{"schemaVersion":"jobsearcher.job.v1","id":"eff4add57fb9e8a46632cab5","url":"https://jobsearcher.com/jobs/eff4add57fb9e8a46632cab5","canonicalUrl":"https://jobsearcher.com/jobs/eff4add57fb9e8a46632cab5","title":"Packaging Engineer","description":"OverviewWe are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.Base pay range: $170,000.00/yr - $200,000.00/yr. This range is provided by Insight Global. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.ResponsibilitiesLead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Own each IC package end-to-end.Work closely with hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.Collaborate with manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.Define and execute test plans for package/system level reliability.Conduct failure analysis to drive continuous improvement.Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.Required skills and experience5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master’s degree.Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.Experience in wafer-level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test).Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.Experience with optical systems (LiDAR, camera, microscope, etc.).Employment detailsPermanent full-time position with competitive and comprehensive benefits (medical, dental, and vision); 401(k); company-paid holidays; paid sick leave and vacation; stock options.Base salary range $130-$200K.Candidate will need to be comfortable working fully onsite in the San Francisco office.Seniority levelMid-Senior level\n #J-18808-Ljbffr","company":"Insight Global","rawCompany":"insight global","city":"Millbrae","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-05-20T10:22:40.186Z","occupations":[{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Engineer","description":"OverviewWe are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.Base pay range: $170,000.00/yr - $200,000.00/yr. This range is provided by Insight Global. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.ResponsibilitiesLead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Own each IC package end-to-end.Work closely with hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.Collaborate with manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.Define and execute test plans for package/system level reliability.Conduct failure analysis to drive continuous improvement.Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.Required skills and experience5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master’s degree.Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.Experience in wafer-level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test).Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.Experience with optical systems (LiDAR, camera, microscope, etc.).Employment detailsPermanent full-time position with competitive and comprehensive benefits (medical, dental, and vision); 401(k); company-paid holidays; paid sick leave and vacation; stock options.Base salary range $130-$200K.Candidate will need to be comfortable working fully onsite in the San Francisco office.Seniority levelMid-Senior level\n #J-18808-Ljbffr","datePosted":"2026-05-20T10:22:40.186Z","dateModified":"2026-05-20T10:22:40.186Z","hiringOrganization":{"@type":"Organization","name":"Insight Global","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Millbrae","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"eff4add57fb9e8a46632cab5"},"url":"https://jobsearcher.com/jobs/eff4add57fb9e8a46632cab5"}}