{"schemaVersion":"jobsearcher.job.v1","id":"e9bf46eb2a58aa6e6bbf6a74","url":"https://jobsearcher.com/jobs/e9bf46eb2a58aa6e6bbf6a74","canonicalUrl":"https://jobsearcher.com/jobs/e9bf46eb2a58aa6e6bbf6a74","title":"IC Package Layout Engineer 2.5D/3D-IC Expert","description":"Annapurna Labs Ltd. in the United States is seeking a Package Layout Design Engineer to advance the physical design of advanced IC packages for data center GPUs and ML accelerators.\nYou will lead die floor planning, RDL routing, and interposer packaging strategies, collaborating with ASIC teams, SI/PI, thermal, and manufacturing to deliver production-ready designs that meet performance, density, and reliability targets.\n\n#J-18808-Ljbffr","company":"Amazon","rawCompany":"amazon","city":"Springfield","state":"IL","isRemote":false,"isActive":false,"createdAt":"2026-10-02T03:43:07.394Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"IC Package Layout Engineer 2.5D/3D-IC Expert","description":"Annapurna Labs Ltd. in the United States is seeking a Package Layout Design Engineer to advance the physical design of advanced IC packages for data center GPUs and ML accelerators.\nYou will lead die floor planning, RDL routing, and interposer packaging strategies, collaborating with ASIC teams, SI/PI, thermal, and manufacturing to deliver production-ready designs that meet performance, density, and reliability targets.\n\n#J-18808-Ljbffr","datePosted":"2026-10-02T03:43:07.394Z","dateModified":"2026-10-02T03:43:07.394Z","hiringOrganization":{"@type":"Organization","name":"Amazon","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Springfield","addressRegion":"IL","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"e9bf46eb2a58aa6e6bbf6a74"},"url":"https://jobsearcher.com/jobs/e9bf46eb2a58aa6e6bbf6a74"}}