{"schemaVersion":"jobsearcher.job.v1","id":"e6d7d5c8d6818edc3cd08c6d","url":"https://jobsearcher.com/jobs/e6d7d5c8d6818edc3cd08c6d","canonicalUrl":"https://jobsearcher.com/jobs/e6d7d5c8d6818edc3cd08c6d","title":"Technical Program Manager","description":"We're looking for technical program managers to own programs across our wafer‑scale photonic systems. Each TPM owns one program and works embedded with the engineering team that carries most of it, from packaging and assembly to silicon and system bring‑up. We have two openings.This is a hands‑on role. You'll own the schedule, the risks and the handoffs between teams, and you'll work in the technical details alongside the engineers. We want someone who gets things done themselves, not someone who only tracks status.Ideal Background:8+ years in semiconductor or hardware development, as an engineer, a program manager or both, with programs taken from development to working hardwareDeep working knowledge of at least one of: advanced packaging and assembly, or ASIC/SoC and system hardwareCommunicates clearly and directly with engineers, partners and leadershipReads specifications closely and spots gaps, conflicts and missing ownersAction‑oriented: builds plans and schedules that engineers actually use, and drives them to doneExperience running work with external partners (foundries, OSATs, IP or design‑services vendors)Nice to Have:Experience with chip‑on‑wafer (CoW) assembly, including mechanical stress and thermal effectsPhotonic, optoelectronic or other heterogeneous‑material assembliesReliability qualification, failure analysis, test vehicles and DOEsAdvanced-node ASIC/SoC tape‑outs and work with third‑party IP or design‑services partnersMulti‑die, chiplet or MCM programs, including chip‑package co‑designSystem hardware (boards, power, thermal, mechanical) through bring‑upOptical I/O or high‑speed SerDes programsData‑center or OCP‑style hardwareExperience with Jira and Confluence#J-18808-Ljbffr","company":"Volantis Semiconductor","rawCompany":"volantis semiconductor","city":"Millbrae","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-11-04T02:55:01.921Z","occupations":[{"code":"13-1082.00","title":"Project Management Specialists","slug":"project-management-specialists"},{"code":"15-1299.09","title":"Information Technology Project Managers","slug":"information-technology-project-managers"},{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"541511","title":"Custom Computer Programming Services","slug":"custom-computer-programming-services"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Technical Program Manager","description":"We're looking for technical program managers to own programs across our wafer‑scale photonic systems. Each TPM owns one program and works embedded with the engineering team that carries most of it, from packaging and assembly to silicon and system bring‑up. We have two openings.This is a hands‑on role. You'll own the schedule, the risks and the handoffs between teams, and you'll work in the technical details alongside the engineers. We want someone who gets things done themselves, not someone who only tracks status.Ideal Background:8+ years in semiconductor or hardware development, as an engineer, a program manager or both, with programs taken from development to working hardwareDeep working knowledge of at least one of: advanced packaging and assembly, or ASIC/SoC and system hardwareCommunicates clearly and directly with engineers, partners and leadershipReads specifications closely and spots gaps, conflicts and missing ownersAction‑oriented: builds plans and schedules that engineers actually use, and drives them to doneExperience running work with external partners (foundries, OSATs, IP or design‑services vendors)Nice to Have:Experience with chip‑on‑wafer (CoW) assembly, including mechanical stress and thermal effectsPhotonic, optoelectronic or other heterogeneous‑material assembliesReliability qualification, failure analysis, test vehicles and DOEsAdvanced-node ASIC/SoC tape‑outs and work with third‑party IP or design‑services partnersMulti‑die, chiplet or MCM programs, including chip‑package co‑designSystem hardware (boards, power, thermal, mechanical) through bring‑upOptical I/O or high‑speed SerDes programsData‑center or OCP‑style hardwareExperience with Jira and Confluence#J-18808-Ljbffr","datePosted":"2026-11-04T02:55:01.921Z","dateModified":"2026-11-04T02:55:01.921Z","hiringOrganization":{"@type":"Organization","name":"Volantis Semiconductor","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Millbrae","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"e6d7d5c8d6818edc3cd08c6d"},"url":"https://jobsearcher.com/jobs/e6d7d5c8d6818edc3cd08c6d"}}