{"schemaVersion":"jobsearcher.job.v1","id":"e5b71e81e9c2bd2287d00e7e","url":"https://jobsearcher.com/jobs/e5b71e81e9c2bd2287d00e7e","canonicalUrl":"https://jobsearcher.com/jobs/e5b71e81e9c2bd2287d00e7e","title":"IC Packaging Design Engineer","description":"Hi,Please find the new opening from INTEL.Here is the below JD for your reference IC Packaging Design EngineerLocation: Chandler, AZ or Hillsboro, OR (ONSITE)Longterm Contract – 1 Year +Skills Required Bachelor’s or Master’s degree in Electrical /Electronics EngineeringExperience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for performance, manufacturability, yield, and reliabilityDesign rule compliance","company":"Element Technologies","rawCompany":"element technologies","city":"Hillsboro","state":"OH","isRemote":false,"isActive":false,"createdAt":"2026-06-17T02:57:15.268Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2071.00","title":"Electrical Engineers","slug":"electrical-engineers"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"IC Packaging Design Engineer","description":"Hi,Please find the new opening from INTEL.Here is the below JD for your reference IC Packaging Design EngineerLocation: Chandler, AZ or Hillsboro, OR (ONSITE)Longterm Contract – 1 Year +Skills Required Bachelor’s or Master’s degree in Electrical /Electronics EngineeringExperience: Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutSI/PI aware design implementationDesign for performance, manufacturability, yield, and reliabilityDesign rule compliance","datePosted":"2026-06-17T02:57:15.268Z","dateModified":"2026-06-17T02:57:15.268Z","hiringOrganization":{"@type":"Organization","name":"Element Technologies","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Hillsboro","addressRegion":"OH","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"e5b71e81e9c2bd2287d00e7e"},"url":"https://jobsearcher.com/jobs/e5b71e81e9c2bd2287d00e7e"}}