{"schemaVersion":"jobsearcher.job.v1","id":"df566de9f8e7b4d6a291f035","url":"https://jobsearcher.com/jobs/df566de9f8e7b4d6a291f035","canonicalUrl":"https://jobsearcher.com/jobs/df566de9f8e7b4d6a291f035","title":"Semiconductor Process Engineer Sr Stf - E5","description":"Overview\nAs a Staff FPA Process Engineer, you lead the fabrication and optimization of advanced focal plane arrays (FPAs) in a fast-paced, high-mix production setting. You work closely with development and process integration to translate new techniques into manufacturing, defining equipment needs and ensuring quality and yield. Your impact spans process definition, equipment procurement, and continuous improvement to advance FPA technology. This role offers hands-on leadership in cutting-edge infrared sensor manufacturing with significant cross-functional collaboration and problem solving. You will help shape scalable processes that enable high-performance detectors.\n\nCompensation / Benefitsmedical, dental, visionflexible work arrangements401(k) matchpaid time off and holidaysparential leaveeducation assistance\nResponsibilitiesDefine processing and handling equipment requirements and specifications for FPA manufacturingCollaborate with development and process integration to adapt new processes on the production lineLead projects for FPA processing equipment capital procurementAnalyze test data to drive process control and improvement initiativesTroubleshoot failure modes and implement corrective actions for FPAsDevelop and maintain workflows, work instructions, and process control checklists\nKey requirementsBachelor in Engineering (or Physics) or related disciplineExperience in semiconductor packaging or FPA manufacturing in a cleanroomExpertise in flip-chip hybridization or related processes (epoxy die attach/bonding, polishing, substrate removal, AR coating)excellent written and verbal communicationcross-functional collaborationability to lead multifunctional teamsIR FPA packaging and flip-chip hybridizationprocess development and optimizationstatistical methods and data analysis (DOE, SPC, JMP)","company":"Lockheed Martin","rawCompany":"lockheed martin","city":"Santa Barbara","state":"CA","isRemote":false,"isActive":true,"createdAt":"2026-09-15T04:28:58.963Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Semiconductor Process Engineer Sr Stf - E5","description":"Overview\nAs a Staff FPA Process Engineer, you lead the fabrication and optimization of advanced focal plane arrays (FPAs) in a fast-paced, high-mix production setting. You work closely with development and process integration to translate new techniques into manufacturing, defining equipment needs and ensuring quality and yield. Your impact spans process definition, equipment procurement, and continuous improvement to advance FPA technology. This role offers hands-on leadership in cutting-edge infrared sensor manufacturing with significant cross-functional collaboration and problem solving. You will help shape scalable processes that enable high-performance detectors.\n\nCompensation / Benefitsmedical, dental, visionflexible work arrangements401(k) matchpaid time off and holidaysparential leaveeducation assistance\nResponsibilitiesDefine processing and handling equipment requirements and specifications for FPA manufacturingCollaborate with development and process integration to adapt new processes on the production lineLead projects for FPA processing equipment capital procurementAnalyze test data to drive process control and improvement initiativesTroubleshoot failure modes and implement corrective actions for FPAsDevelop and maintain workflows, work instructions, and process control checklists\nKey requirementsBachelor in Engineering (or Physics) or related disciplineExperience in semiconductor packaging or FPA manufacturing in a cleanroomExpertise in flip-chip hybridization or related processes (epoxy die attach/bonding, polishing, substrate removal, AR coating)excellent written and verbal communicationcross-functional collaborationability to lead multifunctional teamsIR FPA packaging and flip-chip hybridizationprocess development and optimizationstatistical methods and data analysis (DOE, SPC, JMP)","datePosted":"2026-09-15T04:28:58.963Z","dateModified":"2026-09-15T04:28:58.963Z","hiringOrganization":{"@type":"Organization","name":"Lockheed Martin","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Santa Barbara","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"df566de9f8e7b4d6a291f035"},"url":"https://jobsearcher.com/jobs/df566de9f8e7b4d6a291f035"}}