{"schemaVersion":"jobsearcher.job.v1","id":"d6fda1c1935914c09cc2eca7","url":"https://jobsearcher.com/jobs/d6fda1c1935914c09cc2eca7","canonicalUrl":"https://jobsearcher.com/jobs/d6fda1c1935914c09cc2eca7","title":"R&D Engineering, Architect","description":"Architect R&D Engineer, Advanced Packaging\n\nWe Are\n\nSynopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.\n\nYou Are\n\nYou have built a career at the intersection of package substrate design and EDA tool development, and you understand that advancing the field requires more than incremental feature improvements. It requires rethinking the underlying technical approach. You are the engineer who can engage in substantive technical discussions with foundry partners and assembly and test companies about DRC constraints, PDN topology, and Design Rule Manual implementation, translating those conversations into actionable R&D direction.\n\nYour experience spans both the theoretical and the practical. You have developed EDA tools that handle production-scale designs, and you understand computational geometry well enough to anticipate when an algorithm will scale and when it will encounter limitations. You have worked through the details of ODB++ output formats and manufacturing handoff requirements because you know that tools must integrate seamlessly into real-world flows.\n\nAt this stage in your career, you contribute to technical strategy while maintaining deep hands-on involvement in implementation. You guide less experienced engineers through complex technical decisions, helping them develop the judgment that comes from years of solving hard problems. At Synopsys, you will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions will influence how the industry approaches these design challenges.\n\nWhat You'll Be Doing\n\nLead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilities\nDrive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite\nDevelop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation\nCollaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling\nWork with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designs\nProvide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffs\nEngage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product direction\n\nThe Impact You Will Have\n\nEstablish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industry\nEnable customers to design substrates for advanced packaging technologies that current tooling cannot adequately support\nReduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environments\nInfluence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiatives\nAccelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues early\nShape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologies\nStrengthen the technical capabilities of the R&D organization through mentorship and knowledge transfer\n\nWhat You'll Need\n\nBachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design\n10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design\nDeep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis\nStrong programming proficiency in Python or TCL for tool integration and automation\nDemonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements\nExperience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++\nSolid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valued\n\nWho You Are\n\nYou can engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approaches\nYou raise concerns when technical requirements conflict with sound architectural principles, and you can articulate alternative approaches that address the underlying need\nYou write well-structured code with attention to maintainability, documentation, and long-term supportability\nYou are effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalized\nYou understand how to guide less experienced engineers through technical challenges in a way that builds their capabilities and judgment\nYou approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processes\n\nThe Team You'll Be Part Of\n\nYour recruiter will share more about the team structure and mission during the interview process.\n\nRewards and Benefits\n\nWe offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.\n\n#LI-MK1","company":"Synopsys","rawCompany":"synopsys","city":"Austin","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-08-19T16:51:50.891Z","occupations":[{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541512","title":"Computer Systems Design Services","slug":"computer-systems-design-services"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"R&D Engineering, Architect","description":"Architect R&D Engineer, Advanced Packaging\n\nWe Are\n\nSynopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.\n\nYou Are\n\nYou have built a career at the intersection of package substrate design and EDA tool development, and you understand that advancing the field requires more than incremental feature improvements. It requires rethinking the underlying technical approach. You are the engineer who can engage in substantive technical discussions with foundry partners and assembly and test companies about DRC constraints, PDN topology, and Design Rule Manual implementation, translating those conversations into actionable R&D direction.\n\nYour experience spans both the theoretical and the practical. You have developed EDA tools that handle production-scale designs, and you understand computational geometry well enough to anticipate when an algorithm will scale and when it will encounter limitations. You have worked through the details of ODB++ output formats and manufacturing handoff requirements because you know that tools must integrate seamlessly into real-world flows.\n\nAt this stage in your career, you contribute to technical strategy while maintaining deep hands-on involvement in implementation. You guide less experienced engineers through complex technical decisions, helping them develop the judgment that comes from years of solving hard problems. At Synopsys, you will work on package substrate technology that enables the next generation of semiconductor products, and your technical contributions will influence how the industry approaches these design challenges.\n\nWhat You'll Be Doing\n\nLead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilities\nDrive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite\nDevelop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation\nCollaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling\nWork with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designs\nProvide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffs\nEngage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product direction\n\nThe Impact You Will Have\n\nEstablish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industry\nEnable customers to design substrates for advanced packaging technologies that current tooling cannot adequately support\nReduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environments\nInfluence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiatives\nAccelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues early\nShape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologies\nStrengthen the technical capabilities of the R&D organization through mentorship and knowledge transfer\n\nWhat You'll Need\n\nBachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design\n10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design\nDeep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis\nStrong programming proficiency in Python or TCL for tool integration and automation\nDemonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements\nExperience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++\nSolid foundation in computational geometry and algorithm design for layout automation, experience with constraint-based routing or placement is highly valued\n\nWho You Are\n\nYou can engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approaches\nYou raise concerns when technical requirements conflict with sound architectural principles, and you can articulate alternative approaches that address the underlying need\nYou write well-structured code with attention to maintainability, documentation, and long-term supportability\nYou are effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalized\nYou understand how to guide less experienced engineers through technical challenges in a way that builds their capabilities and judgment\nYou approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processes\n\nThe Team You'll Be Part Of\n\nYour recruiter will share more about the team structure and mission during the interview process.\n\nRewards and Benefits\n\nWe offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.\n\n#LI-MK1","datePosted":"2026-08-19T16:51:50.891Z","dateModified":"2026-08-19T16:51:50.891Z","hiringOrganization":{"@type":"Organization","name":"Synopsys","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Austin","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"d6fda1c1935914c09cc2eca7"},"url":"https://jobsearcher.com/jobs/d6fda1c1935914c09cc2eca7"}}