{"schemaVersion":"jobsearcher.job.v1","id":"d398fc51b60d5d164beb7cfb","url":"https://jobsearcher.com/jobs/d398fc51b60d5d164beb7cfb","canonicalUrl":"https://jobsearcher.com/jobs/d398fc51b60d5d164beb7cfb","title":"Packaging Reliability Engineer - AI HPC, Equity","description":"OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.\nIdeal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.\n\n#J-18808-Ljbffr","company":"OpenAI","rawCompany":"openai","city":"Millbrae","state":"CA","isRemote":false,"isActive":true,"createdAt":"2026-06-22T03:15:37.159Z","occupations":[{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"},{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"},{"code":"15-2051.00","title":"Data Scientists","slug":"data-scientists"}],"industries":[{"code":"513210","title":"Software Publishers","slug":"software-publishers"},{"code":"518210","title":"Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services","slug":"computing-infrastructure-providers-data-processing-web-hosting-and-related-services"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Reliability Engineer - AI HPC, Equity","description":"OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.\nIdeal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.\n\n#J-18808-Ljbffr","datePosted":"2026-06-22T03:15:37.159Z","dateModified":"2026-06-22T03:15:37.159Z","hiringOrganization":{"@type":"Organization","name":"OpenAI","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Millbrae","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"d398fc51b60d5d164beb7cfb"},"url":"https://jobsearcher.com/jobs/d398fc51b60d5d164beb7cfb"}}