{"schemaVersion":"jobsearcher.job.v1","id":"d3738ee0a7f13f69aa76a45f","url":"https://jobsearcher.com/jobs/d3738ee0a7f13f69aa76a45f","canonicalUrl":"https://jobsearcher.com/jobs/d3738ee0a7f13f69aa76a45f","title":"Module Process Engineer V","description":"Who We Are\nApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.\nWhat We Offer\nSalary:\n$140,000.00 - $192,500.00\nLocation:\nAlbany,NY\nYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.\nAt Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .\nKey Responsibilities\nDevelop advanced packaging modules using Applied Materials’ equipment portfolio and advise the Packaging Business Unit on equipment requirements.\nDrive new materials and process development for logic, DRAM, and NAND through structured problem solving and experimentation.\nProvide domain expertise in W2W and D2W bonding, micro-bumps, TSVs, thermal and stress management, optics, and multi-wafer stacking, with deep knowledge of materials, processes, device physics, and integration.\nDesign and tape out test vehicles for internal development and customer programs.\nDefine engineering plans and DOEs, lead characterization, and prepare technical reports.\nImprove packaging interconnect performance by reducing RC delay and increasing wiring density across polymer and thin-film dielectrics.\nSolve complex technical challenges through innovative and novel approaches.\nIdentify patentable innovations and support intellectual property filings.\nServe as the IMS module expert to internal business units and external customers, leading cross-functional initiatives across Applied Materials.\nDevelop packaging roadmaps, lead application committees, and guide product portfolio strategy in alignment with industry trends.\nQualifications\nBachelor’s or master’s degree in electrical, mechanical, or materials engineering, or a related field; PhD preferred.\n10+ years of semiconductor packaging development and manufacturing experience.\nStrong communication and collaboration skills across business units, manufacturing organizations, and customers.\nProven ability to lead global, cross-functional projects in a fast-paced environment.\nSelf-motivated team player who works effectively with minimal supervision.\nLeadership Competencies\nApplies industry and commercial expertise to improve business performance.\nLeads through influence, executes business plans, and contributes to strategy.\nResolves complex challenges through advanced analysis and sound judgment.\nInfluences business results and enables cross-functional teams.\nCommunicates and negotiates effectively with executives and external partners.\nRequires full compliance with Applied Materials’ Standards of Business Conduct, ethical standards, and core values.\n\nAdditional Information\nTime Type:\nFull time\nEmployee Type:\nAssignee / Regular\nTravel:\nYes, 10% of the Time\nRelocation Eligible:\nYes\nThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\nApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.\nIn addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.","company":"Applied Materials","rawCompany":"applied materials","city":"Albany","state":"NY","isRemote":false,"isActive":false,"createdAt":"2026-08-09T11:12:00.112Z","occupations":[{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Module Process Engineer V","description":"Who We Are\nApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.\nWhat We Offer\nSalary:\n$140,000.00 - $192,500.00\nLocation:\nAlbany,NY\nYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.\nAt Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .\nKey Responsibilities\nDevelop advanced packaging modules using Applied Materials’ equipment portfolio and advise the Packaging Business Unit on equipment requirements.\nDrive new materials and process development for logic, DRAM, and NAND through structured problem solving and experimentation.\nProvide domain expertise in W2W and D2W bonding, micro-bumps, TSVs, thermal and stress management, optics, and multi-wafer stacking, with deep knowledge of materials, processes, device physics, and integration.\nDesign and tape out test vehicles for internal development and customer programs.\nDefine engineering plans and DOEs, lead characterization, and prepare technical reports.\nImprove packaging interconnect performance by reducing RC delay and increasing wiring density across polymer and thin-film dielectrics.\nSolve complex technical challenges through innovative and novel approaches.\nIdentify patentable innovations and support intellectual property filings.\nServe as the IMS module expert to internal business units and external customers, leading cross-functional initiatives across Applied Materials.\nDevelop packaging roadmaps, lead application committees, and guide product portfolio strategy in alignment with industry trends.\nQualifications\nBachelor’s or master’s degree in electrical, mechanical, or materials engineering, or a related field; PhD preferred.\n10+ years of semiconductor packaging development and manufacturing experience.\nStrong communication and collaboration skills across business units, manufacturing organizations, and customers.\nProven ability to lead global, cross-functional projects in a fast-paced environment.\nSelf-motivated team player who works effectively with minimal supervision.\nLeadership Competencies\nApplies industry and commercial expertise to improve business performance.\nLeads through influence, executes business plans, and contributes to strategy.\nResolves complex challenges through advanced analysis and sound judgment.\nInfluences business results and enables cross-functional teams.\nCommunicates and negotiates effectively with executives and external partners.\nRequires full compliance with Applied Materials’ Standards of Business Conduct, ethical standards, and core values.\n\nAdditional Information\nTime Type:\nFull time\nEmployee Type:\nAssignee / Regular\nTravel:\nYes, 10% of the Time\nRelocation Eligible:\nYes\nThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\nApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.\nIn addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.","datePosted":"2026-08-09T11:12:00.112Z","dateModified":"2026-08-09T11:12:00.112Z","hiringOrganization":{"@type":"Organization","name":"Applied Materials","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Albany","addressRegion":"NY","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"d3738ee0a7f13f69aa76a45f"},"url":"https://jobsearcher.com/jobs/d3738ee0a7f13f69aa76a45f"}}