{"schemaVersion":"jobsearcher.job.v1","id":"ca236defca0f657a1e0c10f4","url":"https://jobsearcher.com/jobs/ca236defca0f657a1e0c10f4","canonicalUrl":"https://jobsearcher.com/jobs/ca236defca0f657a1e0c10f4","title":"Design Integration Engineer","description":"TITLE: DESIGN INTEGRATION ENGINEER\nFLSA STATUS: EXEMPT\nREPORTS TO: DIRECTOR, DESIGN INTEGRATION\nSUMMARY:\nUnder the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.\nESSENTIAL FUNCTIONS:\nDesigns and delivers masks and layouts for thin film recording heads\nTracks wafer schedules, mask manufacturing progress in the fab, and vendor interactions to ensure just-in-time delivery of masks, tools, or wafers\nUpdates, creates, and maintains CAD libraries for layouts as needed\nIntegrates new recording head designs into the existing design libraries based upon job or customer specifications\nMaintains, updates, and documents all design reference materials; ensures readiness of manufacturing materials as needed\nReviews and analyzes data, creates reports, and presents findings to groups, teams, or departments as required\nUses knowledge of TMR, PMR, MAMR, or HAMR design integration issues, layouts, and wafer processing to ensure masks are designed efficiently and cost effectively\nInteracts with and responds to inquiries from other product groups regarding manufacturing-related issues and product or device modifications or requirements\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nBachelors degree in Electrical or Mechanical Engineering and/or equivalent relevant experience\nOne to three years of hands on experience working in the thin film recording head or semiconductor industry in a mask design role preferred\nExperience using CAD software such as DW-2000 or AutoCAD preferred\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nKnowledge of thin film recording head manufacturing or semiconductor processes, practices, and techniques\nKnowledge and ability to use CAD or similar software to create complex masks and layouts for use in thin film recording heads\nKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations\nAbility to manage and track wafer schedules, projects, and design changes efficiently to ensure just-in-time delivery of materials or wafers\nAbility to create various reports, presentations, and written sample analysis\nAbility to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, vendors, and management\nAbility to work productively and collaboratively with all levels of employees and management\nAbility to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Design Integration Engineer works primarily in an indoor environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 or more pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","company":"Headway Technologies","rawCompany":"headway technologies","city":"Milpitas","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-04-12T20:24:31.321Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Design Integration Engineer","description":"TITLE: DESIGN INTEGRATION ENGINEER\nFLSA STATUS: EXEMPT\nREPORTS TO: DIRECTOR, DESIGN INTEGRATION\nSUMMARY:\nUnder the direction of the Director of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.\nESSENTIAL FUNCTIONS:\nDesigns and delivers masks and layouts for thin film recording heads\nTracks wafer schedules, mask manufacturing progress in the fab, and vendor interactions to ensure just-in-time delivery of masks, tools, or wafers\nUpdates, creates, and maintains CAD libraries for layouts as needed\nIntegrates new recording head designs into the existing design libraries based upon job or customer specifications\nMaintains, updates, and documents all design reference materials; ensures readiness of manufacturing materials as needed\nReviews and analyzes data, creates reports, and presents findings to groups, teams, or departments as required\nUses knowledge of TMR, PMR, MAMR, or HAMR design integration issues, layouts, and wafer processing to ensure masks are designed efficiently and cost effectively\nInteracts with and responds to inquiries from other product groups regarding manufacturing-related issues and product or device modifications or requirements\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nBachelors degree in Electrical or Mechanical Engineering and/or equivalent relevant experience\nOne to three years of hands on experience working in the thin film recording head or semiconductor industry in a mask design role preferred\nExperience using CAD software such as DW-2000 or AutoCAD preferred\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nKnowledge of thin film recording head manufacturing or semiconductor processes, practices, and techniques\nKnowledge and ability to use CAD or similar software to create complex masks and layouts for use in thin film recording heads\nKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations\nAbility to manage and track wafer schedules, projects, and design changes efficiently to ensure just-in-time delivery of materials or wafers\nAbility to create various reports, presentations, and written sample analysis\nAbility to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, vendors, and management\nAbility to work productively and collaboratively with all levels of employees and management\nAbility to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Design Integration Engineer works primarily in an indoor environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 or more pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","datePosted":"2026-04-12T20:24:31.321Z","dateModified":"2026-04-12T20:24:31.321Z","hiringOrganization":{"@type":"Organization","name":"Headway Technologies","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Milpitas","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"ca236defca0f657a1e0c10f4"},"url":"https://jobsearcher.com/jobs/ca236defca0f657a1e0c10f4"}}