{"schemaVersion":"jobsearcher.job.v1","id":"c3dd115bc6bfa088b32bc526","url":"https://jobsearcher.com/jobs/c3dd115bc6bfa088b32bc526","canonicalUrl":"https://jobsearcher.com/jobs/c3dd115bc6bfa088b32bc526","title":"WATD Module Development Engineer","description":"Job Details:\nJob Description:\nJoin the Wafer Assembly Technology Development Group (WATD)\n\nAs a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.\n\nKey Responsibilities\n\nDrive technology development and enablement for both high-volume manufacturing and future technologies.\nLead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.\nPerform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.\nDevelop and implement technology roadmaps to guide future manufacturing needs and industry standards.\nCollaborate with equipment and material suppliers to design and implement enabling process technologies.\nRecommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.\nEmploy statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.\nOptimize production efficiency, manufacturing techniques, and output for existing and new products.\nPartner with cross-functional teams to ensure process integration and alignment with project deliverables.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.\nMinimum Qualifications\n\nBachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.\nOR Master's degree in the same fields with 4+ years of experience.\nOR PhD in the same fields with 2+ years of experience.\nExperience listed above should be a combination of the following:\n\nDevelopment methodologies, statistical process control, and/or data analytics.\nWafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.\nThis position is not eligible for Intel Immigration Sponsorship\n\nPreferred Qualifications\n\nExperience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.\nDemonstrated expertise in leading programs from early strategy formation through high-volume production.\nRecognized technical leadership with a proven track record of solving complex engineering challenges.\nExperience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.\nStrong collaboration skills with internal and external teams, including yield, operations, and supplier management.\n\nJoin Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.\n\nJob Type:\nExperienced Hire\nShift:\nShift 1 (United States of America)\nPrimary Location:\nUS, Oregon, Hillsboro\nAdditional Locations:\nBusiness group:\nIntel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","company":"Intel","rawCompany":"intel","city":"Hillsboro","state":"IL","isRemote":false,"isActive":true,"createdAt":"2026-07-15T08:30:38.720Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"WATD Module Development Engineer","description":"Job Details:\nJob Description:\nJoin the Wafer Assembly Technology Development Group (WATD)\n\nAs a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.\n\nKey Responsibilities\n\nDrive technology development and enablement for both high-volume manufacturing and future technologies.\nLead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.\nPerform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.\nDevelop and implement technology roadmaps to guide future manufacturing needs and industry standards.\nCollaborate with equipment and material suppliers to design and implement enabling process technologies.\nRecommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.\nEmploy statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.\nOptimize production efficiency, manufacturing techniques, and output for existing and new products.\nPartner with cross-functional teams to ensure process integration and alignment with project deliverables.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.\nMinimum Qualifications\n\nBachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.\nOR Master's degree in the same fields with 4+ years of experience.\nOR PhD in the same fields with 2+ years of experience.\nExperience listed above should be a combination of the following:\n\nDevelopment methodologies, statistical process control, and/or data analytics.\nWafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.\nThis position is not eligible for Intel Immigration Sponsorship\n\nPreferred Qualifications\n\nExperience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.\nDemonstrated expertise in leading programs from early strategy formation through high-volume production.\nRecognized technical leadership with a proven track record of solving complex engineering challenges.\nExperience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.\nStrong collaboration skills with internal and external teams, including yield, operations, and supplier management.\n\nJoin Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.\n\nJob Type:\nExperienced Hire\nShift:\nShift 1 (United States of America)\nPrimary Location:\nUS, Oregon, Hillsboro\nAdditional Locations:\nBusiness group:\nIntel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","datePosted":"2026-07-15T08:30:38.720Z","dateModified":"2026-07-15T08:30:38.720Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Hillsboro","addressRegion":"IL","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"c3dd115bc6bfa088b32bc526"},"url":"https://jobsearcher.com/jobs/c3dd115bc6bfa088b32bc526"}}