{"schemaVersion":"jobsearcher.job.v1","id":"c1c7de3e12068aa0cdc0cfa2","url":"https://jobsearcher.com/jobs/c1c7de3e12068aa0cdc0cfa2","canonicalUrl":"https://jobsearcher.com/jobs/c1c7de3e12068aa0cdc0cfa2","title":"Hardware Engineer - Process Engineer SIP Assembly","description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job.\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nDescription:\nJoin this team focusing on RF modules for the cellular and wireless data markets. You will be part of the Packaging Product Support team within the Wireless Semiconductor Division (WSD) of Broadcom.\nYou will be working primarily in the prototype assembly lab to participate in all SIP module build operations, develop, improve and troubleshoot SIP assembly processes, support machine PM execution, arrange facility works, and update daily build status.\nResponsibilities:\nBecome a process owner of many specific SIP assembly processes, primary wirebond and Datacon die attach.\nBackup the operation activities of other SIP assembly processes and oversee entire SIP assembly process flow\nWork in the prototype lab to participate in all SIP module build including hands-on machine programing and operations. After hours and weekend support are required occasionally\nWork with each process owners to develop, improve, and troubleshoot SIP assembly processes\nInitiate new equipment and process evaluation and buyoff plan\nCollaborate with R&D, QRE/NPI/FA teams on yield and quality issues. Investigate the root causes, trigger corrective actions and improvement plan and verify the effectiveness in the lab\nInitiate, lead and manage continuous process / yield improvement projects with process owners\nWork with each process owners to arrange and execute machine PM and keep spare parts of each machine to prevent machine downtime\nArrange facility work, communicate with facility manager and team to resolve CDA, DI water, power issues to keep the lab in good operation condition\nManage the floor plan, facility requirement, moving logistic for the new machine installation\nJoin the weekly build plan meeting. Update daily build status. Response to all build status inquiries\nPerform design review and conduct Design for Manufacturability (DFM) and design rule optimization\nWork with packaging engineers on packaging and product development\nCreate package drawings, specifications, reports, and production documentation using Cadence and AutoCAD\nRequirements:\nBachelor’s degree in Mechanical / Materials / Chemical and related engineering field\n0 to 2 years of experiences in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation, shielding...etc.)\nHands on experiences wirebond, Datacon die attach, and other SIP assembly processes including machine programing and operations\nSolid technical understanding of full range of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms and analytical techniques\nUnderstanding of statistics, control methodology, DOE, troubleshooting and problem solving techniques\nGood knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)\nGood project leading, communication and presentation skills\nA great team member\nExperience on AutoCAD is a plus\nAfter hours and weekend support are required occasionally\nWillingness to travel for training and machine buy-off\nAdditional Job Description:\nCompensation and Benefits\nThe annual base salary range for this position is $66,000 - $105,000.\nThis position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.\nBroadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.\nIf you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.","company":"Broadcom","rawCompany":"broadcom","city":"San Jose","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-04-12T20:57:18.819Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334220","title":"Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing","slug":"radio-and-television-broadcasting-and-wireless-communications-equipment-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Hardware Engineer - Process Engineer SIP Assembly","description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job.\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nDescription:\nJoin this team focusing on RF modules for the cellular and wireless data markets. You will be part of the Packaging Product Support team within the Wireless Semiconductor Division (WSD) of Broadcom.\nYou will be working primarily in the prototype assembly lab to participate in all SIP module build operations, develop, improve and troubleshoot SIP assembly processes, support machine PM execution, arrange facility works, and update daily build status.\nResponsibilities:\nBecome a process owner of many specific SIP assembly processes, primary wirebond and Datacon die attach.\nBackup the operation activities of other SIP assembly processes and oversee entire SIP assembly process flow\nWork in the prototype lab to participate in all SIP module build including hands-on machine programing and operations. After hours and weekend support are required occasionally\nWork with each process owners to develop, improve, and troubleshoot SIP assembly processes\nInitiate new equipment and process evaluation and buyoff plan\nCollaborate with R&D, QRE/NPI/FA teams on yield and quality issues. Investigate the root causes, trigger corrective actions and improvement plan and verify the effectiveness in the lab\nInitiate, lead and manage continuous process / yield improvement projects with process owners\nWork with each process owners to arrange and execute machine PM and keep spare parts of each machine to prevent machine downtime\nArrange facility work, communicate with facility manager and team to resolve CDA, DI water, power issues to keep the lab in good operation condition\nManage the floor plan, facility requirement, moving logistic for the new machine installation\nJoin the weekly build plan meeting. Update daily build status. Response to all build status inquiries\nPerform design review and conduct Design for Manufacturability (DFM) and design rule optimization\nWork with packaging engineers on packaging and product development\nCreate package drawings, specifications, reports, and production documentation using Cadence and AutoCAD\nRequirements:\nBachelor’s degree in Mechanical / Materials / Chemical and related engineering field\n0 to 2 years of experiences in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation, shielding...etc.)\nHands on experiences wirebond, Datacon die attach, and other SIP assembly processes including machine programing and operations\nSolid technical understanding of full range of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms and analytical techniques\nUnderstanding of statistics, control methodology, DOE, troubleshooting and problem solving techniques\nGood knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)\nGood project leading, communication and presentation skills\nA great team member\nExperience on AutoCAD is a plus\nAfter hours and weekend support are required occasionally\nWillingness to travel for training and machine buy-off\nAdditional Job Description:\nCompensation and Benefits\nThe annual base salary range for this position is $66,000 - $105,000.\nThis position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.\nBroadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.\nIf you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.","datePosted":"2026-04-12T20:57:18.819Z","dateModified":"2026-04-12T20:57:18.819Z","hiringOrganization":{"@type":"Organization","name":"Broadcom","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"San Jose","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"c1c7de3e12068aa0cdc0cfa2"},"url":"https://jobsearcher.com/jobs/c1c7de3e12068aa0cdc0cfa2"}}