{"schemaVersion":"jobsearcher.job.v1","id":"b7b6e8da97a2ba4e4daff4a3","url":"https://jobsearcher.com/jobs/b7b6e8da97a2ba4e4daff4a3","canonicalUrl":"https://jobsearcher.com/jobs/b7b6e8da97a2ba4e4daff4a3","title":"Senior RF Packaging Engineer - Microelectronics (Hybrid)","description":"A leading communications technology firm is seeking a Senior Packaging Engineer (Microelectronics) in Tempe, AZ. You will play a key role in developing next-generation packaging solutions for RF communications products. Responsibilities include defining package structures, leading technical engagements with vendors, and driving the full development lifecycle. Ideal candidates should have a Bachelors degree in Electrical Engineering and eight years of experience in semiconductor packaging. Comprehensive benefits and a hybrid work model are offered.\n\nJ-18808-Ljbffr","company":"Kforce","rawCompany":"kforce","city":"Tempe","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-04-18T03:04:44.264Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"15-1241.01","title":"Telecommunications Engineering Specialists","slug":"telecommunications-engineering-specialists"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334220","title":"Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing","slug":"radio-and-television-broadcasting-and-wireless-communications-equipment-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior RF Packaging Engineer - Microelectronics (Hybrid)","description":"A leading communications technology firm is seeking a Senior Packaging Engineer (Microelectronics) in Tempe, AZ. You will play a key role in developing next-generation packaging solutions for RF communications products. Responsibilities include defining package structures, leading technical engagements with vendors, and driving the full development lifecycle. Ideal candidates should have a Bachelors degree in Electrical Engineering and eight years of experience in semiconductor packaging. Comprehensive benefits and a hybrid work model are offered.\n\nJ-18808-Ljbffr","datePosted":"2026-04-18T03:04:44.264Z","dateModified":"2026-04-18T03:04:44.264Z","hiringOrganization":{"@type":"Organization","name":"Kforce","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Tempe","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b7b6e8da97a2ba4e4daff4a3"},"url":"https://jobsearcher.com/jobs/b7b6e8da97a2ba4e4daff4a3"}}