{"schemaVersion":"jobsearcher.job.v1","id":"b68b127a0e96cd1e07f078a7","url":"https://jobsearcher.com/jobs/b68b127a0e96cd1e07f078a7","canonicalUrl":"https://jobsearcher.com/jobs/b68b127a0e96cd1e07f078a7","title":"Hardware Engineering Architect, Server","description":"Job Summary\nWe are seeking an experienced Hardware Engineering Architect for Server/AI Products to lead architecture concept work during the early design phase. This role focuses on translating customer use cases and technical trends into viable, scalable server architectures to support RFQ/RFI and new business engagements. You will collaborate closely with stakeholders (e.g., CTO, BU, Marketing) to define system-level strategy, high-level configurations, and functional requirements for next‑generation server/AI platforms. This role can be Hybrid/ for Austin TX candidates.\n\nKey Responsibilities\n\nLead system-level architecture planning for Server/AI platforms, including product configuration definition, functional partitioning, and mechanical/thermal/power/cooling feasibility alignment.\n\nDrive the definition of system requirements, interface specifications, and early configuration options (e.g., GPU, accelerator, storage, and compute servers).\n\nConduct architectural trade‑off analysis balancing performance, cost, power, scalability, and manufacturability.\n\nCollaborate with EE, thermal, mechanical, BMC, and firmware architects to form a complete product‑level concept package.\n\nWork with Architecture and BU teams to evaluate RFQ/RFI requirements and generate competitive architecture proposals.\n\nDefine and propose system topologies, mechanical footprints, airflow design, I/O mappings, and cabling options.\n\nInterface with customers and internal stakeholders to align design intent and value proposition during the concept phase.\n\nPresent and document concept proposals that include block diagrams, design strategy, trade‑off summary, and risk evaluation.\n\nStay up to date with Open Compute (OCP), Computer Express Link (CXL) or Open BMC.\n\nEvaluate and integrate technology enablers such as PCIe Gen5/6, 112G PAM4 SerDes, high‑efficiency power stages, and new materials.\n\nParticipate in roadmap planning with BU/CTO to ensure platform reusability and alignment with future‑generation technologies.\n\nDefine how electrical, mechanical, thermal, and firmware domains interact to support functional and performance goals.\n\nCoordinate platform‑level integration strategies including MB placement, airflow optimization, and system serviceability.\n\nAlign system‑level DFM/EMC/thermal reliability requirements in early phase and guide downstream teams with clear targets.\n\nLead the creation of architecture decks, system requirements, platform‑level block diagrams, and BoM‑level feasibility plans.\n\nDrive internal and customer‑facing design reviews for architecture alignment and requirement sign‑off.\n\nMaintain issue‑tracking and lessons‑learned documentation to improve future concept efficiency.\n\nTechnical Skills\n\nAbility to research and explore unfamiliar technologies and concepts with an eye towards feasibility.\n\nFamiliarity with the Intel, AMD, Nvidia or ARM CPU/GPU architectures. Specifically, an understanding of how to optimize performance, IO, thermals, real‑estate and/or power. Direct experience with at least some of the above is preferred.\n\nFamiliarity with PCB board materials and construction techniques. Specifically, an understanding of trade‑offs and optimizations around insertion loss, via construction, stack‑ups and sizing of power planes and shapes.\n\nHigh‑level understanding of voltage regulators related to types of VR architectures, trade‑offs, efficiency, thermals, and critical VR components.\n\nAbility to use industry standard ECAD tools to review layouts and schematics is required.\n\nAbility to manipulate existing ECAD layouts and schematic databases for purposes of architectural planning and assessment preferred.\n\nExperience coding, sizing, and planning FPGAs, preferred.\n\nFluency in the mechanical, firmware and software domain. Specifically, an understanding of basics nomenclature, concepts and tools used by your architectural teammates.\n\nFluency in the thermal domain. Specifically, an understanding of component cooling techniques, when components require cooling and what information your thermal engineering teammate needs during concept assessment.\n\nDesired Traits & Skills\n\nStrategic thinker with system-level ownership mindset\n\nFamiliarity with system-level architecture\n\nStrong leadership and cross‑functional coordination skills\n\nComfortable working in fast‑paced, cross‑functional, global teams\n\nProactive, self‑driven, with high adaptability\n\nClear technical communicator, able to present trade‑offs and justify proposals\n\nCapable of NRE estimation and abstract requirement hardening\n\nFluent in English; able to work with global teams and customers\n\nEducation & Experience Requirements\n\nBachelor’s degree in Electrical, Computer Engineering, or a related field (Master’s preferred)\n\n15+ years of experience in data center system/server architecture\n\nDemonstrated experience leading concept‑phase architecture for AI/server products\n\n#J-18808-Ljbffr","company":"Plasticos Castella","rawCompany":"plasticos castella","city":"Austin","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-06-17T03:31:29.077Z","occupations":[{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"541512","title":"Computer Systems Design Services","slug":"computer-systems-design-services"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"541310","title":"Architectural Services","slug":"architectural-services"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Hardware Engineering Architect, Server","description":"Job Summary\nWe are seeking an experienced Hardware Engineering Architect for Server/AI Products to lead architecture concept work during the early design phase. This role focuses on translating customer use cases and technical trends into viable, scalable server architectures to support RFQ/RFI and new business engagements. You will collaborate closely with stakeholders (e.g., CTO, BU, Marketing) to define system-level strategy, high-level configurations, and functional requirements for next‑generation server/AI platforms. This role can be Hybrid/ for Austin TX candidates.\n\nKey Responsibilities\n\nLead system-level architecture planning for Server/AI platforms, including product configuration definition, functional partitioning, and mechanical/thermal/power/cooling feasibility alignment.\n\nDrive the definition of system requirements, interface specifications, and early configuration options (e.g., GPU, accelerator, storage, and compute servers).\n\nConduct architectural trade‑off analysis balancing performance, cost, power, scalability, and manufacturability.\n\nCollaborate with EE, thermal, mechanical, BMC, and firmware architects to form a complete product‑level concept package.\n\nWork with Architecture and BU teams to evaluate RFQ/RFI requirements and generate competitive architecture proposals.\n\nDefine and propose system topologies, mechanical footprints, airflow design, I/O mappings, and cabling options.\n\nInterface with customers and internal stakeholders to align design intent and value proposition during the concept phase.\n\nPresent and document concept proposals that include block diagrams, design strategy, trade‑off summary, and risk evaluation.\n\nStay up to date with Open Compute (OCP), Computer Express Link (CXL) or Open BMC.\n\nEvaluate and integrate technology enablers such as PCIe Gen5/6, 112G PAM4 SerDes, high‑efficiency power stages, and new materials.\n\nParticipate in roadmap planning with BU/CTO to ensure platform reusability and alignment with future‑generation technologies.\n\nDefine how electrical, mechanical, thermal, and firmware domains interact to support functional and performance goals.\n\nCoordinate platform‑level integration strategies including MB placement, airflow optimization, and system serviceability.\n\nAlign system‑level DFM/EMC/thermal reliability requirements in early phase and guide downstream teams with clear targets.\n\nLead the creation of architecture decks, system requirements, platform‑level block diagrams, and BoM‑level feasibility plans.\n\nDrive internal and customer‑facing design reviews for architecture alignment and requirement sign‑off.\n\nMaintain issue‑tracking and lessons‑learned documentation to improve future concept efficiency.\n\nTechnical Skills\n\nAbility to research and explore unfamiliar technologies and concepts with an eye towards feasibility.\n\nFamiliarity with the Intel, AMD, Nvidia or ARM CPU/GPU architectures. Specifically, an understanding of how to optimize performance, IO, thermals, real‑estate and/or power. Direct experience with at least some of the above is preferred.\n\nFamiliarity with PCB board materials and construction techniques. Specifically, an understanding of trade‑offs and optimizations around insertion loss, via construction, stack‑ups and sizing of power planes and shapes.\n\nHigh‑level understanding of voltage regulators related to types of VR architectures, trade‑offs, efficiency, thermals, and critical VR components.\n\nAbility to use industry standard ECAD tools to review layouts and schematics is required.\n\nAbility to manipulate existing ECAD layouts and schematic databases for purposes of architectural planning and assessment preferred.\n\nExperience coding, sizing, and planning FPGAs, preferred.\n\nFluency in the mechanical, firmware and software domain. Specifically, an understanding of basics nomenclature, concepts and tools used by your architectural teammates.\n\nFluency in the thermal domain. Specifically, an understanding of component cooling techniques, when components require cooling and what information your thermal engineering teammate needs during concept assessment.\n\nDesired Traits & Skills\n\nStrategic thinker with system-level ownership mindset\n\nFamiliarity with system-level architecture\n\nStrong leadership and cross‑functional coordination skills\n\nComfortable working in fast‑paced, cross‑functional, global teams\n\nProactive, self‑driven, with high adaptability\n\nClear technical communicator, able to present trade‑offs and justify proposals\n\nCapable of NRE estimation and abstract requirement hardening\n\nFluent in English; able to work with global teams and customers\n\nEducation & Experience Requirements\n\nBachelor’s degree in Electrical, Computer Engineering, or a related field (Master’s preferred)\n\n15+ years of experience in data center system/server architecture\n\nDemonstrated experience leading concept‑phase architecture for AI/server products\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T03:31:29.077Z","dateModified":"2026-06-17T03:31:29.077Z","hiringOrganization":{"@type":"Organization","name":"Plasticos Castella","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Austin","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b68b127a0e96cd1e07f078a7"},"url":"https://jobsearcher.com/jobs/b68b127a0e96cd1e07f078a7"}}