{"schemaVersion":"jobsearcher.job.v1","id":"b5682e3b6f2f251612a8d683","url":"https://jobsearcher.com/jobs/b5682e3b6f2f251612a8d683","canonicalUrl":"https://jobsearcher.com/jobs/b5682e3b6f2f251612a8d683","title":"Application Development Engineer","description":"About Our Company – PulseForge develops and manufactures non-equilibrium processing equipment utilizing cutting-edge flash lamp technology. Our core technology supports new generations of products across multiple industries, including semiconductor manufacturing, electronics, packaging, materials research, and electronics assembly for consumer and automotive products.\nYour Opportunity - We are seeking a hands-on Applications Development Engineer with experience in electronics manufacturing, soldering, and design for manufacturability (DFM). In this role, you will work directly on next-generation process development, supporting both internal teams and external EMS partners. This includes optimizing photonic processes for PCB assembly, solder reflow, component attach, and substrate preparation, as well as creating robust workflows for scalable electronics production.\nYou’ll collaborate cross-functionally with mechanical, electrical, and software engineers to develop and validate manufacturing solutions that meet real-world production needs. The ideal candidate brings practical know-how from the EMS industry, combined with a passion for innovation and continuous process improvement.\nResponsibilities:\nDevelop and optimize photonic soldering and curing applications for electronic assemblies, including SMT reflow, component bonding, and interconnect formation.\nConduct Design of Experiments (DOE) to refine process conditions, enhance yield, and reduce cycle times.\nCollaborate with manufacturing teams to translate R&D outcomes into design-for-manufacturing (DFM) ready processes and prototypes.\nGenerate detailed technical documentation, including work instructions, process flow diagrams, and application notes.\nInterface with EMS customers and contract manufacturers to support pilot runs, technical evaluations, and process troubleshooting.\nLead and manage internal development projects from concept to validation, including system-level testing and data-driven analysis.\nMaintain laboratory safety and equipment calibration; follow cleanroom and ESD best practices where required.\nSupport prototype tool qualification and participate in continuous improvement initiatives for system performance and reliability.\nParticipate in external technical discussions, customer demos, and onsite installation or support visits (up to 20% travel).\nMinimum Qualifications:\nBachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.\n2+ years of hands-on experience in electronics manufacturing, electronics assembly, or SMT process development.\nStrong understanding of soldering processes, electronic component packaging, and assembly line integration.\nDemonstrated skills in process design, data analysis, and structured problem-solving.\nExcellent documentation, organizational, and project management abilities.\nPreferred Qualifications:\nMaster’s degree or equivalent experience in electronics manufacturing or process engineering.\nFamiliarity with EMS workflows, DFM principles, and high-throughput electronics production lines.\nExperience with pick-and-place systems, reflow ovens, stencil printing, and optical inspection tools.\nBackground in backend semiconductor packaging, photonic curing, or thin-film materials processing.\nWorking knowledge of glass substrates, adhesives, and polymer materials is a plus.\nPrior experience supporting customer trials, joint development agreements, or field applications engineering roles.\nStrong verbal and written communication skills, including experience preparing customer-facing technical materials\nCompensation:\nCommensurate with experience\nBenefits:\n401(k)\nDental Insurance\nHealth insurance\nPaid time off\nVision insurance\nPlease, no recruiting agencies!","company":"Pulse Forge","rawCompany":"pulse forge","city":"Austin","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-04-10T04:33:17.006Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Application Development Engineer","description":"About Our Company – PulseForge develops and manufactures non-equilibrium processing equipment utilizing cutting-edge flash lamp technology. Our core technology supports new generations of products across multiple industries, including semiconductor manufacturing, electronics, packaging, materials research, and electronics assembly for consumer and automotive products.\nYour Opportunity - We are seeking a hands-on Applications Development Engineer with experience in electronics manufacturing, soldering, and design for manufacturability (DFM). In this role, you will work directly on next-generation process development, supporting both internal teams and external EMS partners. This includes optimizing photonic processes for PCB assembly, solder reflow, component attach, and substrate preparation, as well as creating robust workflows for scalable electronics production.\nYou’ll collaborate cross-functionally with mechanical, electrical, and software engineers to develop and validate manufacturing solutions that meet real-world production needs. The ideal candidate brings practical know-how from the EMS industry, combined with a passion for innovation and continuous process improvement.\nResponsibilities:\nDevelop and optimize photonic soldering and curing applications for electronic assemblies, including SMT reflow, component bonding, and interconnect formation.\nConduct Design of Experiments (DOE) to refine process conditions, enhance yield, and reduce cycle times.\nCollaborate with manufacturing teams to translate R&D outcomes into design-for-manufacturing (DFM) ready processes and prototypes.\nGenerate detailed technical documentation, including work instructions, process flow diagrams, and application notes.\nInterface with EMS customers and contract manufacturers to support pilot runs, technical evaluations, and process troubleshooting.\nLead and manage internal development projects from concept to validation, including system-level testing and data-driven analysis.\nMaintain laboratory safety and equipment calibration; follow cleanroom and ESD best practices where required.\nSupport prototype tool qualification and participate in continuous improvement initiatives for system performance and reliability.\nParticipate in external technical discussions, customer demos, and onsite installation or support visits (up to 20% travel).\nMinimum Qualifications:\nBachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.\n2+ years of hands-on experience in electronics manufacturing, electronics assembly, or SMT process development.\nStrong understanding of soldering processes, electronic component packaging, and assembly line integration.\nDemonstrated skills in process design, data analysis, and structured problem-solving.\nExcellent documentation, organizational, and project management abilities.\nPreferred Qualifications:\nMaster’s degree or equivalent experience in electronics manufacturing or process engineering.\nFamiliarity with EMS workflows, DFM principles, and high-throughput electronics production lines.\nExperience with pick-and-place systems, reflow ovens, stencil printing, and optical inspection tools.\nBackground in backend semiconductor packaging, photonic curing, or thin-film materials processing.\nWorking knowledge of glass substrates, adhesives, and polymer materials is a plus.\nPrior experience supporting customer trials, joint development agreements, or field applications engineering roles.\nStrong verbal and written communication skills, including experience preparing customer-facing technical materials\nCompensation:\nCommensurate with experience\nBenefits:\n401(k)\nDental Insurance\nHealth insurance\nPaid time off\nVision insurance\nPlease, no recruiting agencies!","datePosted":"2026-04-10T04:33:17.006Z","dateModified":"2026-04-10T04:33:17.006Z","hiringOrganization":{"@type":"Organization","name":"Pulse Forge","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Austin","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b5682e3b6f2f251612a8d683"},"url":"https://jobsearcher.com/jobs/b5682e3b6f2f251612a8d683"}}