{"schemaVersion":"jobsearcher.job.v1","id":"b2b480aae34a1348a4bac87a","url":"https://jobsearcher.com/jobs/b2b480aae34a1348a4bac87a","canonicalUrl":"https://jobsearcher.com/jobs/b2b480aae34a1348a4bac87a","title":"Process Integration, Yield and Defect Reduction Engineering Lead","description":"Job Details:\n\nJob Description:\n\nThe New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This position reports directly to the NM Si Manufacturing Integration Director and offers the opportunity to lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations.\n\nIn this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. You will play a critical role in ensuring successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency.\n\nThe ideal candidate will have a proven track record of technical leadership, innovation, and cross-functional collaboration. Success in this position requires strong problem-solving skills, the ability to influence across organizations, and a passion for enabling technology development in a high-volume manufacturing environment.\n\nQualifications:\n\nMinimum Qualifications:\n\nBachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.\n5+ years of experience in semiconductor manufacturing or advanced packaging.\nIn addition, candidates should possess experience in one or more of the following areas:\n5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.\n3+ years of experience applying Design of Experiments (DOE) methodologies.\n5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.\n\nPreferred Qualifications:\n\nTechnical Skills and Experience\n\nStrong understanding of semiconductor manufacturing process flow and advanced packaging technologies.\nKnowledge of process capability analysis, specification management, statistical variation, and process control methodologies.\nProven ability to analyze defectivity and parametric data to identify yield limiters and drive process improvements.\nExperience with yield analysis and defect reduction methodologies.\nExperience applying Failure Modes and Effects Analysis (FMEA) techniques.\nExperience developing inline monitoring systems, dashboards, and manufacturing health metrics.\n\nLeadership and Problem Solving\n\nDemonstrated success leading technology development, transfer, and manufacturing ramp activities.\nProven ability to solve complex technical challenges using innovative and data-driven approaches.\nStrong project management, communication, and stakeholder management skills.\nAbility to lead cross-functional teams and influence technical decisions across multiple organizations.\nExperience driving operational excellence, yield improvement, and manufacturing efficiency initiatives.\n\nJob Type:\nExperienced Hire\n\nShift:\nShift 1 (United States of America)\n\nPrimary Location:\nUS, New Mexico, Albuquerque\n\nAdditional Locations:\n\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\n\nBenefits\n\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $140,830.00-198,820.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\n\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\n\n*\n\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","company":"Intel","rawCompany":"intel","city":"Albuquerque","state":"NM","isRemote":false,"isActive":false,"createdAt":"2026-08-23T08:15:40.020Z","occupations":[{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2112.00","title":"Industrial Engineers","slug":"industrial-engineers"},{"code":"11-3051.00","title":"Industrial Production Managers","slug":"industrial-production-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Process Integration, Yield and Defect Reduction Engineering Lead","description":"Job Details:\n\nJob Description:\n\nThe New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This position reports directly to the NM Si Manufacturing Integration Director and offers the opportunity to lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations.\n\nIn this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. You will play a critical role in ensuring successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency.\n\nThe ideal candidate will have a proven track record of technical leadership, innovation, and cross-functional collaboration. Success in this position requires strong problem-solving skills, the ability to influence across organizations, and a passion for enabling technology development in a high-volume manufacturing environment.\n\nQualifications:\n\nMinimum Qualifications:\n\nBachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.\n5+ years of experience in semiconductor manufacturing or advanced packaging.\nIn addition, candidates should possess experience in one or more of the following areas:\n5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.\n3+ years of experience applying Design of Experiments (DOE) methodologies.\n5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.\n\nPreferred Qualifications:\n\nTechnical Skills and Experience\n\nStrong understanding of semiconductor manufacturing process flow and advanced packaging technologies.\nKnowledge of process capability analysis, specification management, statistical variation, and process control methodologies.\nProven ability to analyze defectivity and parametric data to identify yield limiters and drive process improvements.\nExperience with yield analysis and defect reduction methodologies.\nExperience applying Failure Modes and Effects Analysis (FMEA) techniques.\nExperience developing inline monitoring systems, dashboards, and manufacturing health metrics.\n\nLeadership and Problem Solving\n\nDemonstrated success leading technology development, transfer, and manufacturing ramp activities.\nProven ability to solve complex technical challenges using innovative and data-driven approaches.\nStrong project management, communication, and stakeholder management skills.\nAbility to lead cross-functional teams and influence technical decisions across multiple organizations.\nExperience driving operational excellence, yield improvement, and manufacturing efficiency initiatives.\n\nJob Type:\nExperienced Hire\n\nShift:\nShift 1 (United States of America)\n\nPrimary Location:\nUS, New Mexico, Albuquerque\n\nAdditional Locations:\n\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\n\nBenefits\n\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $140,830.00-198,820.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\n\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\n\n*\n\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","datePosted":"2026-08-23T08:15:40.020Z","dateModified":"2026-08-23T08:15:40.020Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Albuquerque","addressRegion":"NM","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b2b480aae34a1348a4bac87a"},"url":"https://jobsearcher.com/jobs/b2b480aae34a1348a4bac87a"}}