{"schemaVersion":"jobsearcher.job.v1","id":"b0d6cf162d5897393f03d02f","url":"https://jobsearcher.com/jobs/b0d6cf162d5897393f03d02f","canonicalUrl":"https://jobsearcher.com/jobs/b0d6cf162d5897393f03d02f","title":"Yield Engineer On Shift","description":"Role Overview Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading‑edge, high quality, and cost effective substrate packaging solutions. Become part of SPTD to help us advance this mission while contributing to an exceptional workplace culture.\nResponsibilities Receive written and verbal passdown from tool owners and previous shift peers.\nExecute tasks based on shift priorities and escalate issues following the calling tree when roadblocks arise.\nPerform key shift activities such as tool troubleshooting, recipe modifications, PIL reviews and approvals.\nExecute non‑standard procedures (e.g., visual inspections, engineering scans and basic analysis).\nWrite and update specifications and RFCs after reviews with tool owners and internal stakeholders, including defect reduction teams.\nProvide thorough written and verbal passdown to the incoming shift, ensuring clear, structured communication of activities, encountered issues, and detailed observations that support effective resolution.\nQualifications Minimum Requirements\nBachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant experience. OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.\nPreferred Qualifications\n1+ years of experience in semiconductor packaging or substrate manufacturing. Prior experience working night and weekend shifts.\nJob Type Experienced Hire Shift: Shift 8 (United States of America)\nLocation(s) Primary Location: US, Arizona, Phoenix. Additional Locations: [List of possible additional locations].\nCompensation Annual Salary Range: $85,200.00–$139,810.00 USD (US locations). Pay is determined by work location and additional factors including job‑related skills, experience, and education.\nBenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nWork Model This role will require an on‑site presence.\nAdditional Information Intel is committed to Responsible Business Alliance compliance and ethical hiring practices. No fees will be charged during the hiring process. Candidates should never be required to pay recruitment or medical examination fees or any other charges as a condition of employment.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Chandler","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-04T03:59:50.223Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"51-9199.00","title":"Production Workers, All Other","slug":"production-workers-all-other"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Yield Engineer On Shift","description":"Role Overview Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading‑edge, high quality, and cost effective substrate packaging solutions. Become part of SPTD to help us advance this mission while contributing to an exceptional workplace culture.\nResponsibilities Receive written and verbal passdown from tool owners and previous shift peers.\nExecute tasks based on shift priorities and escalate issues following the calling tree when roadblocks arise.\nPerform key shift activities such as tool troubleshooting, recipe modifications, PIL reviews and approvals.\nExecute non‑standard procedures (e.g., visual inspections, engineering scans and basic analysis).\nWrite and update specifications and RFCs after reviews with tool owners and internal stakeholders, including defect reduction teams.\nProvide thorough written and verbal passdown to the incoming shift, ensuring clear, structured communication of activities, encountered issues, and detailed observations that support effective resolution.\nQualifications Minimum Requirements\nBachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant experience. OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.\nPreferred Qualifications\n1+ years of experience in semiconductor packaging or substrate manufacturing. Prior experience working night and weekend shifts.\nJob Type Experienced Hire Shift: Shift 8 (United States of America)\nLocation(s) Primary Location: US, Arizona, Phoenix. Additional Locations: [List of possible additional locations].\nCompensation Annual Salary Range: $85,200.00–$139,810.00 USD (US locations). Pay is determined by work location and additional factors including job‑related skills, experience, and education.\nBenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nWork Model This role will require an on‑site presence.\nAdditional Information Intel is committed to Responsible Business Alliance compliance and ethical hiring practices. No fees will be charged during the hiring process. Candidates should never be required to pay recruitment or medical examination fees or any other charges as a condition of employment.\n\n#J-18808-Ljbffr","datePosted":"2026-07-04T03:59:50.223Z","dateModified":"2026-07-04T03:59:50.223Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Chandler","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b0d6cf162d5897393f03d02f"},"url":"https://jobsearcher.com/jobs/b0d6cf162d5897393f03d02f"}}