{"schemaVersion":"jobsearcher.job.v1","id":"b091ac4794fc4e1c3dc44627","url":"https://jobsearcher.com/jobs/b091ac4794fc4e1c3dc44627","canonicalUrl":"https://jobsearcher.com/jobs/b091ac4794fc4e1c3dc44627","title":"HBI Module Development Engineer","description":"Job Description The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments. Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap. Key Responsibilities • Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control. • Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance. • Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control. • Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies. • Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies. • Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output. • Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies. • Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions. • Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement. • Contribute to future technology roadma...","company":"Intel","rawCompany":"intel","city":"Portland","state":"OR","isRemote":false,"isActive":false,"createdAt":"2026-07-18T22:48:20.638Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"HBI Module Development Engineer","description":"Job Description The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments. Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap. Key Responsibilities • Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control. • Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance. • Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control. • Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies. • Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies. • Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output. • Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies. • Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions. • Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement. • Contribute to future technology roadma...","datePosted":"2026-07-18T22:48:20.638Z","dateModified":"2026-07-18T22:48:20.638Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Portland","addressRegion":"OR","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"b091ac4794fc4e1c3dc44627"},"url":"https://jobsearcher.com/jobs/b091ac4794fc4e1c3dc44627"}}