{"schemaVersion":"jobsearcher.job.v1","id":"af7e5bb58024c43dd1078d9c","url":"https://jobsearcher.com/jobs/af7e5bb58024c43dd1078d9c","canonicalUrl":"https://jobsearcher.com/jobs/af7e5bb58024c43dd1078d9c","title":"ElectroMechanical Design Engineer Sr: MicroElectronics","description":"Overview\nAs ElectroMechanical Design Engineer on the Advanced Electronics Packaging team, you will design and validate innovative 2D/3D heterogeneous packaging solutions for flight-qualified hardware. You collaborate with electrical, systems, test, and product design engineers to translate emerging semiconductor processes into robust packaging. You’ll model architectures, optimize thermal and mechanical performance, and lead test plans while mentoring junior engineers. This role offers hands-on advancement in cutting-edge packaging technologies within a mission-driven aerospace environment.\n\nCompensation / BenefitsMedicalDentalVisionFlexible work arrangements (e.g., 4x10)401(k) matchPaid time off (PTO) and holidays\nResponsibilitiesConceptualize and model 2D/3D heterogeneous package architecturesDevelop mechanical and electrical designs for thin film interconnects, dies, and thermal featuresCreate and execute test plans to validate electrical, thermal, and mechanical performancePerform failure analysis and iterate designs from test and manufacturing feedbackPrepare design documentation including drawings, BOMs, specs, and verification reportsCollaborate with cross-functional teams to integrate packaging solutions into larger systemsMentor junior engineers and support knowledge transfer to the Advanced Packaging SMEStay current with emerging packaging technologies and propose program-adoption approachesSupport technology readiness reviews and contribute to risk assessments for new concepts\nKey requirementsDoD Secret level clearance or ability to obtain oneWorking knowledge of CREO and WindchillGeometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysisPackaging design experienceHardware design experienceMust be a U.S. citizenCross-functional collaborationMentoring and guidance to junior engineersContinuous learning and adaptationCREOWindchillGD&T and tolerance analysis","company":"Lockheed Martin","rawCompany":"lockheed martin","city":"Millbrae","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-09-15T04:52:43.081Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"336414","title":"Guided Missile and Space Vehicle Manufacturing","slug":"guided-missile-and-space-vehicle-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"ElectroMechanical Design Engineer Sr: MicroElectronics","description":"Overview\nAs ElectroMechanical Design Engineer on the Advanced Electronics Packaging team, you will design and validate innovative 2D/3D heterogeneous packaging solutions for flight-qualified hardware. You collaborate with electrical, systems, test, and product design engineers to translate emerging semiconductor processes into robust packaging. You’ll model architectures, optimize thermal and mechanical performance, and lead test plans while mentoring junior engineers. This role offers hands-on advancement in cutting-edge packaging technologies within a mission-driven aerospace environment.\n\nCompensation / BenefitsMedicalDentalVisionFlexible work arrangements (e.g., 4x10)401(k) matchPaid time off (PTO) and holidays\nResponsibilitiesConceptualize and model 2D/3D heterogeneous package architecturesDevelop mechanical and electrical designs for thin film interconnects, dies, and thermal featuresCreate and execute test plans to validate electrical, thermal, and mechanical performancePerform failure analysis and iterate designs from test and manufacturing feedbackPrepare design documentation including drawings, BOMs, specs, and verification reportsCollaborate with cross-functional teams to integrate packaging solutions into larger systemsMentor junior engineers and support knowledge transfer to the Advanced Packaging SMEStay current with emerging packaging technologies and propose program-adoption approachesSupport technology readiness reviews and contribute to risk assessments for new concepts\nKey requirementsDoD Secret level clearance or ability to obtain oneWorking knowledge of CREO and WindchillGeometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysisPackaging design experienceHardware design experienceMust be a U.S. citizenCross-functional collaborationMentoring and guidance to junior engineersContinuous learning and adaptationCREOWindchillGD&T and tolerance analysis","datePosted":"2026-09-15T04:52:43.081Z","dateModified":"2026-09-15T04:52:43.081Z","hiringOrganization":{"@type":"Organization","name":"Lockheed Martin","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Millbrae","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"af7e5bb58024c43dd1078d9c"},"url":"https://jobsearcher.com/jobs/af7e5bb58024c43dd1078d9c"}}