{"schemaVersion":"jobsearcher.job.v1","id":"af137b84ae5851e2c9e339d9","url":"https://jobsearcher.com/jobs/af137b84ae5851e2c9e339d9","canonicalUrl":"https://jobsearcher.com/jobs/af137b84ae5851e2c9e339d9","title":"Quantum IC Substrate Layout Engineer (2.5D/3D Packaging)","description":"Intel Corporation's Quantum Computing Group in Hillsboro, Oregon seeks a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology. You will use Siemens Xpedition, conduct DRC/LVS, support 2.5D/3D packaging, tapeouts with suppliers, and communicate designs to stakeholders while staying current with packaging trends.J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Eastern","state":"KY","isRemote":false,"isActive":false,"createdAt":"2026-10-22T13:52:43.717Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Quantum IC Substrate Layout Engineer (2.5D/3D Packaging)","description":"Intel Corporation's Quantum Computing Group in Hillsboro, Oregon seeks a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology. You will use Siemens Xpedition, conduct DRC/LVS, support 2.5D/3D packaging, tapeouts with suppliers, and communicate designs to stakeholders while staying current with packaging trends.J-18808-Ljbffr","datePosted":"2026-10-22T13:52:43.717Z","dateModified":"2026-10-22T13:52:43.717Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Eastern","addressRegion":"KY","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"af137b84ae5851e2c9e339d9"},"url":"https://jobsearcher.com/jobs/af137b84ae5851e2c9e339d9"}}