{"schemaVersion":"jobsearcher.job.v1","id":"a8f20ef3bd08647aa24d86dd","url":"https://jobsearcher.com/jobs/a8f20ef3bd08647aa24d86dd","canonicalUrl":"https://jobsearcher.com/jobs/a8f20ef3bd08647aa24d86dd","title":"Advanced Packaging Dry Etch Module Development Engineer","description":"Job Details:\nJob Description:\nWe are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.\n\nKey Responsibilities\n\nDevelop and optimize plasma etch processes for advanced packaging applications\nDesign experiments (DOE) to characterize process windows and optimize etch performance\nDevelop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.\nPartner with equipment suppliers to design, test, and implement innovative process solutions.\nMonitor and optimize production efficiency, yield, and manufacturing techniques for existing products.\nIdentify and implement modifications to improve equipment performance, reduce costs, and enhance production output.\nCollaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates\nMinimum Qualifications\n\nMaster or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.\nMaster's degree with at least 4 years of experience, or PhD with at least 2 years of experience.\nExperience listed above should be a combination of the following:\n\nProcess development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.\nDesign of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.\nExperience with plasma etch equipment platforms\nPreferred Qualifications\n\nExperience in wafer-level assembly, advanced packaging, or related technologies.\nDemonstrated success in leading programs from initial strategy development through high-volume production.\nTechnical leadership experience in solving complex engineering challenges and driving industry-leading solutions.\nStrong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.\n\nIntel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.\n\nJob Type:\nExperienced Hire\nShift:\nShift 1 (United States of America)\nPrimary Location:\nUS, Oregon, Hillsboro\nAdditional Locations:\nBusiness group:\nIntel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","company":"Intel","rawCompany":"intel","city":"Hillsboro","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-08-11T15:15:05.147Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Advanced Packaging Dry Etch Module Development Engineer","description":"Job Details:\nJob Description:\nWe are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.\n\nKey Responsibilities\n\nDevelop and optimize plasma etch processes for advanced packaging applications\nDesign experiments (DOE) to characterize process windows and optimize etch performance\nDevelop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.\nPartner with equipment suppliers to design, test, and implement innovative process solutions.\nMonitor and optimize production efficiency, yield, and manufacturing techniques for existing products.\nIdentify and implement modifications to improve equipment performance, reduce costs, and enhance production output.\nCollaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.\nQualifications:\nMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates\nMinimum Qualifications\n\nMaster or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.\nMaster's degree with at least 4 years of experience, or PhD with at least 2 years of experience.\nExperience listed above should be a combination of the following:\n\nProcess development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.\nDesign of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.\nExperience with plasma etch equipment platforms\nPreferred Qualifications\n\nExperience in wafer-level assembly, advanced packaging, or related technologies.\nDemonstrated success in leading programs from initial strategy development through high-volume production.\nTechnical leadership experience in solving complex engineering challenges and driving industry-leading solutions.\nStrong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.\n\nIntel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.\n\nJob Type:\nExperienced Hire\nShift:\nShift 1 (United States of America)\nPrimary Location:\nUS, Oregon, Hillsboro\nAdditional Locations:\nBusiness group:\nIntel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\nPosition of Trust\nN/A\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .\n\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD\n\nThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.\n\nWork Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","datePosted":"2026-08-11T15:15:05.147Z","dateModified":"2026-08-11T15:15:05.147Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Hillsboro","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"a8f20ef3bd08647aa24d86dd"},"url":"https://jobsearcher.com/jobs/a8f20ef3bd08647aa24d86dd"}}