{"schemaVersion":"jobsearcher.job.v1","id":"a5d771c99a188dab1b4ca37a","url":"https://jobsearcher.com/jobs/a5d771c99a188dab1b4ca37a","canonicalUrl":"https://jobsearcher.com/jobs/a5d771c99a188dab1b4ca37a","title":"Tech Integration Engineer","description":"Company Description\nAbsolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.\nPosition: Tech Integration Engineer\nLocation: COVINGTON, GA\nJOB SUMMARY\nThe Tech Integration Engineer leads advanced packaging substrate integration from customer requirements through qualification and mass production. The role serves as the primary customer technical interface and owns cross-process gray-zone issues by aligning internal teams, identifying root causes, and driving timely resolution. Strong knowledge of advanced packaging and end-to-end substrate manufacturing is required.\nDUTIES/RESPONSIBILITIES\n\nLead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production.\nServe as the primary customer technical interface and translate performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans.\nMaintain end-to-end understanding of substrate processes, including material preparation, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final quality assurance.\nIdentify and resolve technical gray zones between process modules where ownership, specifications, or root causes are unclear.\nLead cross-process troubleshooting for yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues.\nCoordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams to define ownership, containment, root cause, corrective actions, and closure timing.\nEstablish process-interface criteria, monitor technical risks and key performance indicators, and communicate status to customers and management.\nApply SPC, DOE, FMEA, and structured problem-solving methods to improve capability, yield, and reliability.\n\nREQUIREMENTS\n\nStrong understanding of advanced packaging technologies and end-to-end glass or organic substrate manufacturing.\nAbility to translate customer requirements into technical specifications, process flows, and qualification plans.\nProven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution.\nExperience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment.\nStrong communication, data analysis, and structured problem-solving skills.\n\nQUALIFICATIONS\n\nDemonstrated technical ownership, sound judgment, and ability to manage multiple priorities.\nEffective cross-functional leadership, stakeholder alignment, mentoring, and executive communication skills.\nMust be at least 18 years old and authorized to work in the United States.\n\nEDUCATION\n\nBachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field; a master’s degree is preferred.\n\nEXPERIENCE\n\nTypically 7+ years of relevant engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development, including experience leading customer-facing or cross-functional technical programs.\nHands-on experience supporting technology qualification, new product introduction, manufacturing ramp, yield improvement, or high-volume production is strongly preferred.\n\nSALARY\n\n$100,000 – $160,000\n\nBENEFIT\n\n401K 6% matching (NO vesting period)\nHealthcare 100% support (Health, Dental, Vision)\nLife, STD, LTD 100 % support\nCell phone allowance\nPTO and self-development\nDaily Lunch Benefit\n\n#J-18808-Ljbffr","company":"Absolics","rawCompany":"absolics","city":"Covington","state":"VA","isRemote":false,"isActive":false,"createdAt":"2026-10-03T04:16:52.394Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Tech Integration Engineer","description":"Company Description\nAbsolics Inc. is the world’s first glass substrate manufacturer and a leader in advanced packaging technologies. The company provides scalable solutions tailored for businesses in high-performance computing. Absolics pioneers innovative manufacturing techniques to support cutting-edge semiconductor advancements. Located in Covington, GA, the company is positioned at the forefront of the technology industry.\nPosition: Tech Integration Engineer\nLocation: COVINGTON, GA\nJOB SUMMARY\nThe Tech Integration Engineer leads advanced packaging substrate integration from customer requirements through qualification and mass production. The role serves as the primary customer technical interface and owns cross-process gray-zone issues by aligning internal teams, identifying root causes, and driving timely resolution. Strong knowledge of advanced packaging and end-to-end substrate manufacturing is required.\nDUTIES/RESPONSIBILITIES\n\nLead advanced packaging substrate integration from customer requirements and design review through qualification, ramp, and mass production.\nServe as the primary customer technical interface and translate performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans.\nMaintain end-to-end understanding of substrate processes, including material preparation, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final quality assurance.\nIdentify and resolve technical gray zones between process modules where ownership, specifications, or root causes are unclear.\nLead cross-process troubleshooting for yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues.\nCoordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams to define ownership, containment, root cause, corrective actions, and closure timing.\nEstablish process-interface criteria, monitor technical risks and key performance indicators, and communicate status to customers and management.\nApply SPC, DOE, FMEA, and structured problem-solving methods to improve capability, yield, and reliability.\n\nREQUIREMENTS\n\nStrong understanding of advanced packaging technologies and end-to-end glass or organic substrate manufacturing.\nAbility to translate customer requirements into technical specifications, process flows, and qualification plans.\nProven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution.\nExperience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment.\nStrong communication, data analysis, and structured problem-solving skills.\n\nQUALIFICATIONS\n\nDemonstrated technical ownership, sound judgment, and ability to manage multiple priorities.\nEffective cross-functional leadership, stakeholder alignment, mentoring, and executive communication skills.\nMust be at least 18 years old and authorized to work in the United States.\n\nEDUCATION\n\nBachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field; a master’s degree is preferred.\n\nEXPERIENCE\n\nTypically 7+ years of relevant engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development, including experience leading customer-facing or cross-functional technical programs.\nHands-on experience supporting technology qualification, new product introduction, manufacturing ramp, yield improvement, or high-volume production is strongly preferred.\n\nSALARY\n\n$100,000 – $160,000\n\nBENEFIT\n\n401K 6% matching (NO vesting period)\nHealthcare 100% support (Health, Dental, Vision)\nLife, STD, LTD 100 % support\nCell phone allowance\nPTO and self-development\nDaily Lunch Benefit\n\n#J-18808-Ljbffr","datePosted":"2026-10-03T04:16:52.394Z","dateModified":"2026-10-03T04:16:52.394Z","hiringOrganization":{"@type":"Organization","name":"Absolics","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Covington","addressRegion":"VA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"a5d771c99a188dab1b4ca37a"},"url":"https://jobsearcher.com/jobs/a5d771c99a188dab1b4ca37a"}}