{"schemaVersion":"jobsearcher.job.v1","id":"a57eab3ca480a2e29fa180a8","url":"https://jobsearcher.com/jobs/a57eab3ca480a2e29fa180a8","canonicalUrl":"https://jobsearcher.com/jobs/a57eab3ca480a2e29fa180a8","title":"Lead Engineer, Advanced Packaging & 3D Integration","description":"Micron Technology, Inc in Boise is seeking a Principal Engineer to lead the APTD team in shaping next-generation semiconductor packaging technologies. This position is vital for influencing product quality and reliability.\nIdeal candidates will have 5+ years of experience in semiconductor advanced packaging and a relevant degree. The role involves collaboration, mentoring, and driving innovation in an exciting, fast-paced environment.\nMicron offers comprehensive benefits, supporting the well-being and future preparation of its employees.\n\n#J-18808-Ljbffr","company":"Micron Technology","rawCompany":"micron technology","city":"Boise","state":"ID","isRemote":false,"isActive":false,"createdAt":"2026-06-17T04:11:40.263Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead Engineer, Advanced Packaging & 3D Integration","description":"Micron Technology, Inc in Boise is seeking a Principal Engineer to lead the APTD team in shaping next-generation semiconductor packaging technologies. This position is vital for influencing product quality and reliability.\nIdeal candidates will have 5+ years of experience in semiconductor advanced packaging and a relevant degree. The role involves collaboration, mentoring, and driving innovation in an exciting, fast-paced environment.\nMicron offers comprehensive benefits, supporting the well-being and future preparation of its employees.\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T04:11:40.263Z","dateModified":"2026-06-17T04:11:40.263Z","hiringOrganization":{"@type":"Organization","name":"Micron Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Boise","addressRegion":"ID","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"a57eab3ca480a2e29fa180a8"},"url":"https://jobsearcher.com/jobs/a57eab3ca480a2e29fa180a8"}}