{"schemaVersion":"jobsearcher.job.v1","id":"9ee8538615b93fe36b1014a3","url":"https://jobsearcher.com/jobs/9ee8538615b93fe36b1014a3","canonicalUrl":"https://jobsearcher.com/jobs/9ee8538615b93fe36b1014a3","title":"Lead Advanced Packaging Plating Module Engineer","description":"Intel Corporation in Hillsboro, Oregon is seeking an experienced Module Development Engineer to advance advanced packaging plating modules. You will develop and optimize plating processes, perform feasibility studies, and enable high-volume manufacturing for next-generation device architectures.\r\nThe role emphasizes collaboration with equipment and material suppliers, data analytics, and SPC to ensure process stability and scalable production.#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Brooklyn","state":"NY","isRemote":false,"isActive":false,"createdAt":"2026-10-11T13:26:54.852Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"332813","title":"Electroplating, Plating, Polishing, Anodizing, and Coloring","slug":"electroplating-plating-polishing-anodizing-and-coloring"},{"code":"332812","title":"Metal Coating, Engraving (except Jewelry and Silverware), and Allied Services to Manufacturers","slug":"metal-coating-engraving-except-jewelry-and-silverware-and-allied-services-to-manufacturers"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead Advanced Packaging Plating Module Engineer","description":"Intel Corporation in Hillsboro, Oregon is seeking an experienced Module Development Engineer to advance advanced packaging plating modules. You will develop and optimize plating processes, perform feasibility studies, and enable high-volume manufacturing for next-generation device architectures.\r\nThe role emphasizes collaboration with equipment and material suppliers, data analytics, and SPC to ensure process stability and scalable production.#J-18808-Ljbffr","datePosted":"2026-10-11T13:26:54.852Z","dateModified":"2026-10-11T13:26:54.852Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Brooklyn","addressRegion":"NY","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"9ee8538615b93fe36b1014a3"},"url":"https://jobsearcher.com/jobs/9ee8538615b93fe36b1014a3"}}