{"schemaVersion":"jobsearcher.job.v1","id":"9c5fc945be593e747b68500f","url":"https://jobsearcher.com/jobs/9c5fc945be593e747b68500f","canonicalUrl":"https://jobsearcher.com/jobs/9c5fc945be593e747b68500f","title":"Sr Principal Process Development Engineer","description":"OverviewIn this role you will own and optimize SMT processes for probe card PCB assembly, ensuring high-quality output and stable production. You'll lead cross-functional improvements across plating, lithography, mechanical assembly, and electrical test teams to enhance yield and process robustness. You will drive equipment performance, defect reduction, and continuous improvement initiatives. This position offers the opportunity to shape advanced SMT manufacturing for high-density probe cards in a global, customer-focused environment.Compensation / Benefitsmedical, dental, vision benefits401(k) with company matchemployee stock purchase plan (ESPP)paid time offquarterly profit-sharing bonusesflexible spending accountsResponsibilitiesDevelop, qualify, and maintain SMT processes including solder paste selection, injection, inspection, reflow profiling, and placement parametersOwn recipe creation and optimization for high-density probe card PCBsImprove process capability (Cp/Cpk) and maintain stable production performanceProvide daily engineering support for SMT equipment (stencil printer, pick-and-place, reflow oven, SPI)Lead troubleshooting and root cause analysis for equipment failures and defectsDefine and maintain PM schedules, calibration, and spare parts strategiesMonitor yield, defects Pareto, and SPC trends; lead DfX discussions with design engineeringImplement corrective actions and robust controls for solder bridging, opens, voiding, tombstoning, and wettingSupport production with process deviations, equipment issues, and new product introductionsDevelop documentation (WI/SOPs, setup sheets, inspection criteria) and drive cycle time reduction and trainingCollaborate with plating, photolithography, mechanical/assembly, and electrical test teamsLead Lean/6s initiatives to reduce waste and improve process robustnessEvaluate and introduce new materials and improved stencil/hardware designsParticipate in equipment justification and capital project planningProvide engineering support during prototype builds and customer-specific configurationsKey requirementsBachelor's degree in relevant engineering field3–7 years SMT or PCB assembly experience (semiconductor/PCBA/electronics assembly preferred)Strong understanding of solder paste behavior, reflow principles, and defect mechanismsHands-on experience with SMT equipment and inspection systems (SPI, AOI)Proficiency with SPC, FMEA, DOE, and root cause problem solvingExperience in probe card, semiconductor test hardware, or high-precision PCB manufacturingFamiliarity with high-density BGAs, fine-pitch components, and micro-assemblyKnowledge of CAM/EDA data for stencil/paste aperture optimizationLean/6s Green Belt or Black Belt certificationExperience with MES systems and factory automationStrong ownership mindsetExcellent troubleshooting and structured problem solvingAbility to work cross-functionally in a fast-paced, high-mix environmentSMT equipment and inspection systems (SPI, AOI)Solder paste behavior and reflow principlesProcess capability (Cp/Cpk)","company":"Formfactor","rawCompany":"formfactor","city":"Oakland","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-10-26T13:06:36.466Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334412","title":"Bare Printed Circuit Board Manufacturing","slug":"bare-printed-circuit-board-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Sr Principal Process Development Engineer","description":"OverviewIn this role you will own and optimize SMT processes for probe card PCB assembly, ensuring high-quality output and stable production. You'll lead cross-functional improvements across plating, lithography, mechanical assembly, and electrical test teams to enhance yield and process robustness. You will drive equipment performance, defect reduction, and continuous improvement initiatives. This position offers the opportunity to shape advanced SMT manufacturing for high-density probe cards in a global, customer-focused environment.Compensation / Benefitsmedical, dental, vision benefits401(k) with company matchemployee stock purchase plan (ESPP)paid time offquarterly profit-sharing bonusesflexible spending accountsResponsibilitiesDevelop, qualify, and maintain SMT processes including solder paste selection, injection, inspection, reflow profiling, and placement parametersOwn recipe creation and optimization for high-density probe card PCBsImprove process capability (Cp/Cpk) and maintain stable production performanceProvide daily engineering support for SMT equipment (stencil printer, pick-and-place, reflow oven, SPI)Lead troubleshooting and root cause analysis for equipment failures and defectsDefine and maintain PM schedules, calibration, and spare parts strategiesMonitor yield, defects Pareto, and SPC trends; lead DfX discussions with design engineeringImplement corrective actions and robust controls for solder bridging, opens, voiding, tombstoning, and wettingSupport production with process deviations, equipment issues, and new product introductionsDevelop documentation (WI/SOPs, setup sheets, inspection criteria) and drive cycle time reduction and trainingCollaborate with plating, photolithography, mechanical/assembly, and electrical test teamsLead Lean/6s initiatives to reduce waste and improve process robustnessEvaluate and introduce new materials and improved stencil/hardware designsParticipate in equipment justification and capital project planningProvide engineering support during prototype builds and customer-specific configurationsKey requirementsBachelor's degree in relevant engineering field3–7 years SMT or PCB assembly experience (semiconductor/PCBA/electronics assembly preferred)Strong understanding of solder paste behavior, reflow principles, and defect mechanismsHands-on experience with SMT equipment and inspection systems (SPI, AOI)Proficiency with SPC, FMEA, DOE, and root cause problem solvingExperience in probe card, semiconductor test hardware, or high-precision PCB manufacturingFamiliarity with high-density BGAs, fine-pitch components, and micro-assemblyKnowledge of CAM/EDA data for stencil/paste aperture optimizationLean/6s Green Belt or Black Belt certificationExperience with MES systems and factory automationStrong ownership mindsetExcellent troubleshooting and structured problem solvingAbility to work cross-functionally in a fast-paced, high-mix environmentSMT equipment and inspection systems (SPI, AOI)Solder paste behavior and reflow principlesProcess capability (Cp/Cpk)","datePosted":"2026-10-26T13:06:36.466Z","dateModified":"2026-10-26T13:06:36.466Z","hiringOrganization":{"@type":"Organization","name":"Formfactor","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Oakland","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"9c5fc945be593e747b68500f"},"url":"https://jobsearcher.com/jobs/9c5fc945be593e747b68500f"}}