{"schemaVersion":"jobsearcher.job.v1","id":"9acbe1d7889c78b5d839698b","url":"https://jobsearcher.com/jobs/9acbe1d7889c78b5d839698b","canonicalUrl":"https://jobsearcher.com/jobs/9acbe1d7889c78b5d839698b","title":"Lead Advanced Packaging Process Integration Engineer","description":"Intel Corporation in Albuquerque, New Mexico, is seeking a Process Integration Engineer to join the Advanced Packaging Technology Development team. You will help enable next-generation packaging by bridging process modules, device engineering, yield, and reliability teams to deliver robust base-die solutions.\nThe role emphasizes cross-functional collaboration, data-driven defect and yield management, and ownership of process development from concept through qualification, with transfer readiness\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Albuquerque","state":"NM","isRemote":false,"isActive":true,"createdAt":"2026-07-22T03:27:28.195Z","occupations":[{"code":"17-2112.00","title":"Industrial Engineers","slug":"industrial-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead Advanced Packaging Process Integration Engineer","description":"Intel Corporation in Albuquerque, New Mexico, is seeking a Process Integration Engineer to join the Advanced Packaging Technology Development team. You will help enable next-generation packaging by bridging process modules, device engineering, yield, and reliability teams to deliver robust base-die solutions.\nThe role emphasizes cross-functional collaboration, data-driven defect and yield management, and ownership of process development from concept through qualification, with transfer readiness\n\n#J-18808-Ljbffr","datePosted":"2026-07-22T03:27:28.195Z","dateModified":"2026-07-22T03:27:28.195Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Albuquerque","addressRegion":"NM","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"9acbe1d7889c78b5d839698b"},"url":"https://jobsearcher.com/jobs/9acbe1d7889c78b5d839698b"}}