{"schemaVersion":"jobsearcher.job.v1","id":"974d26f5a9aafd28b52b4dcd","url":"https://jobsearcher.com/jobs/974d26f5a9aafd28b52b4dcd","canonicalUrl":"https://jobsearcher.com/jobs/974d26f5a9aafd28b52b4dcd","title":"Photolithography Process Development Engineer (Advanced Patterning)","description":"Overview\nIn this role you will drive advanced lithography and patterning development for 20nm-class logic at TI's LFAB. You will collaborate with ATD to optimize patterning, RET/OPC, and litho-etch integration to meet performance and yield goals. Expect hands-on work across lithography, materials, and plasma etch, with a strong emphasis on data-driven improvements and cross-functional transfer to high-volume manufacturing. This is a high-impact position at the intersection of technology, process development, and manufacturing excellence. You will help shape next-generation nodes and contribute to TI’s mission of affordable, reliable electronics.\n\nCompensation / Benefitscompetitive paybenefits designed to support you and your familywell-being support\nResponsibilitiesModeling and simulation of lithography processes to optimize patterning resultsMetrology and yield improvement using CD-SEM, overlay, and scatterometry to enhance CDU and overlayCollaborate with equipment vendors on new materials, photoresists, and tool hardware upgradesData analysis and SPC/DOE to develop lithography shrink processesDefine pathfinding activities for new patterning technologies and assess High NA ImmersionLead technology transfer from R&D to high-volume manufacturing for photolithographyLead development of Litho Shrink processes for 20nm-class logicDrive litho-etch integration (LELE, SADP, pitch doubling) for advanced patterningDevelop RET/OPC strategies and optimize materials selections (photoresists, hard masks, ARCs)Characterize and reduce defects (LER, CD variation, overlay) and interface with Etch for pattern transferCollaborate with design, integration, yield, and manufacturing teams\nKey requirementsMaster's in Electrical Engineering, Materials Science, Physics, or related discipline5+ years of industry experience in advanced semiconductor process developmentHands-on experience with 22nm node or comparable advanced nodes (e.g., 28nm, 14nm)Expertise in photolithography process development and optimizationLitho-etch integration (LELE, SADP, pitch splitting/doubling)OPC and RET methodologies, dry etch processes for pattern transferCD control and uniformity, overlay and alignment challenges, defectivity mitigationcross-functional collaborationproblem-solvingdata-driven decision makingImmersion lithography, DUV, and multi-patterning processesSADP, LELE, pitch doubling/ splittingOPC and RET techniques","company":"Texas Instruments","rawCompany":"texas instruments","city":"Provo","state":"UT","isRemote":false,"isActive":true,"createdAt":"2026-09-15T04:46:32.010Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Photolithography Process Development Engineer (Advanced Patterning)","description":"Overview\nIn this role you will drive advanced lithography and patterning development for 20nm-class logic at TI's LFAB. You will collaborate with ATD to optimize patterning, RET/OPC, and litho-etch integration to meet performance and yield goals. Expect hands-on work across lithography, materials, and plasma etch, with a strong emphasis on data-driven improvements and cross-functional transfer to high-volume manufacturing. This is a high-impact position at the intersection of technology, process development, and manufacturing excellence. You will help shape next-generation nodes and contribute to TI’s mission of affordable, reliable electronics.\n\nCompensation / Benefitscompetitive paybenefits designed to support you and your familywell-being support\nResponsibilitiesModeling and simulation of lithography processes to optimize patterning resultsMetrology and yield improvement using CD-SEM, overlay, and scatterometry to enhance CDU and overlayCollaborate with equipment vendors on new materials, photoresists, and tool hardware upgradesData analysis and SPC/DOE to develop lithography shrink processesDefine pathfinding activities for new patterning technologies and assess High NA ImmersionLead technology transfer from R&D to high-volume manufacturing for photolithographyLead development of Litho Shrink processes for 20nm-class logicDrive litho-etch integration (LELE, SADP, pitch doubling) for advanced patterningDevelop RET/OPC strategies and optimize materials selections (photoresists, hard masks, ARCs)Characterize and reduce defects (LER, CD variation, overlay) and interface with Etch for pattern transferCollaborate with design, integration, yield, and manufacturing teams\nKey requirementsMaster's in Electrical Engineering, Materials Science, Physics, or related discipline5+ years of industry experience in advanced semiconductor process developmentHands-on experience with 22nm node or comparable advanced nodes (e.g., 28nm, 14nm)Expertise in photolithography process development and optimizationLitho-etch integration (LELE, SADP, pitch splitting/doubling)OPC and RET methodologies, dry etch processes for pattern transferCD control and uniformity, overlay and alignment challenges, defectivity mitigationcross-functional collaborationproblem-solvingdata-driven decision makingImmersion lithography, DUV, and multi-patterning processesSADP, LELE, pitch doubling/ splittingOPC and RET techniques","datePosted":"2026-09-15T04:46:32.010Z","dateModified":"2026-09-15T04:46:32.010Z","hiringOrganization":{"@type":"Organization","name":"Texas Instruments","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Provo","addressRegion":"UT","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"974d26f5a9aafd28b52b4dcd"},"url":"https://jobsearcher.com/jobs/974d26f5a9aafd28b52b4dcd"}}