{"schemaVersion":"jobsearcher.job.v1","id":"93ec3cfeeef9461f11a522e5","url":"https://jobsearcher.com/jobs/93ec3cfeeef9461f11a522e5","canonicalUrl":"https://jobsearcher.com/jobs/93ec3cfeeef9461f11a522e5","title":"Sr. Packaging Engineer","description":"Elevate Quantum (EQ) is America’s Quantum Tech Hub—designatedby the U.S. Department of Commerce andrepresentingthe largest concentration of quantum organizations in the world. EQoperatesat the center of a rapidly scaling ecosystem spanning industry, academia, national laboratories, and government across Colorado, New Mexico, and Wyoming. Our mission is to accelerate the commercialization of quantum technology and translate regional scientific leadership into lasting economic impact.\n\nEQ is not a traditional nonprofit—it is an execution engine responsible for deploying capital, standing up infrastructure, and delivering measurable outcomes across a diverse portfolio of programs. The organization operates across five core business units:\n\nAdvanced Packaging Facility\nFocused on high-mix, low- to medium-volume production, this facility supports quantum and advanced photonics companies with capabilities in optoelectronics packaging such as flip chip bonding, solder attach, wire-bonding, fiber-to-chip coupling, and various metrology capabilities. In partnership with Sandia National Laboratories, EQ is helping bridge the gap between research and scalable manufacturing.\n\nPhotonic Integrated Circuit (PIC) Fabrication Facility\nA rapid-turn, low-volume fabrication facility designed for quantum-relevant materials (including silicon nitride and lithium niobate), enabling significantly faster iteration cycles than traditional foundries and supporting early‑stage and scaling companies alike.\n\nCommercialization Labs\nA shared‑use environment offering access to advanced equipment, lab space, and the nation’s first open‑access, open‑architecture quantum system. These labs provide critical infrastructure for testing, prototyping, and validating emerging technologies.\n\nWorkforce Development\nSpanning Colorado and New Mexico, EQ’s workforce programs combine ecosystem coordination with hands‑on training delivered on real equipment. These programs are designed to build the next generation of quantum technicians and support a rapidly growing talent pipeline.\n\nConsortium Engagement\nEQ manages a 150+ member coalition and convenes the broader ecosystem through advisory boards, CEO roundtables, major events, and cross‑state collaboration. The organization also partners with state and regional entities to attract companies, align strategy, and drive continued investment into the region.\n\nTogether, these business units form a vertically integrated platform—one that spans infrastructure, talent, commercialization, and ecosystem activation. EQ’s role is to ensure these components operate cohesively to accelerate the path from scientific breakthroughs to commercial deployment at scale.\n\nJOB SUMMARY\nReporting to the Director of Packaging, the Sr. Packaging Engineer will drive the development of optoelectronic packaging and integration processes, qualifying them and supporting the launch of new processes. As part of the development team, the Sr. Packaging Engineer will help identify and develop innovative solutions to process and manufacturing challenges in a team‑based and fast‑paced environment.\n\nESSENTIAL JOB FUNCTIONS\n\nPlanningand executingexperiments forthedevelopment of newelectronicand photonicpackaging processes (joining such as flip chipand wire bonding,reflow processes, optical couplingsuch as fiber to shipattach etc.).\n\nEmployingvariousmetrology tools andtechniques,and reliability tests to understand and improve the performance of theprocesses.\n\nOptimizingassemblyprocesses,FMEAand root cause analysis.\n\nCompilingand analyzingdata,writingreports, and presentingresults to team members and management.\n\nSupportingthe launchof new processesand trainingmanufacturing personnel.\n\nMaintaining and improving the established processes andequipment,andproviding support to production and troubleshooting technical issues.\n\nInterfacingwithvendors of equipment andprocess materials.\n\nJOB QUALIFICATIONS & REQUIREMENTS\nRequired qualifications:\n\nM.S. or Ph.D. in Physics, Materials Science, Mechanical Engineering, Chemistry or related field.\n\nMinimum3-7years of experiencewith photonic systems and integration, electronic packaging, solder systems and reflow processes in a high- techindustry (Quantum, MEMS, semiconductor, or PCB).\n\nStrong foundationof materials scienceand opticsprinciples and hands‑on experience withfiber alignment procedures, flip chip bonders, wire bonders and reflow ovens.\n\nHands‑on experience in setting up and maintaining optoelectronic packaging processes, equipment and metrology methods for the control and monitoring of such processes.\n\nExperience with diagnosing issues using failure analysis techniques and equipment, researching, and recommending solutions.\n\nExperiencewith,profilometry,surface and bulk analytical methods relevant to characterization of thin films (e.g.XPS, XRD, EDX).\n\nStrong statistical analysis and data mining capabilities with tools like JMP and Excel.\n\nStrong and independent problem‑solving skills.\n\nExcellent written and verbal communication skills and ability to work as a team player in a fast-paced environment.\n\nSelf‑motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as writing technical specifications and procedures.\n\nPreferred qualifications:\n\nExperience with technology transfer from R&D into manufacturing\n\nFamiliarity with quantum subsystems and hardware infrastructure preferred.\n\nSix sigma or statistical process control training\n\nCompensation and Location:\nBased in the Greater Albuquerque, New Mexico\n\n#J-18808-Ljbffr","company":"Elevatequantum","rawCompany":"elevatequantum","city":"Albuquerque","state":"NM","isRemote":false,"isActive":false,"createdAt":"2026-07-16T03:59:51.286Z","occupations":[{"code":"53-7064.00","title":"Packers and Packagers, Hand","slug":"packers-and-packagers-hand"},{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"},{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"}],"industries":[{"code":"561910","title":"Packaging and Labeling Services","slug":"packaging-and-labeling-services"},{"code":"541713","title":"Research and Development in Nanotechnology","slug":"research-and-development-in-nanotechnology"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Sr. Packaging Engineer","description":"Elevate Quantum (EQ) is America’s Quantum Tech Hub—designatedby the U.S. Department of Commerce andrepresentingthe largest concentration of quantum organizations in the world. EQoperatesat the center of a rapidly scaling ecosystem spanning industry, academia, national laboratories, and government across Colorado, New Mexico, and Wyoming. Our mission is to accelerate the commercialization of quantum technology and translate regional scientific leadership into lasting economic impact.\n\nEQ is not a traditional nonprofit—it is an execution engine responsible for deploying capital, standing up infrastructure, and delivering measurable outcomes across a diverse portfolio of programs. The organization operates across five core business units:\n\nAdvanced Packaging Facility\nFocused on high-mix, low- to medium-volume production, this facility supports quantum and advanced photonics companies with capabilities in optoelectronics packaging such as flip chip bonding, solder attach, wire-bonding, fiber-to-chip coupling, and various metrology capabilities. In partnership with Sandia National Laboratories, EQ is helping bridge the gap between research and scalable manufacturing.\n\nPhotonic Integrated Circuit (PIC) Fabrication Facility\nA rapid-turn, low-volume fabrication facility designed for quantum-relevant materials (including silicon nitride and lithium niobate), enabling significantly faster iteration cycles than traditional foundries and supporting early‑stage and scaling companies alike.\n\nCommercialization Labs\nA shared‑use environment offering access to advanced equipment, lab space, and the nation’s first open‑access, open‑architecture quantum system. These labs provide critical infrastructure for testing, prototyping, and validating emerging technologies.\n\nWorkforce Development\nSpanning Colorado and New Mexico, EQ’s workforce programs combine ecosystem coordination with hands‑on training delivered on real equipment. These programs are designed to build the next generation of quantum technicians and support a rapidly growing talent pipeline.\n\nConsortium Engagement\nEQ manages a 150+ member coalition and convenes the broader ecosystem through advisory boards, CEO roundtables, major events, and cross‑state collaboration. The organization also partners with state and regional entities to attract companies, align strategy, and drive continued investment into the region.\n\nTogether, these business units form a vertically integrated platform—one that spans infrastructure, talent, commercialization, and ecosystem activation. EQ’s role is to ensure these components operate cohesively to accelerate the path from scientific breakthroughs to commercial deployment at scale.\n\nJOB SUMMARY\nReporting to the Director of Packaging, the Sr. Packaging Engineer will drive the development of optoelectronic packaging and integration processes, qualifying them and supporting the launch of new processes. As part of the development team, the Sr. Packaging Engineer will help identify and develop innovative solutions to process and manufacturing challenges in a team‑based and fast‑paced environment.\n\nESSENTIAL JOB FUNCTIONS\n\nPlanningand executingexperiments forthedevelopment of newelectronicand photonicpackaging processes (joining such as flip chipand wire bonding,reflow processes, optical couplingsuch as fiber to shipattach etc.).\n\nEmployingvariousmetrology tools andtechniques,and reliability tests to understand and improve the performance of theprocesses.\n\nOptimizingassemblyprocesses,FMEAand root cause analysis.\n\nCompilingand analyzingdata,writingreports, and presentingresults to team members and management.\n\nSupportingthe launchof new processesand trainingmanufacturing personnel.\n\nMaintaining and improving the established processes andequipment,andproviding support to production and troubleshooting technical issues.\n\nInterfacingwithvendors of equipment andprocess materials.\n\nJOB QUALIFICATIONS & REQUIREMENTS\nRequired qualifications:\n\nM.S. or Ph.D. in Physics, Materials Science, Mechanical Engineering, Chemistry or related field.\n\nMinimum3-7years of experiencewith photonic systems and integration, electronic packaging, solder systems and reflow processes in a high- techindustry (Quantum, MEMS, semiconductor, or PCB).\n\nStrong foundationof materials scienceand opticsprinciples and hands‑on experience withfiber alignment procedures, flip chip bonders, wire bonders and reflow ovens.\n\nHands‑on experience in setting up and maintaining optoelectronic packaging processes, equipment and metrology methods for the control and monitoring of such processes.\n\nExperience with diagnosing issues using failure analysis techniques and equipment, researching, and recommending solutions.\n\nExperiencewith,profilometry,surface and bulk analytical methods relevant to characterization of thin films (e.g.XPS, XRD, EDX).\n\nStrong statistical analysis and data mining capabilities with tools like JMP and Excel.\n\nStrong and independent problem‑solving skills.\n\nExcellent written and verbal communication skills and ability to work as a team player in a fast-paced environment.\n\nSelf‑motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as writing technical specifications and procedures.\n\nPreferred qualifications:\n\nExperience with technology transfer from R&D into manufacturing\n\nFamiliarity with quantum subsystems and hardware infrastructure preferred.\n\nSix sigma or statistical process control training\n\nCompensation and Location:\nBased in the Greater Albuquerque, New Mexico\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T03:59:51.286Z","dateModified":"2026-07-16T03:59:51.286Z","hiringOrganization":{"@type":"Organization","name":"Elevatequantum","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Albuquerque","addressRegion":"NM","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"93ec3cfeeef9461f11a522e5"},"url":"https://jobsearcher.com/jobs/93ec3cfeeef9461f11a522e5"}}