{"schemaVersion":"jobsearcher.job.v1","id":"922c4ac042cd5c459583600a","url":"https://jobsearcher.com/jobs/922c4ac042cd5c459583600a","canonicalUrl":"https://jobsearcher.com/jobs/922c4ac042cd5c459583600a","title":"Advanced Packaging, Distinguished Architect","description":"Date posted08/27/2026Category Engineering\r\nHire Type Employee\r\nJob ID 18426\r\nBase Salary Range $218000-$328000\r\nRemote Eligible Yes\r\nDate Posted 08/27/2026Distinguished Engineer, Advanced Packaging Solutions\r\nWe Are\r\nSynopsys delivers silicon-to-systems design solutions that help engineering teams build the next generation of AI-powered products. Our software, IP, simulation, and analysis platforms enable customers to solve complex design challenges across semiconductors, systems, and advanced packaging.\r\nYou Are\r\nYou have spent your career near the physical limits of semiconductor design, where architecture, manufacturability, and performance intersect. You understand that advanced packaging is now part of system architecture, not a downstream implementation step.\r\nYou think deeply about algorithms and data structures, but you have also shipped production software that real design teams depend on. At Synopsys, you will help shape package substrate design automation within 3DIC Compiler, enabling advanced multi-die systems for AI, high-performance computing, and heterogeneous integration.\r\nWhat You'll Be Doing\r\nArchitect and drive package substrate design automation capabilities within the 3DIC Compiler platform.\r\nDesign and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.\r\nBuild scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.\r\nPartner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.\r\nLead architecture reviews and influence technical decisions across the 3DIC product portfolio.\r\nMentor engineers and raise the bar on algorithmic rigor, performance, and software quality.\r\nThe Impact You Will Have\r\nDefine capabilities that enable next-generation advanced packaging designs for AI, high-performance computing, and other complex systems.\r\nReduce design cycle time for customers working on HDI substrates, chiplets, and multi-die architectures.\r\nDrive algorithmic advances in auto-routing, power delivery, and design for manufacturability.\r\nShape a strategic Synopsys product line used by leading semiconductor companies.\r\nWhat You'll Need\r\nDeep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.\r\nProven experience building production software products at scale.\r\nStrong algorithmic foundation for physical design automation challenges.\r\nExpert-level C/C++ skills for performance-critical, large-scale systems.\r\nExperience in at least one related domain: custom IC design automation, auto-routing, physical verification, or substrate design tools.\r\nAdvanced degree in Computer Science, Electrical Engineering, or equivalent hands-on R&D experience.\r\nTrack record of technical leadership through architecture ownership, product influence, publications, or patents.\r\nHow You Think and Build\r\nYou see advanced packaging as a systems problem across substrate architecture, connectivity, signal and power integrity, thermal behavior, manufacturability, and tool performance.\r\nYou thrive in ambiguous technical problems where strong product judgment matters as much as algorithmic depth.\r\nYou translate customer pain into scalable software architecture.\r\nYou challenge assumptions with clarity, data, and respect.\r\nYou care about engineering craft: performance, maintainability, testability, and extensibility.\r\nWhy This Role Is Different\r\nThis is a chance to help define how engineering teams design, analyze, and sign off the next generation of multi-die systems. As AI, high-performance computing, and heterogeneous integration push beyond monolithic scaling, package architecture is becoming a primary driver of system performance.\r\nYou will have the technical latitude to build from first principles: smarter substrate automation, scalable routing, tighter analysis integration, and workflows that make advanced multi-die architecture practical for real design teams. For an engineer who wants to build rather than maintain, this role offers a visible imprint on a major transition in semiconductor design.\r\nThe Team You'll Be Part Of\r\nYou will be a key technical leader on the advanced packaging design automation team for 3DIC Compiler. The team is focused on package substrate design and the industry shift toward chiplet architectures and heterogeneous integration. Your work will directly shape the product roadmap and technical direction of a strategic Synopsys growth area.\r\nRewards and Benefits\r\nSynopsys offers health, wellness, and financial benefits, including monetary and non-monetary rewards. Your recruiter will share compensation and benefits details during the hiring process.\r\n#LI-MK1\r\nAt Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.\r\nIn addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.","company":"Synopsys","rawCompany":"synopsys","city":"Mountain View","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-09-25T01:26:06.936Z","occupations":[{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"541512","title":"Computer Systems Design Services","slug":"computer-systems-design-services"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"513210","title":"Software Publishers","slug":"software-publishers"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Advanced Packaging, Distinguished Architect","description":"Date posted08/27/2026Category Engineering\r\nHire Type Employee\r\nJob ID 18426\r\nBase Salary Range $218000-$328000\r\nRemote Eligible Yes\r\nDate Posted 08/27/2026Distinguished Engineer, Advanced Packaging Solutions\r\nWe Are\r\nSynopsys delivers silicon-to-systems design solutions that help engineering teams build the next generation of AI-powered products. Our software, IP, simulation, and analysis platforms enable customers to solve complex design challenges across semiconductors, systems, and advanced packaging.\r\nYou Are\r\nYou have spent your career near the physical limits of semiconductor design, where architecture, manufacturability, and performance intersect. You understand that advanced packaging is now part of system architecture, not a downstream implementation step.\r\nYou think deeply about algorithms and data structures, but you have also shipped production software that real design teams depend on. At Synopsys, you will help shape package substrate design automation within 3DIC Compiler, enabling advanced multi-die systems for AI, high-performance computing, and heterogeneous integration.\r\nWhat You'll Be Doing\r\nArchitect and drive package substrate design automation capabilities within the 3DIC Compiler platform.\r\nDesign and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.\r\nBuild scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.\r\nPartner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.\r\nLead architecture reviews and influence technical decisions across the 3DIC product portfolio.\r\nMentor engineers and raise the bar on algorithmic rigor, performance, and software quality.\r\nThe Impact You Will Have\r\nDefine capabilities that enable next-generation advanced packaging designs for AI, high-performance computing, and other complex systems.\r\nReduce design cycle time for customers working on HDI substrates, chiplets, and multi-die architectures.\r\nDrive algorithmic advances in auto-routing, power delivery, and design for manufacturability.\r\nShape a strategic Synopsys product line used by leading semiconductor companies.\r\nWhat You'll Need\r\nDeep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.\r\nProven experience building production software products at scale.\r\nStrong algorithmic foundation for physical design automation challenges.\r\nExpert-level C/C++ skills for performance-critical, large-scale systems.\r\nExperience in at least one related domain: custom IC design automation, auto-routing, physical verification, or substrate design tools.\r\nAdvanced degree in Computer Science, Electrical Engineering, or equivalent hands-on R&D experience.\r\nTrack record of technical leadership through architecture ownership, product influence, publications, or patents.\r\nHow You Think and Build\r\nYou see advanced packaging as a systems problem across substrate architecture, connectivity, signal and power integrity, thermal behavior, manufacturability, and tool performance.\r\nYou thrive in ambiguous technical problems where strong product judgment matters as much as algorithmic depth.\r\nYou translate customer pain into scalable software architecture.\r\nYou challenge assumptions with clarity, data, and respect.\r\nYou care about engineering craft: performance, maintainability, testability, and extensibility.\r\nWhy This Role Is Different\r\nThis is a chance to help define how engineering teams design, analyze, and sign off the next generation of multi-die systems. As AI, high-performance computing, and heterogeneous integration push beyond monolithic scaling, package architecture is becoming a primary driver of system performance.\r\nYou will have the technical latitude to build from first principles: smarter substrate automation, scalable routing, tighter analysis integration, and workflows that make advanced multi-die architecture practical for real design teams. For an engineer who wants to build rather than maintain, this role offers a visible imprint on a major transition in semiconductor design.\r\nThe Team You'll Be Part Of\r\nYou will be a key technical leader on the advanced packaging design automation team for 3DIC Compiler. The team is focused on package substrate design and the industry shift toward chiplet architectures and heterogeneous integration. Your work will directly shape the product roadmap and technical direction of a strategic Synopsys growth area.\r\nRewards and Benefits\r\nSynopsys offers health, wellness, and financial benefits, including monetary and non-monetary rewards. Your recruiter will share compensation and benefits details during the hiring process.\r\n#LI-MK1\r\nAt Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.\r\nIn addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.","datePosted":"2026-09-25T01:26:06.936Z","dateModified":"2026-09-25T01:26:06.936Z","hiringOrganization":{"@type":"Organization","name":"Synopsys","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Mountain View","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"922c4ac042cd5c459583600a"},"url":"https://jobsearcher.com/jobs/922c4ac042cd5c459583600a"}}