{"schemaVersion":"jobsearcher.job.v1","id":"8ccff37de2815ee58643b9bd","url":"https://jobsearcher.com/jobs/8ccff37de2815ee58643b9bd","canonicalUrl":"https://jobsearcher.com/jobs/8ccff37de2815ee58643b9bd","title":"Senior Advanced Packaging Process Integration Engineer","description":"Intel Corporation in Albuquerque, NM seeks a Process Integration Engineer to help drive advanced packaging technology nodes, bridging process modules, device engineering, yield and reliability teams for robust base die solutions.\nThe role requires shaping the roadmap, enabling PRI and technology transfer, and delivering manufacturable processes for high‑volume production on site in the US. Competitive compensation includes stock bonuses and benefits.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Rio Rancho","state":"NM","isRemote":false,"isActive":false,"createdAt":"2026-07-22T03:27:26.433Z","occupations":[{"code":"53-7064.00","title":"Packers and Packagers, Hand","slug":"packers-and-packagers-hand"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"}],"industries":[{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior Advanced Packaging Process Integration Engineer","description":"Intel Corporation in Albuquerque, NM seeks a Process Integration Engineer to help drive advanced packaging technology nodes, bridging process modules, device engineering, yield and reliability teams for robust base die solutions.\nThe role requires shaping the roadmap, enabling PRI and technology transfer, and delivering manufacturable processes for high‑volume production on site in the US. Competitive compensation includes stock bonuses and benefits.\n\n#J-18808-Ljbffr","datePosted":"2026-07-22T03:27:26.433Z","dateModified":"2026-07-22T03:27:26.433Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Rio Rancho","addressRegion":"NM","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"8ccff37de2815ee58643b9bd"},"url":"https://jobsearcher.com/jobs/8ccff37de2815ee58643b9bd"}}