{"schemaVersion":"jobsearcher.job.v1","id":"89bda0bdc0ca5dc2f8466279","url":"https://jobsearcher.com/jobs/89bda0bdc0ca5dc2f8466279","canonicalUrl":"https://jobsearcher.com/jobs/89bda0bdc0ca5dc2f8466279","title":"Process Integration Engineer","description":"Location: Alhambra, CA (Onsite)\nPosition Summary: The Process Integration Engineer – InP Wafer Fab position is responsible for end-to-end ownership of Indium Phosphide ( InP ) wafer fabrication process flows supporting the manufacturing of DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip (GC) products. This role serves as the technical integrator across all wafer fab process modules, ensuring compatibility, robustness, and high-yield performance of the complete device fabrication flow . The position focuses on cross-module coordination, yield analysis, failure analysis, and root-cause resolution to enable stable manufacturing operations and successful new product introduction. The role requires strong systems-level understanding of InP device fabrication, data-driven problem solving, and close collaboration with process, device, reliability, and manufacturing teams.\n\nResponsibilities :\nEnd-to-End Process Flow Ownership and Integration (35%) :\nOwn and manage the complete InP wafer fabrication process flow from epitaxy through backend processing\nEnsure process compatibility and robust integration across lithography, etch, deposition, metallization, and test modules\nDefine and maintain integration requirements including layer interactions, thermal budgets, process margins, and sequence dependencies\nServe as the primary technical owner for process flow integrity and change impact assessment\nYield Analysis, Excursion Response, and Continuous Improvement (25%) :\nLead yield analysis efforts to identify yield limiters, systematic defects, and process interactions\nDrive excursion response activities, including rapid containment, root-cause identification, and corrective action implementation\nAnalyze inline and electrical test data to identify process trends and emerging risks\nPartner with manufacturing and process teams to implement yield improvement and defect reduction initiatives\nFailure Analysis and Root-Cause Resolution (20%) :\nLead and coordinate failure analysis (FA) activities using structured problem-solving methodologies (e.g., 8D, Six Sigma)\nIdentify defect mechanisms and process-induced failure modes through cross-functional investigation\nLeverage FA techniques such as optical inspection, SEM, FIB, SIMS, and electrical analysis (directly or via partners)\nEnsure corrective and preventive actions are implemented and verified for effectiveness\nNew Product Introduction and Technology Support (10%) :\nSupport new product introduction (NPI), process transfers, and technology changes within the InP wafer fab\nEvaluate integration risks associated with new designs , materials, or process changes\nCollaborate with device and design teams to ensure manufacturability and integration robustness\nDocumentation, Process Control, and Manufacturing Support (10%) :\nAuthor and maintain process flows, integration specifications, travelers, and control plans\nDefine requirements for process control monitor structures (PCM/TLM) and ensure implementation in design layouts\nSupport day-to-day manufacturing operations by providing technical guidance and integration expertise\nEnsure documentation accuracy and compliance with internal quality and manufacturing standards\n\nMinimum Qualifications :\nBachelor’s degree or higher in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field required\nMinimum of 5+ years of experience in semiconductor process integration or device fabrication\nStrong hands-on understanding of InP -based or III-V compound semiconductor wafer fabrication processes\nDemonstrated experience with yield analysis, defect reduction, and root-cause methodologies\nExperience working across multiple wafer fab process modules in a manufacturing environment\nStrong systems-level understanding of semiconductor device fabrication and process interactions\nProficiency in data analysis and statistical process control (SPC)\nAbility to drive alignment and decision-making across cross-functional engineering teams\nPreferred experience with DFB lasers, SOAs, gain chips, or photonic device manufacturing\nFamiliarity with reliability testing, qualification flows, and product lifecycle support preferred\nExperience supporting high-mix, low-volume manufacturing environments preferred\n\nThe intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.\n\nAll duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.\n\nA reasonable estimate of the pay range for this position is $93,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.\n#LI-Onsite","company":"Semtech","rawCompany":"semtech","city":"Alhambra","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-04-12T18:43:52.888Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2112.00","title":"Industrial Engineers","slug":"industrial-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Process Integration Engineer","description":"Location: Alhambra, CA (Onsite)\nPosition Summary: The Process Integration Engineer – InP Wafer Fab position is responsible for end-to-end ownership of Indium Phosphide ( InP ) wafer fabrication process flows supporting the manufacturing of DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip (GC) products. This role serves as the technical integrator across all wafer fab process modules, ensuring compatibility, robustness, and high-yield performance of the complete device fabrication flow . The position focuses on cross-module coordination, yield analysis, failure analysis, and root-cause resolution to enable stable manufacturing operations and successful new product introduction. The role requires strong systems-level understanding of InP device fabrication, data-driven problem solving, and close collaboration with process, device, reliability, and manufacturing teams.\n\nResponsibilities :\nEnd-to-End Process Flow Ownership and Integration (35%) :\nOwn and manage the complete InP wafer fabrication process flow from epitaxy through backend processing\nEnsure process compatibility and robust integration across lithography, etch, deposition, metallization, and test modules\nDefine and maintain integration requirements including layer interactions, thermal budgets, process margins, and sequence dependencies\nServe as the primary technical owner for process flow integrity and change impact assessment\nYield Analysis, Excursion Response, and Continuous Improvement (25%) :\nLead yield analysis efforts to identify yield limiters, systematic defects, and process interactions\nDrive excursion response activities, including rapid containment, root-cause identification, and corrective action implementation\nAnalyze inline and electrical test data to identify process trends and emerging risks\nPartner with manufacturing and process teams to implement yield improvement and defect reduction initiatives\nFailure Analysis and Root-Cause Resolution (20%) :\nLead and coordinate failure analysis (FA) activities using structured problem-solving methodologies (e.g., 8D, Six Sigma)\nIdentify defect mechanisms and process-induced failure modes through cross-functional investigation\nLeverage FA techniques such as optical inspection, SEM, FIB, SIMS, and electrical analysis (directly or via partners)\nEnsure corrective and preventive actions are implemented and verified for effectiveness\nNew Product Introduction and Technology Support (10%) :\nSupport new product introduction (NPI), process transfers, and technology changes within the InP wafer fab\nEvaluate integration risks associated with new designs , materials, or process changes\nCollaborate with device and design teams to ensure manufacturability and integration robustness\nDocumentation, Process Control, and Manufacturing Support (10%) :\nAuthor and maintain process flows, integration specifications, travelers, and control plans\nDefine requirements for process control monitor structures (PCM/TLM) and ensure implementation in design layouts\nSupport day-to-day manufacturing operations by providing technical guidance and integration expertise\nEnsure documentation accuracy and compliance with internal quality and manufacturing standards\n\nMinimum Qualifications :\nBachelor’s degree or higher in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field required\nMinimum of 5+ years of experience in semiconductor process integration or device fabrication\nStrong hands-on understanding of InP -based or III-V compound semiconductor wafer fabrication processes\nDemonstrated experience with yield analysis, defect reduction, and root-cause methodologies\nExperience working across multiple wafer fab process modules in a manufacturing environment\nStrong systems-level understanding of semiconductor device fabrication and process interactions\nProficiency in data analysis and statistical process control (SPC)\nAbility to drive alignment and decision-making across cross-functional engineering teams\nPreferred experience with DFB lasers, SOAs, gain chips, or photonic device manufacturing\nFamiliarity with reliability testing, qualification flows, and product lifecycle support preferred\nExperience supporting high-mix, low-volume manufacturing environments preferred\n\nThe intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.\n\nAll duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.\n\nA reasonable estimate of the pay range for this position is $93,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.\n#LI-Onsite","datePosted":"2026-04-12T18:43:52.888Z","dateModified":"2026-04-12T18:43:52.888Z","hiringOrganization":{"@type":"Organization","name":"Semtech","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Alhambra","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"89bda0bdc0ca5dc2f8466279"},"url":"https://jobsearcher.com/jobs/89bda0bdc0ca5dc2f8466279"}}