{"schemaVersion":"jobsearcher.job.v1","id":"84dfa27e18589334058d1372","url":"https://jobsearcher.com/jobs/84dfa27e18589334058d1372","canonicalUrl":"https://jobsearcher.com/jobs/84dfa27e18589334058d1372","title":"Senior Packaging Module Development Engineer","description":"Job Overview As a Senior Packaging Module Development Engineer, you will play a pivotal role in shaping Intel's product packaging solutions to ensure the safe and efficient transport, display, and delivery of Intel products worldwide. Your expertise will drive innovation and sustainability in packaging design, enabling Intel to meet business objectives while exceeding customer expectations. You will collaborate with cross‑functional teams to contribute directly to Intel’s success, enabling seamless product launches, improving packaging supply chains, and influencing sustainability practices.\nKey Responsibilities Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.\nLead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.\nCollaborate with manufacturing, logistics, regulatory, and supply‑chain partners to ensure packaging solutions meet operational needs.\nIdentify and implement cost‑saving, waste‑reduction, and efficiency improvement measures for packaging processes.\nConduct risk analysis to ensure packaging solutions comply with regulations and align with Intel’s quality standards.\nConsult with cross‑organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel’s distribution channel.\nEvaluate and qualify vendors to ensure high‑quality packaging manufacturing startup and scalability.\nBenchmark packaging designs and processes against industry standards to maintain a competitive edge.\nDocument and maintain technical specifications for packaging solutions to ensure consistency and clarity.\nBehavioral Traits Effective communication skills to collaborate with cross‑organizational teams, external vendors, and customers.\nExperience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.\nA track record of delivering results in time‑critical technical projects involving innovation and strategic planning.\nApply problem‑solving techniques and fundamental engineering concepts to create novel, efficient solutions.\nStrong data analysis skills.\nQualifications Minimum Qualifications: Master’s degree in Engineering, Physics, Chemistry, or a related STEM field with 4+ years of educational or work experience, or a PhD with 2+ years of experience.\nExperience in product packaging assembly processes and production methodologies.\nKnowledge of statistical process control (SPC) principles and design of experiments (DOE) techniques.\nAnalytical skills with proficiency in data analysis and risk assessment methods.\nDesign for manufacturing (DFM) practices and packaging test criteria.\n\nPreferred Qualifications: Prior experience with solder joint quality assessment.\nExperience with surface‑mount technologies, solder joint formation/quality/reliability, and package certification methodologies.\nPassion for engineering excellence and sustainability.\n\nLocation & Work Model Primary Location: US, Arizona, Phoenix\nShift: Shift1 (United States of America)\nWork Model: This role requires on‑site presence. The role may be performed in other locations if needed.\nCompensation Annual Salary Range:$155,520.00–219,550.00USD\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Chandler","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-06-17T04:11:40.527Z","occupations":[{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior Packaging Module Development Engineer","description":"Job Overview As a Senior Packaging Module Development Engineer, you will play a pivotal role in shaping Intel's product packaging solutions to ensure the safe and efficient transport, display, and delivery of Intel products worldwide. Your expertise will drive innovation and sustainability in packaging design, enabling Intel to meet business objectives while exceeding customer expectations. You will collaborate with cross‑functional teams to contribute directly to Intel’s success, enabling seamless product launches, improving packaging supply chains, and influencing sustainability practices.\nKey Responsibilities Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.\nLead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.\nCollaborate with manufacturing, logistics, regulatory, and supply‑chain partners to ensure packaging solutions meet operational needs.\nIdentify and implement cost‑saving, waste‑reduction, and efficiency improvement measures for packaging processes.\nConduct risk analysis to ensure packaging solutions comply with regulations and align with Intel’s quality standards.\nConsult with cross‑organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel’s distribution channel.\nEvaluate and qualify vendors to ensure high‑quality packaging manufacturing startup and scalability.\nBenchmark packaging designs and processes against industry standards to maintain a competitive edge.\nDocument and maintain technical specifications for packaging solutions to ensure consistency and clarity.\nBehavioral Traits Effective communication skills to collaborate with cross‑organizational teams, external vendors, and customers.\nExperience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.\nA track record of delivering results in time‑critical technical projects involving innovation and strategic planning.\nApply problem‑solving techniques and fundamental engineering concepts to create novel, efficient solutions.\nStrong data analysis skills.\nQualifications Minimum Qualifications: Master’s degree in Engineering, Physics, Chemistry, or a related STEM field with 4+ years of educational or work experience, or a PhD with 2+ years of experience.\nExperience in product packaging assembly processes and production methodologies.\nKnowledge of statistical process control (SPC) principles and design of experiments (DOE) techniques.\nAnalytical skills with proficiency in data analysis and risk assessment methods.\nDesign for manufacturing (DFM) practices and packaging test criteria.\n\nPreferred Qualifications: Prior experience with solder joint quality assessment.\nExperience with surface‑mount technologies, solder joint formation/quality/reliability, and package certification methodologies.\nPassion for engineering excellence and sustainability.\n\nLocation & Work Model Primary Location: US, Arizona, Phoenix\nShift: Shift1 (United States of America)\nWork Model: This role requires on‑site presence. The role may be performed in other locations if needed.\nCompensation Annual Salary Range:$155,520.00–219,550.00USD\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T04:11:40.527Z","dateModified":"2026-06-17T04:11:40.527Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Chandler","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"84dfa27e18589334058d1372"},"url":"https://jobsearcher.com/jobs/84dfa27e18589334058d1372"}}