{"schemaVersion":"jobsearcher.job.v1","id":"844eb4aecfa206dc019be73a","url":"https://jobsearcher.com/jobs/844eb4aecfa206dc019be73a","canonicalUrl":"https://jobsearcher.com/jobs/844eb4aecfa206dc019be73a","title":"Associate Optical Packaging Engineer","description":"Associate Optical Packaging EngineerLocation: Milpitas, California, United StatesJob Type: Full-Time, Entry Level, OnsiteResponsibilities:Build fiber-to-chip optical packages and photonic chip assemblies in a hands-on manufacturing environmentSupport development and optimization of optical packaging and active alignment processes for photonic componentsAssist in process characterization including optical alignment, adhesive curing, and performance evaluationConduct experiments and collect data to improve optical coupling efficiency, yield, and process stabilitySupport New Product Introduction (NPI) activities including process development and production readinessTroubleshoot manufacturing and reliability issues using structured problem-solving methodsDevelop and maintain process documentation including work instructions, process flows, and control plansCollaborate with design, manufacturing, test, and reliability teams on packaging improvementsSupport equipment setup, calibration, qualification, and maintenance for optical assembly systemsWork with vendors and internal teams to evaluate materials and tooling improvementsAnalyze metrology and process data to identify yield and quality improvement opportunitiesQualifications:Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing (internships included)Understanding of optical alignment, fiber optics, and optical measurement techniquesExperience with precision assembly systems or semiconductor manufacturing toolsHands-on lab or manufacturing experience with metrology and assembly processesStrong communication and collaboration skillsProblem-solving ability in fast-paced engineering environmentsPreferred:Familiarity with photonic integrated circuit (PIC) packaging or optical module assemblyExperience with data analysis tools such as Excel, MATLAB, JMP, or PythonUnderstanding of statistical process control (SPC), DOE, or yield analysis conceptsExposure to automated manufacturing or semiconductor assembly systemsBenefits and Compensation:Base salary range: $85,000 to $120,000 (U.S.), or $115,000 to $130,000 (Bay Area) depending on experienceEquity eligibility as part of total compensation packageComprehensive employee benefits (healthcare, medical, dental, vision, and mental health support)Opportunity to work on large-scale fault-tolerant photonic quantum computing systemsExposure to advanced semiconductor manufacturing and optical packaging technologiesCareer growth in a cutting-edge quantum hardware environmentOther Information:PsiQuantum focuses on building large-scale, fault-tolerant quantum computers using silicon photonicsRole involves hands-on engineering and lab-based work in optical packaging and assemblyCandidates must complete application requirements including cover letter and eligibility questionsEqual employment opportunity employer committed to diversity and inclusionApplicants are advised to apply only through official PsiQuantum channels","company":"Quantum Usa","rawCompany":"quantum usa","city":"Milpitas","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-10-17T14:00:53.764Z","occupations":[{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"},{"code":"17-3029.08","title":"Photonics Technicians","slug":"photonics-technicians"},{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"335921","title":"Fiber Optic Cable Manufacturing","slug":"fiber-optic-cable-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Associate Optical Packaging Engineer","description":"Associate Optical Packaging EngineerLocation: Milpitas, California, United StatesJob Type: Full-Time, Entry Level, OnsiteResponsibilities:Build fiber-to-chip optical packages and photonic chip assemblies in a hands-on manufacturing environmentSupport development and optimization of optical packaging and active alignment processes for photonic componentsAssist in process characterization including optical alignment, adhesive curing, and performance evaluationConduct experiments and collect data to improve optical coupling efficiency, yield, and process stabilitySupport New Product Introduction (NPI) activities including process development and production readinessTroubleshoot manufacturing and reliability issues using structured problem-solving methodsDevelop and maintain process documentation including work instructions, process flows, and control plansCollaborate with design, manufacturing, test, and reliability teams on packaging improvementsSupport equipment setup, calibration, qualification, and maintenance for optical assembly systemsWork with vendors and internal teams to evaluate materials and tooling improvementsAnalyze metrology and process data to identify yield and quality improvement opportunitiesQualifications:Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing (internships included)Understanding of optical alignment, fiber optics, and optical measurement techniquesExperience with precision assembly systems or semiconductor manufacturing toolsHands-on lab or manufacturing experience with metrology and assembly processesStrong communication and collaboration skillsProblem-solving ability in fast-paced engineering environmentsPreferred:Familiarity with photonic integrated circuit (PIC) packaging or optical module assemblyExperience with data analysis tools such as Excel, MATLAB, JMP, or PythonUnderstanding of statistical process control (SPC), DOE, or yield analysis conceptsExposure to automated manufacturing or semiconductor assembly systemsBenefits and Compensation:Base salary range: $85,000 to $120,000 (U.S.), or $115,000 to $130,000 (Bay Area) depending on experienceEquity eligibility as part of total compensation packageComprehensive employee benefits (healthcare, medical, dental, vision, and mental health support)Opportunity to work on large-scale fault-tolerant photonic quantum computing systemsExposure to advanced semiconductor manufacturing and optical packaging technologiesCareer 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