{"schemaVersion":"jobsearcher.job.v1","id":"83b9481e4e8784832cf0717e","url":"https://jobsearcher.com/jobs/83b9481e4e8784832cf0717e","canonicalUrl":"https://jobsearcher.com/jobs/83b9481e4e8784832cf0717e","title":"Principal Characterization-Failure Analysis Engineer","description":"Job Summary\nThe Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus.\n\nResponsibilities\n\nExperienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.\n\nExperienced with failure mode and effects analysis (FMEA).\n\nExperienced in data processing tools such as Python, MATLAB, and JMP.\n\nFamiliarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.\n\nExposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).\n\nCharacterization experience in mechanical vibrations, thermography, and mechanical load testers.\n\nDemonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.\n\nGood team worker and brings in a positive attitude and is always ready to help others.\n\nExperience & Qualifications\n\nMaster's degree or higher in an applicable engineering discipline, such as Electrical Engineering, Mechanical Engineering, Optical Engineering or Applied Physics.\n\n10+ years of experience applying engineering principles to debug complex failure analysis in opto-mechanical assembly process problems.\n\nExcellent written and verbal communication skills; Self-starter.\n\nDemonstrated strong analytical and problem‑solving skills.\n\nAbility to provide technical leadership in ambiguous situations.\n\nEmployee Note\nPsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.\n\nWe are not accepting unsolicited resumes from employment agencies.\n\nCompensation\nBase Salary Range: $165,000 - $200,000 USD (U.S. - non-Bay Area). Bay Area Pay Range: $208,000 - $245,000 USD. Full‑time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.\n\n#J-18808-Ljbffr","company":"Psi Quantum","rawCompany":"psi quantum","city":"Milpitas","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-07-16T03:25:20.968Z","occupations":[{"code":"19-2012.00","title":"Physicists","slug":"physicists"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Principal Characterization-Failure Analysis Engineer","description":"Job Summary\nThe Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus.\n\nResponsibilities\n\nExperienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.\n\nExperienced with failure mode and effects analysis (FMEA).\n\nExperienced in data processing tools such as Python, MATLAB, and JMP.\n\nFamiliarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.\n\nExposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).\n\nCharacterization experience in mechanical vibrations, thermography, and mechanical load testers.\n\nDemonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.\n\nGood team worker and brings in a positive attitude and is always ready to help others.\n\nExperience & Qualifications\n\nMaster's degree or higher in an applicable engineering discipline, such as Electrical Engineering, Mechanical Engineering, Optical Engineering or Applied Physics.\n\n10+ years of experience applying engineering principles to debug complex failure analysis in opto-mechanical assembly process problems.\n\nExcellent written and verbal communication skills; Self-starter.\n\nDemonstrated strong analytical and problem‑solving skills.\n\nAbility to provide technical leadership in ambiguous situations.\n\nEmployee Note\nPsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.\n\nWe are not accepting unsolicited resumes from employment agencies.\n\nCompensation\nBase Salary Range: $165,000 - $200,000 USD (U.S. - non-Bay Area). Bay Area Pay Range: $208,000 - $245,000 USD. Full‑time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T03:25:20.968Z","dateModified":"2026-07-16T03:25:20.968Z","hiringOrganization":{"@type":"Organization","name":"Psi Quantum","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Milpitas","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"83b9481e4e8784832cf0717e"},"url":"https://jobsearcher.com/jobs/83b9481e4e8784832cf0717e"}}