{"schemaVersion":"jobsearcher.job.v1","id":"7e8c393c0d2da0dcc9e2d1b3","url":"https://jobsearcher.com/jobs/7e8c393c0d2da0dcc9e2d1b3","canonicalUrl":"https://jobsearcher.com/jobs/7e8c393c0d2da0dcc9e2d1b3","title":"Packaging Module Development Engineer","description":"Job Details:\nThe Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.\n\nJob Description:\nThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:\n\nDeveloping First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms.\n\nCollaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.\n\nInnovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale.\n\nManaging equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing.\n\nManaging projects to meet product development timelines.\n\nApplying formal education and judgment to solve technical problems.\n\nProviding sustaining support for equipment performance and process health in high-volume manufacturing.\n\nResponding promptly to foundry customer requests and events.\n\nThe ideal candidate will demonstrate:\n\nTechnical leadership, strategic planning, and critical thinking.\n\nAbility to coach and develop technical teams.\n\nTolerance for ambiguity and adaptability in a dynamic environment.\n\nFlexibility in managing changing priorities and responsibilities.\n\nExperience leading teams in a highly matrixed organization.\n\nInitiative and ability to work independently.\n\nStrong communication, influencing, technical, and analytical skills.\n\nThis position requires regular onsite presence.\n\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.\n\nMinimum Qualifications\n\nPhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR\n\nMaster’s degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.\n\nCandidates who are within four (4) months of completing the required degree are eligible to apply.\n\nMinimum 1+ years of experience in the following:\n\nMechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments.\n\nStrong experimental background, including hands-on laboratory or prototype development experience.\n\nAt least one first-author publication in a peer-reviewed technical journal for PhD candidates.\n\nPosting Statement\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\n\nAnnual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD\n\n#J-18808-Ljbffr","company":"Dormont Manufacturing Company","rawCompany":"dormont manufacturing company","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-05T03:35:35.360Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Module Development Engineer","description":"Job Details:\nThe Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.\n\nJob Description:\nThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:\n\nDeveloping First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms.\n\nCollaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.\n\nInnovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale.\n\nManaging equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing.\n\nManaging projects to meet product development timelines.\n\nApplying formal education and judgment to solve technical problems.\n\nProviding sustaining support for equipment performance and process health in high-volume manufacturing.\n\nResponding promptly to foundry customer requests and events.\n\nThe ideal candidate will demonstrate:\n\nTechnical leadership, strategic planning, and critical thinking.\n\nAbility to coach and develop technical teams.\n\nTolerance for ambiguity and adaptability in a dynamic environment.\n\nFlexibility in managing changing priorities and responsibilities.\n\nExperience leading teams in a highly matrixed organization.\n\nInitiative and ability to work independently.\n\nStrong communication, influencing, technical, and analytical skills.\n\nThis position requires regular onsite presence.\n\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.\n\nMinimum Qualifications\n\nPhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR\n\nMaster’s degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.\n\nCandidates who are within four (4) months of completing the required degree are eligible to apply.\n\nMinimum 1+ years of experience in the following:\n\nMechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments.\n\nStrong experimental background, including hands-on laboratory or prototype development experience.\n\nAt least one first-author publication in a peer-reviewed technical journal for PhD candidates.\n\nPosting Statement\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\nBenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\n\nAnnual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD\n\n#J-18808-Ljbffr","datePosted":"2026-07-05T03:35:35.360Z","dateModified":"2026-07-05T03:35:35.360Z","hiringOrganization":{"@type":"Organization","name":"Dormont Manufacturing Company","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"7e8c393c0d2da0dcc9e2d1b3"},"url":"https://jobsearcher.com/jobs/7e8c393c0d2da0dcc9e2d1b3"}}