{"schemaVersion":"jobsearcher.job.v1","id":"7ce27fc563c579ebb5dfc898","url":"https://jobsearcher.com/jobs/7ce27fc563c579ebb5dfc898","canonicalUrl":"https://jobsearcher.com/jobs/7ce27fc563c579ebb5dfc898","title":"Chip Packaging Design Engineer","description":"· 5+ years’ experience completing layouts of high pin count, multi-layer organic build-up packages using Cadence APD and SiP package design tools.\n· Creating die and BGA symbols from scratch or from spreadsheet inputs\n· Setting up design environment, including tech files, stack ups, and constraints\n· Setting up Constraint Manager from scratch for complex packages (diff pair creation, multiple power supplies, net and zone specific constraints.\n· Routing signals and matching length both manually and using tool features\n· Design file management and documentation from initiation to final signoff\n· Generation of POD\n· Solid knowledge of top package suppliers design rules and basic manufacturing practices\nJob Type: Full-time\nPay: $59,288.21 - $153,964.46 per year\nSchedule:\n8 hour shift\nDay shift\nAbility to commute/relocate:\nMountain View, CA 94035: Reliably commute or planning to relocate before starting work (Required)\nWork Location: In person","company":"Xiar Tech","rawCompany":"xiar tech","city":"Mountain View","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-08-03T12:08:22.023Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Chip Packaging Design Engineer","description":"· 5+ years’ experience completing layouts of high pin count, multi-layer organic build-up packages using Cadence APD and SiP package design tools.\n· Creating die and BGA symbols from scratch or from spreadsheet inputs\n· Setting up design environment, including tech files, stack ups, and constraints\n· Setting up Constraint Manager from scratch for complex packages (diff pair creation, multiple power supplies, net and zone specific constraints.\n· Routing signals and matching length both manually and using tool features\n· Design file management and documentation from initiation to final signoff\n· Generation of POD\n· Solid knowledge of top package suppliers design rules and basic manufacturing practices\nJob Type: Full-time\nPay: $59,288.21 - $153,964.46 per year\nSchedule:\n8 hour shift\nDay shift\nAbility to commute/relocate:\nMountain View, CA 94035: Reliably commute or planning to relocate before starting work (Required)\nWork Location: In person","datePosted":"2026-08-03T12:08:22.023Z","dateModified":"2026-08-03T12:08:22.023Z","hiringOrganization":{"@type":"Organization","name":"Xiar Tech","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Mountain View","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"7ce27fc563c579ebb5dfc898"},"url":"https://jobsearcher.com/jobs/7ce27fc563c579ebb5dfc898"}}