{"schemaVersion":"jobsearcher.job.v1","id":"7a57ff62353af010b86ce499","url":"https://jobsearcher.com/jobs/7a57ff62353af010b86ce499","canonicalUrl":"https://jobsearcher.com/jobs/7a57ff62353af010b86ce499","title":"Process Engineer, Principal","description":"Overview\nIn this Process Engineer role, you will develop and sustain wafer fabrication processes across grinding, polishing, bonding, and related steps in MACOM's internal fab. You will partner with device and integration teams to improve quality, yield, and cost while ensuring safe, efficient operations. The role combines hands-on process work with project ownership and cross-functional collaboration to advance GaN, GaAs, Si, and InP technologies. This is an opportunity to influence manufacturing scale and reliability in a leading RF/semiconductor environment.\n\nCompensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities\nResponsibilitiesDevelop and optimize wafer fabrication processes in collaboration with design teamsSet up, qualify, troubleshoot, and optimize automated equipment for grinding, polishing, CMP, bonding, and mounting/dismountingSustain processes to meet factory metrics; design experiments to characterize processes throughout developmentProvide daily process support including parameter tuning, running engineering lots, and handling non-conforming materialOwn processes end-to-end: equipment selection, qualification, documentation, and training of operators and engineersUpdate routing documentation and procedures as neededApply electronics manufacturing knowledge to maintain process control and improve reliability and safetyMaintain strong hands-on knowledge of wafer fabrication and polishing techniques\nKey requirementsBS in EngineeringMinimum 8 years in semiconductors/wafer fabricationExperience with compound semiconductor processingFamiliarity with Wafer Grinding, Edge Grinding, CMP, Wafer Bonding, and polishingData mining, SPC, DOE, Lean, Six Sigma experience preferredUS citizenship or permanent residency due to ITARStrong problem-solving, project ownership, and cross-functional collaboration skillsExcellent communication (verbal and written)Strong ownership and proactive mindsetCollaborative teamwork across departmentsWafer grinding, edge grinding, CMP, polishingWafer bonding, mounting/dismountingGlassing and materials handling","company":"Macom","rawCompany":"macom","city":"Somerville","state":"MA","isRemote":false,"isActive":false,"createdAt":"2026-09-15T03:42:02.618Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Process Engineer, Principal","description":"Overview\nIn this Process Engineer role, you will develop and sustain wafer fabrication processes across grinding, polishing, bonding, and related steps in MACOM's internal fab. You will partner with device and integration teams to improve quality, yield, and cost while ensuring safe, efficient operations. The role combines hands-on process work with project ownership and cross-functional collaboration to advance GaN, GaAs, Si, and InP technologies. This is an opportunity to influence manufacturing scale and reliability in a leading RF/semiconductor environment.\n\nCompensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities\nResponsibilitiesDevelop and optimize wafer fabrication processes in collaboration with design teamsSet up, qualify, troubleshoot, and optimize automated equipment for grinding, polishing, CMP, bonding, and mounting/dismountingSustain processes to meet factory metrics; design experiments to characterize processes throughout developmentProvide daily process support including parameter tuning, running engineering lots, and handling non-conforming materialOwn processes end-to-end: equipment selection, qualification, documentation, and training of operators and engineersUpdate routing documentation and procedures as neededApply electronics manufacturing knowledge to maintain process control and improve reliability and safetyMaintain strong hands-on knowledge of wafer fabrication and polishing techniques\nKey requirementsBS in EngineeringMinimum 8 years in semiconductors/wafer fabricationExperience with compound semiconductor processingFamiliarity with Wafer Grinding, Edge Grinding, CMP, Wafer Bonding, and polishingData mining, SPC, DOE, Lean, Six Sigma experience preferredUS citizenship or permanent residency due to ITARStrong problem-solving, project ownership, and cross-functional collaboration skillsExcellent communication (verbal and written)Strong ownership and proactive mindsetCollaborative teamwork across departmentsWafer grinding, edge grinding, CMP, polishingWafer bonding, mounting/dismountingGlassing and materials handling","datePosted":"2026-09-15T03:42:02.618Z","dateModified":"2026-09-15T03:42:02.618Z","hiringOrganization":{"@type":"Organization","name":"Macom","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Somerville","addressRegion":"MA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"7a57ff62353af010b86ce499"},"url":"https://jobsearcher.com/jobs/7a57ff62353af010b86ce499"}}