{"schemaVersion":"jobsearcher.job.v1","id":"76bf2cb48d3c773ec00a8eb9","url":"https://jobsearcher.com/jobs/76bf2cb48d3c773ec00a8eb9","canonicalUrl":"https://jobsearcher.com/jobs/76bf2cb48d3c773ec00a8eb9","title":"Director of Hardware Platform Design","description":"OverviewSeeking a Director of Hardware Platform Design to lead the architecture, design, and execution of advanced hardware packaging platforms from concept through high-volume manufacturing. Own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization.ResponsibilitiesPackage Design Strategy: Own the end-to-end package design strategy, including bump/ball map definition, substrate routing architecture, package stack-up, and material selection. Signal & Power Integrity: Lead high-speed and RF signal integrity (SI) and power integrity (PI) architecture, modeling, simulation, and optimization. Thermal & Mechanical Reliability: Direct thermal and thermomechanical analysis, stress modeling, and warpage optimization to ensure package reliability throughout product qualification and mass production. Engineering Leadership: Build and lead multidisciplinary teams across SI/PI, package layout, thermal, and mechanical engineering. Production Test: Partner with Test and Product Engineering to develop comprehensive production test methodologies.System Integration: Lead hardware platform integration across package module, PCB, and system levels.QualificationsPh.D. in Electrical Engineering (or related field) with 10+ years of industry experience, or M.S. with 14+ years. Expertise in advanced semiconductor packaging, substrate design, and high-density interconnects. Strong knowledge of SI/PI, thermal analysis, and mechanical reliability. Experience with electromagnetic, SI/PI, and thermal simulation tools. Proven success leading multidisciplinary engineering teams and complex hardware programs from concept through production. Strong leadership, communication, project management, and cross-functional collaboration skills.LocationsSilicon Valley, CA (San Jose metro area)Irvine, CA (Orange County area)","company":"Point2 Technology","rawCompany":"point2 technology","city":"San Jose","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-08-07T08:58:53.826Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Director of Hardware Platform Design","description":"OverviewSeeking a Director of Hardware Platform Design to lead the architecture, design, and execution of advanced hardware packaging platforms from concept through high-volume manufacturing. Own package architecture, SI/PI, thermal and mechanical reliability, production test strategy, and cross-functional hardware integration while building and leading an engineering organization.ResponsibilitiesPackage Design Strategy: Own the end-to-end package design strategy, including bump/ball map definition, substrate routing architecture, package stack-up, and material selection. Signal & Power Integrity: Lead high-speed and RF signal integrity (SI) and power integrity (PI) architecture, modeling, simulation, and optimization. Thermal & Mechanical Reliability: Direct thermal and thermomechanical analysis, stress modeling, and warpage optimization to ensure package reliability throughout product qualification and mass production. Engineering Leadership: Build and lead multidisciplinary teams across SI/PI, package layout, thermal, and mechanical engineering. Production Test: Partner with Test and Product Engineering to develop comprehensive production test methodologies.System Integration: Lead hardware platform integration across package module, PCB, and system levels.QualificationsPh.D. in Electrical Engineering (or related field) with 10+ years of industry experience, or M.S. with 14+ years. Expertise in advanced semiconductor packaging, substrate design, and high-density interconnects. Strong knowledge of SI/PI, thermal analysis, and mechanical reliability. Experience with electromagnetic, SI/PI, and thermal simulation tools. Proven success leading multidisciplinary engineering teams and complex hardware programs from concept through production. Strong leadership, communication, project management, and cross-functional collaboration skills.LocationsSilicon Valley, CA (San Jose metro area)Irvine, CA (Orange County area)","datePosted":"2026-08-07T08:58:53.826Z","dateModified":"2026-08-07T08:58:53.826Z","hiringOrganization":{"@type":"Organization","name":"Point2 Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"San Jose","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"76bf2cb48d3c773ec00a8eb9"},"url":"https://jobsearcher.com/jobs/76bf2cb48d3c773ec00a8eb9"}}