{"schemaVersion":"jobsearcher.job.v1","id":"76aa540ddfdbb3cea5d0e575","url":"https://jobsearcher.com/jobs/76aa540ddfdbb3cea5d0e575","canonicalUrl":"https://jobsearcher.com/jobs/76aa540ddfdbb3cea5d0e575","title":"DRAM Process Integration Engineer - Module Lead","description":"A leading semiconductor company in Boise, Idaho, seeks an expert in semiconductor materials to lead the development of next-generation DRAM technology modules. The candidate will define structural and electrical requirements, optimize process flows, and collaborate cross-functionally to enhance yield and performance. Candidates must hold a Master's degree in a relevant engineering field and possess expertise in semiconductor materials characterization and data analysis. The company offers comprehensive benefits aimed at supporting employee wellbeing and professional growth.\r\nJ-18808-Ljbffr","company":"Micron Technology","rawCompany":"micron technology","city":"Boise","state":"ID","isRemote":false,"isActive":false,"createdAt":"2026-04-24T04:53:26.119Z","occupations":[{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"DRAM Process Integration Engineer - Module Lead","description":"A leading semiconductor company in Boise, Idaho, seeks an expert in semiconductor materials to lead the development of next-generation DRAM technology modules. The candidate will define structural and electrical requirements, optimize process flows, and collaborate cross-functionally to enhance yield and performance. Candidates must hold a Master's degree in a relevant engineering field and possess expertise in semiconductor materials characterization and data analysis. The company offers comprehensive benefits aimed at supporting employee wellbeing and professional growth.\r\nJ-18808-Ljbffr","datePosted":"2026-04-24T04:53:26.119Z","dateModified":"2026-04-24T04:53:26.119Z","hiringOrganization":{"@type":"Organization","name":"Micron Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Boise","addressRegion":"ID","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"76aa540ddfdbb3cea5d0e575"},"url":"https://jobsearcher.com/jobs/76aa540ddfdbb3cea5d0e575"}}