Module Development Engineer

Job Title: Module Development EngineerLocation: Phoenix, Arizona, United StateType: Full TimeOur client is looking for an experienced and innovative Dry Etch Process Engineer to drive next-generation semiconductor manufacturing and technology development. This role plays a critical part in enabling both high-volume production and future device innovations through advanced process engineering and equipment solutions.Key ResponsibilitiesLead the development and optimization of advanced dry etch processes to support cutting-edge semiconductor technologiesDesign and implement sophisticated manufacturing solutions, including material selection, process tuning, and metrology strategyDrive innovation through exploratory research and feasibility analysis for emerging device architecturesCollaborate with cross-functional teams to integrate process solutions that meet performance, yield, and reliability targetsEnhance existing production processes by identifying and implementing efficiency and output improvementsPartner with equipment and materials suppliers to co-develop technologies supporting future manufacturing needsPerform simulation and experimental studies to validate process capabilities and scalabilityStay aligned with industry advancements and contribute to long-term technology roadmapsBasic QualificationsPhD with 4+ years, OR Master’s with 6+ years, OR Bachelor’s with 9+ years of relevant experience in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fieldsStrong hands-on experience in dry etch process development within semiconductor manufacturing environmentsDeep understanding of plasma etching principles, including interaction mechanisms, selectivity control, and defect managementProven track record of improving process performance, yield, or manufacturabilityExpertise in data-driven problem solving using DOE methodologies and tools such as JMP, Python, or MATLABExperience working with semiconductor fabrication tools in a cleanroom environmentPreferred QualificationsExtensive experience developing dry etch solutions for advanced nodes or technology transitionsFamiliarity with advanced etch techniques such as ICP/CCP plasma, ALE, high aspect ratio etching, and isotropic processesExposure to next-generation device architectures (FinFET, GAA, nanosheet) and integration challengesStrong knowledge of metrology and material characterization techniques (SEM, TEM, AFM, XPS, etc.)Demonstrated ability to influence technical direction and mentor junior engineersExperience collaborating across integration, lithography, yield, and equipment teamsContributions to technical innovation through patents, publications, or recognized expertiseWhy This Role?This is an opportunity to be at the forefront of semiconductor innovation, working on technologies that shape the future of computing while collaborating with world-class engineering and supplier ecosystems.