{"schemaVersion":"jobsearcher.job.v1","id":"72d3bf9ef3e18b7e92b1834e","url":"https://jobsearcher.com/jobs/72d3bf9ef3e18b7e92b1834e","canonicalUrl":"https://jobsearcher.com/jobs/72d3bf9ef3e18b7e92b1834e","title":"Semiconductor Packaging Engineer","description":"Job Purpose\r\nWe are seeking a hands-on Semiconductor Packaging Engineer to work for a High-Tech Semiconductor Manufacturer in the Tucson, Area. The Semiconductor Packaging Engineer will ensure stable, robust, repeatable, sustainable and high-yielding manufacturing processes and products are achieved, monitored and maintained and will help to implement a new MES system.\r\nResponsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as design teams. You will be expected to clearly communicate goals, roles, and responsibilities, engage and motivate engineering talent, define and set deliverables, plan resources, and achieve desired results. You will be expected to contribute technically, maintain an optimistic, can-do approach, and present status to executive level management. Excellent judgment, expertise in semiconductor processing, and leadership are essential to success in this role. The position reports to the Process Engineering Manager. Will monitor and control of the process. Improve the process or introduce new process and tools to improve yield, capacity and quality. Work with engineering team to develop new products. Work with engineering team to transfer new products or new process to production and will help to implement a new MES system.\r\nPosition responsibilities include daily oversight of manufacturing operations, continuous improvement of operational processes including scheduling and executing production for Back End Assembly Process. Conducts studies in operations to optimize workflow and space utilization. Ensures facility efficiency and workplace safety.\r\nResponsibilities\r\n\r\nManufacturing monitoring and improvements with SPC.\r\nCreating weekly yield reports using statistical tools.\r\nCreating and maintaining work standards using work measurement, and dynamic and static capacity and cost simulation models.\r\nWorkflow optimization through creating and implementing in-process kanbans models.\r\nWorking with materials manager for supply chain optimization and inventory minimization through creating and implementing raw material kanbans.\r\nDesign of Experiments (DOE) and data analysis to support engineering efforts to improve product design and manufacturability.\r\nPerformance measurement and analysis to monitor and improve manufacturing.\r\nApplying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies.\r\nData analysis and improvements to manufacturing capabilities.\r\nWork with information technology department to improve database structures and collection methods to improve manufacturing.\r\nCost and net worth analysis to evaluate capital expenditures for expansion scenarios.\r\nMaximize space utilization through layout evaluation, design, and improvements, using design software such as AutoCAD, Draftsight.\r\n\r\nDuties\r\n\r\nDevelop and maintain positive working relationships with applicable departments and suppliers to evaluate potential new processes and materials to improve cost, yield, reliability and quality.\r\nDrive identification and implementation of process improvements to increase yield and reduce operating costs.\r\nIdentify new hardware requirements to meet the developing process/customer needs. Ensure these requirements are addressed appropriately with regard to specifications, budget constraints, supplier identification and thorough evaluation.\r\nDevelop, modify and/or continuously improve manufacturing process and procedures to enable higher productivity, reduced scrap, and improved quality.\r\n\r\nSkills/Qualifications:\r\nMust have a B.S. or M.S. Electrical or Mechanical Engineering or related field.\r\nMust have knowledge of process assembly of semiconductor lasers. Communication and managing skills are required.\r\nClean room manufacturing environment, experience working in cleanrooms and labs.\r\nExposure to medium to long-term projects.\r\n3+ years of experience within the semiconductor industry (oven, wire bonding, lead frame design, SMT, reflowing, among other processes).\r\nNew Product Introduction. Strong verbal, written, presentation, analytical and interpersonal skills.\r\nLeadership capabilities to drive and deliver results through motivating cross-cultural teams.\r\nHighly proficient in Excel, Word, Powerpoint and statistical software.\r\nStrong analytical and problem solving ability. Appreciation of both practical and theoretical methodologies.\r\nExperienced in equipment selection, commissioning and process set-up.\r\nKnowledge of troubleshooting guides, working documentation, safety.\r\nKnowledge of quality systems and reliability assessment.\r\nStrong SPC and DOE skill set and experience.\r\nExperience with Lean and 5S programs. Experience with Six Sigma.\r\nDemonstrated success in project management.\r\nDetailed working knowledge of semiconductor wafer fabrication processes, including wet and dry etching, thin films, moderate scale photolithography.\r\nProven track record in program management and technical team leadership.\r\nSelf-motivated with the ability to work both independently and in a team environment\r\nThis position is located in the United States and will require use of information which is subject to the International Traffic in Arms Regulations (ITAR). As such, all applicants must be U.S. persons within the meaning of ITAR. ITAR defines a U.S. person as a U.S. Citizen, U.S. Permanent Resident (i.e. 'Green Card Holder'), Political Asylee, or Refugee.\r\nLeonardo is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability status, protected veteran status, or any other characteristic protected by law.\r\n[NOTE: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.]\r\nHere are the hiring process steps and what you can expect from us\r\nStep 1: Application Review:\r\nUpon submitting your application, it is made available to the recruitment team to review and ensure you meet the basic qualifications.\r\nStep 2: Interview:\r\nIf you have been identified to move forward in the process, you may be invited to participate in a one-on-one or panel interview. The interview format can be a phone call, in-person, or virtual meeting.\r\nStep 3: Offer:\r\nIf you reach this stage of the interview process, congratulations! You will be provided an offer to join the Leonardo Electronics US Inc. team. The offer will include details about your salary, benefits package and start date.","company":"Leonardo","rawCompany":"leonardo","city":"Tucson","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-05-21T07:16:59.466Z","occupations":[{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2112.00","title":"Industrial Engineers","slug":"industrial-engineers"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Semiconductor Packaging Engineer","description":"Job Purpose\r\nWe are seeking a hands-on Semiconductor Packaging Engineer to work for a High-Tech Semiconductor Manufacturer in the Tucson, Area. The Semiconductor Packaging Engineer will ensure stable, robust, repeatable, sustainable and high-yielding manufacturing processes and products are achieved, monitored and maintained and will help to implement a new MES system.\r\nResponsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as design teams. You will be expected to clearly communicate goals, roles, and responsibilities, engage and motivate engineering talent, define and set deliverables, plan resources, and achieve desired results. You will be expected to contribute technically, maintain an optimistic, can-do approach, and present status to executive level management. Excellent judgment, expertise in semiconductor processing, and leadership are essential to success in this role. The position reports to the Process Engineering Manager. Will monitor and control of the process. Improve the process or introduce new process and tools to improve yield, capacity and quality. Work with engineering team to develop new products. Work with engineering team to transfer new products or new process to production and will help to implement a new MES system.\r\nPosition responsibilities include daily oversight of manufacturing operations, continuous improvement of operational processes including scheduling and executing production for Back End Assembly Process. Conducts studies in operations to optimize workflow and space utilization. Ensures facility efficiency and workplace safety.\r\nResponsibilities\r\n\r\nManufacturing monitoring and improvements with SPC.\r\nCreating weekly yield reports using statistical tools.\r\nCreating and maintaining work standards using work measurement, and dynamic and static capacity and cost simulation models.\r\nWorkflow optimization through creating and implementing in-process kanbans models.\r\nWorking with materials manager for supply chain optimization and inventory minimization through creating and implementing raw material kanbans.\r\nDesign of Experiments (DOE) and data analysis to support engineering efforts to improve product design and manufacturability.\r\nPerformance measurement and analysis to monitor and improve manufacturing.\r\nApplying various statistical methods to improve reproducibility and manufacturability through Failure Mode Effect Analysis (FMEA) , Control Plan and Gage R&R studies.\r\nData analysis and improvements to manufacturing capabilities.\r\nWork with information technology department to improve database structures and collection methods to improve manufacturing.\r\nCost and net worth analysis to evaluate capital expenditures for expansion scenarios.\r\nMaximize space utilization through layout evaluation, design, and improvements, using design software such as AutoCAD, Draftsight.\r\n\r\nDuties\r\n\r\nDevelop and maintain positive working relationships with applicable departments and suppliers to evaluate potential new processes and materials to improve cost, yield, reliability and quality.\r\nDrive identification and implementation of process improvements to increase yield and reduce operating costs.\r\nIdentify new hardware requirements to meet the developing process/customer needs. Ensure these requirements are addressed appropriately with regard to specifications, budget constraints, supplier identification and thorough evaluation.\r\nDevelop, modify and/or continuously improve manufacturing process and procedures to enable higher productivity, reduced scrap, and improved quality.\r\n\r\nSkills/Qualifications:\r\nMust have a B.S. or M.S. Electrical or Mechanical Engineering or related field.\r\nMust have knowledge of process assembly of semiconductor lasers. Communication and managing skills are required.\r\nClean room manufacturing environment, experience working in cleanrooms and labs.\r\nExposure to medium to long-term projects.\r\n3+ years of experience within the semiconductor industry (oven, wire bonding, lead frame design, SMT, reflowing, among other processes).\r\nNew Product Introduction. Strong verbal, written, presentation, analytical and interpersonal skills.\r\nLeadership capabilities to drive and deliver results through motivating cross-cultural teams.\r\nHighly proficient in Excel, Word, Powerpoint and statistical software.\r\nStrong analytical and problem solving ability. Appreciation of both practical and theoretical methodologies.\r\nExperienced in equipment selection, commissioning and process set-up.\r\nKnowledge of troubleshooting guides, working documentation, safety.\r\nKnowledge of quality systems and reliability assessment.\r\nStrong SPC and DOE skill set and experience.\r\nExperience with Lean and 5S programs. Experience with Six Sigma.\r\nDemonstrated success in project management.\r\nDetailed working knowledge of semiconductor wafer fabrication processes, including wet and dry etching, thin films, moderate scale photolithography.\r\nProven track record in program management and technical team leadership.\r\nSelf-motivated with the ability to work both independently and in a team environment\r\nThis position is located in the United States and will require use of information which is subject to the International Traffic in Arms Regulations (ITAR). As such, all applicants must be U.S. persons within the meaning of ITAR. ITAR defines a U.S. person as a U.S. Citizen, U.S. Permanent Resident (i.e. 'Green Card Holder'), Political Asylee, or Refugee.\r\nLeonardo is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability status, protected veteran status, or any other characteristic protected by law.\r\n[NOTE: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.]\r\nHere are the hiring process steps and what you can expect from us\r\nStep 1: Application Review:\r\nUpon submitting your application, it is made available to the recruitment team to review and ensure you meet the basic qualifications.\r\nStep 2: Interview:\r\nIf you have been identified to move forward in the process, you may be invited to participate in a one-on-one or panel interview. The interview format can be a phone call, in-person, or virtual meeting.\r\nStep 3: Offer:\r\nIf you reach this stage of the interview process, congratulations! You will be provided an offer to join the Leonardo Electronics US Inc. team. The offer will include details about your salary, benefits package and start date.","datePosted":"2026-05-21T07:16:59.466Z","dateModified":"2026-05-21T07:16:59.466Z","hiringOrganization":{"@type":"Organization","name":"Leonardo","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Tucson","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"72d3bf9ef3e18b7e92b1834e"},"url":"https://jobsearcher.com/jobs/72d3bf9ef3e18b7e92b1834e"}}