{"schemaVersion":"jobsearcher.job.v1","id":"6f62eee5bd8ff6fcc229ad2d","url":"https://jobsearcher.com/jobs/6f62eee5bd8ff6fcc229ad2d","canonicalUrl":"https://jobsearcher.com/jobs/6f62eee5bd8ff6fcc229ad2d","title":"Senior IC Package Layout Engineer 2.5D/3D-IC","description":"Annapurna Labs (U.S.) Inc. within AWS is seeking a Package Layout Design Engineer to advance IC packaging for AI/ML hardware. You will handle floor planning through tape-out, collaborating with SI/PI, thermal, and manufacturing to meet performance targets.\nRole requires hands-on experience with package layout tools and a deep understanding of 2.5D/3D-IC, RDL, TSV, and interposer technologies. Great communication and teamwork are essential.\n\n#J-18808-Ljbffr","company":"Amazon","rawCompany":"amazon","city":"Tempe","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-09-02T03:33:52.736Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"53-7064.00","title":"Packers and Packagers, Hand","slug":"packers-and-packagers-hand"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior IC Package Layout Engineer 2.5D/3D-IC","description":"Annapurna Labs (U.S.) Inc. within AWS is seeking a Package Layout Design Engineer to advance IC packaging for AI/ML hardware. You will handle floor planning through tape-out, collaborating with SI/PI, thermal, and manufacturing to meet performance targets.\nRole requires hands-on experience with package layout tools and a deep understanding of 2.5D/3D-IC, RDL, TSV, and interposer technologies. Great communication and teamwork are essential.\n\n#J-18808-Ljbffr","datePosted":"2026-09-02T03:33:52.736Z","dateModified":"2026-09-02T03:33:52.736Z","hiringOrganization":{"@type":"Organization","name":"Amazon","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Tempe","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"6f62eee5bd8ff6fcc229ad2d"},"url":"https://jobsearcher.com/jobs/6f62eee5bd8ff6fcc229ad2d"}}