Packaging Assembly Laboratory Technician (Apprentice Conversion) - Nicholas Burachowski

IntroductionAt IBM Infrastructure & Technology, we design and operate the systems that keep the world running. From high-resiliency mainframes and hybrid cloud platforms to networking, automation, and site reliability. Our teams ensure the performance, security, and scalability that clients and industries depend on every day. Working in Infrastructure & Technology means tackling complex challenges with curiosity and collaboration. You’ll work with diverse technologies and colleagues worldwide to deliver resilient, future-ready solutions that power innovation. With continuous learning, career growth, and a supportive culture, IBM provides the opportunities to build expertise and shape the infrastructure that drives progress.Your Role And ResponsibilitiesA technician in this role will be responsible for hands-on work on various aspects of microelectronic package assembly as part of the development team working to enable next generation product technologies. Our team focuses on developing bond and assembly processes to provide innovative high-performance microelectronic packages that help IBM differentiate their IBM Z and POWER offerings.Prospective candidate will be working with state-of-the-art tools and inspection techniques such as confocal scanning acoustic microscopy (CSAM), 3-D X-ray imaging, and optical microscopy within a diverse team of technical leaders, experienced engineers and technicians.The candidate must be able to follow operating procedures, develop and document new practices, manage multiple tasks, work effectively as part of a team, and communicate clearly with internal customers.As a part of this role, you will be handling complex machinery, safely troubleshooting it / conducting maintenance procedures and inspecting microelectronic components assembled using both new and established assembly methods.A successful technician is able to work independently in an efficient and organized manner while collaborating effectively with peers, engineers, and management across the company.A high school diploma or GED is required for this position.Technical diplomas and experience are desired, including experience with manufacturing and/or R&D.Required Technical And Professional Expertise Exposure to Engineering Disciplines: Familiarity with engineering disciplines or physical sciences such as electronics, logic, mechanics, hydraulics, plastics, metallurgy, ceramics, and materials. Specialized Knowledge: Possesses specialized knowledge in areas like design, layout, chemistry, physics, or mathematics, typically acquired through formal training like vocational programs, military technical schools, Associate degree programs, or other education programs. Equipment Operation: Experience working with tools and equipment, with the ability to recognize proper and improper operation and take corrective action. Data Management: Exposure to organizing and recording technical data, with basic computer skills to reduce data and observations. Procedure Adherence: Experience working with written procedures, schematics, engineering drawings, sketches, or oral instructions to deliver accurate results.Preferred Technical And Professional Experience Formal Training: Exposure to formal training programs such as vocational training, military technical schools, Associate degree programs, or other education programs in engineering disciplines or physical sciences. Computer Skills: Experience working with computers to reduce data and observations, with basic skills in organizing and recording technical data. Equipment Knowledge: Exposure to operating and adjusting tools and equipment used in job assignments, with the ability to recognize proper and improper operation.