{"schemaVersion":"jobsearcher.job.v1","id":"6d2694cb7c8f7242f4c2e39e","url":"https://jobsearcher.com/jobs/6d2694cb7c8f7242f4c2e39e","canonicalUrl":"https://jobsearcher.com/jobs/6d2694cb7c8f7242f4c2e39e","title":"Senior IC Packaging Engineering Manager","description":"Intel is seeking an experienced IC Packaging Design Manager in Phoenix, Arizona to lead advanced packaging solutions within the Advanced Design and Customer Engineering organization. You will manage a team of engineers, oversee project execution, and ensure compliance with industry standards.\nThis role requires strong leadership in IC packaging design and collaboration across multiple teams. Ideal candidates will have over 9 years of relevant experience and significant technical expertise.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-16T04:03:30.728Z","occupations":[{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2112.00","title":"Industrial Engineers","slug":"industrial-engineers"}],"industries":[{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior IC Packaging Engineering Manager","description":"Intel is seeking an experienced IC Packaging Design Manager in Phoenix, Arizona to lead advanced packaging solutions within the Advanced Design and Customer Engineering organization. You will manage a team of engineers, oversee project execution, and ensure compliance with industry standards.\nThis role requires strong leadership in IC packaging design and collaboration across multiple teams. Ideal candidates will have over 9 years of relevant experience and significant technical expertise.\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T04:03:30.728Z","dateModified":"2026-07-16T04:03:30.728Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"6d2694cb7c8f7242f4c2e39e"},"url":"https://jobsearcher.com/jobs/6d2694cb7c8f7242f4c2e39e"}}