{"schemaVersion":"jobsearcher.job.v1","id":"681e4e87b59349ec00dbd87e","url":"https://jobsearcher.com/jobs/681e4e87b59349ec00dbd87e","canonicalUrl":"https://jobsearcher.com/jobs/681e4e87b59349ec00dbd87e","title":"Senior AI-Driven Packaging Design Engineer","description":"Micron Technology, Inc. in Idaho is seeking a highly experienced Design Engineer to enable our Advanced Packaging Technology Development team.\nYou will drive electrical, thermal, and thermo‑mechanical design and characterization of next‑generation semiconductor packages, including HBM, W2W, COW, Flip Chip, and TSV, with AI/ML integrations to improve simulations and data‑driven decisions. The role collaborates with global R&D, suppliers, and manufacturing, supervising testing, multistage\n\n#J-18808-Ljbffr","company":"Micron Technology","rawCompany":"micron technology","city":"Boise","state":"ID","isRemote":false,"isActive":false,"createdAt":"2026-09-02T04:04:39.954Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior AI-Driven Packaging Design Engineer","description":"Micron Technology, Inc. in Idaho is seeking a highly experienced Design Engineer to enable our Advanced Packaging Technology Development team.\nYou will drive electrical, thermal, and thermo‑mechanical design and characterization of next‑generation semiconductor packages, including HBM, W2W, COW, Flip Chip, and TSV, with AI/ML integrations to improve simulations and data‑driven decisions. The role collaborates with global R&D, suppliers, and manufacturing, supervising testing, multistage\n\n#J-18808-Ljbffr","datePosted":"2026-09-02T04:04:39.954Z","dateModified":"2026-09-02T04:04:39.954Z","hiringOrganization":{"@type":"Organization","name":"Micron Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Boise","addressRegion":"ID","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"681e4e87b59349ec00dbd87e"},"url":"https://jobsearcher.com/jobs/681e4e87b59349ec00dbd87e"}}