{"schemaVersion":"jobsearcher.job.v1","id":"67fedab6c844f137ea3c7b4c","url":"https://jobsearcher.com/jobs/67fedab6c844f137ea3c7b4c","canonicalUrl":"https://jobsearcher.com/jobs/67fedab6c844f137ea3c7b4c","title":"Packaging Module Development Engineer","description":"Packaging Module Development EngineerLocation: Phoenix, ArizonaWorking Pattern: Full-Time | On-SiteSalary: $148,000–$209,000 + Bonus & Comprehensive BenefitsAre you passionate about advancing the future of semiconductor technology?We're looking for a Packaging Module Development Engineer to join a cutting-edge engineering team developing next-generation semiconductor packaging solutions. This is an exciting opportunity to work on innovative technologies that power AI, cloud computing and the future of high-performance electronics.You'll collaborate with world-class engineers to develop advanced thermo-mechanical simulation models, improve package reliability and influence the design of next-generation semiconductor products.What you'll be doing:Develop and validate finite element analysis (FEA) models for advanced semiconductor packagingPerform thermal and mechanical simulations to assess reliability, stress, warpage and package performancePartner with cross-functional engineering teams to optimise product and process designSupport experimental testing, material characterisation and failure analysisContribute to advanced modelling, simulation and AI-driven engineering initiativesDrive innovation across advanced packaging technologies and manufacturing processesWhat we're looking for:PhD in Mechanical Engineering, Materials Science, Chemical Engineering or a related discipline3+ years' experience in thermo-mechanical modelling and Finite Element Analysis (FEA)Experience with material characterisation techniques and silicon reliabilityStrong analytical and problem-solving skillsExperience within semiconductor packaging or semiconductor manufacturing is highly desirableKnowledge of Python, MATLAB or similar scripting tools is advantageousWhat's on offer?Competitive salary of $148,000–$209,000Performance bonus and stock opportunitiesComprehensive medical, retirement and wellbeing benefitsWork on industry-leading semiconductor technologiesCareer development within a global engineering organisationCollaborative, innovative and research-driven environmentIf you're ready to help shape the future of semiconductor packaging and work on technology that powers tomorrow's innovations, we'd love to hear from you.Apply today.","company":"Office Collective","rawCompany":"office collective","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-01T11:02:17.383Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Module Development Engineer","description":"Packaging Module Development EngineerLocation: Phoenix, ArizonaWorking Pattern: Full-Time | On-SiteSalary: $148,000–$209,000 + Bonus & Comprehensive BenefitsAre you passionate about advancing the future of semiconductor technology?We're looking for a Packaging Module Development Engineer to join a cutting-edge engineering team developing next-generation semiconductor packaging solutions. This is an exciting opportunity to work on innovative technologies that power AI, cloud computing and the future of high-performance electronics.You'll collaborate with world-class engineers to develop advanced thermo-mechanical simulation models, improve package reliability and influence the design of next-generation semiconductor products.What you'll be doing:Develop and validate finite element analysis (FEA) models for advanced semiconductor packagingPerform thermal and mechanical simulations to assess reliability, stress, warpage and package performancePartner with cross-functional engineering teams to optimise product and process designSupport experimental testing, material characterisation and failure analysisContribute to advanced modelling, simulation and AI-driven engineering initiativesDrive innovation across advanced packaging technologies and manufacturing processesWhat we're looking for:PhD in Mechanical Engineering, Materials Science, Chemical Engineering or a related discipline3+ years' experience in thermo-mechanical modelling and Finite Element Analysis (FEA)Experience with material characterisation techniques and silicon reliabilityStrong analytical and problem-solving skillsExperience within semiconductor packaging or semiconductor manufacturing is highly desirableKnowledge of Python, MATLAB or similar scripting tools is advantageousWhat's on offer?Competitive salary of $148,000–$209,000Performance bonus and stock opportunitiesComprehensive medical, retirement and wellbeing benefitsWork on industry-leading semiconductor technologiesCareer development within a global engineering organisationCollaborative, innovative and research-driven environmentIf you're ready to help shape the future of semiconductor packaging and work on technology that powers tomorrow's innovations, we'd love to hear from you.Apply today.","datePosted":"2026-07-01T11:02:17.383Z","dateModified":"2026-07-01T11:02:17.383Z","hiringOrganization":{"@type":"Organization","name":"Office Collective","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"67fedab6c844f137ea3c7b4c"},"url":"https://jobsearcher.com/jobs/67fedab6c844f137ea3c7b4c"}}