{"schemaVersion":"jobsearcher.job.v1","id":"61b8f7a984c8fdaa56476415","url":"https://jobsearcher.com/jobs/61b8f7a984c8fdaa56476415","canonicalUrl":"https://jobsearcher.com/jobs/61b8f7a984c8fdaa56476415","title":"Plasma Etch Process Development Engineer - Advanced Packaging","description":"Intel Corporation is seeking an experienced Plasma Etch Process Development Engineer in Hillsboro, Oregon. The role focuses on optimizing dry etch processes for next-generation semiconductor packaging technologies. Candidates should possess a Master's or PhD in relevant engineering fields and experience in semiconductor manufacturing processes.\nKey responsibilities include developing and optimizing plasma etch processes, collaborating with cross-functional teams, and guiding technology roadmaps to meet future manufacturing needs. This position offers competitive compensation and excellent benefits.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Hillsboro","state":"IL","isRemote":false,"isActive":true,"createdAt":"2026-07-10T03:14:23.216Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Plasma Etch Process Development Engineer - Advanced Packaging","description":"Intel Corporation is seeking an experienced Plasma Etch Process Development Engineer in Hillsboro, Oregon. The role focuses on optimizing dry etch processes for next-generation semiconductor packaging technologies. Candidates should possess a Master's or PhD in relevant engineering fields and experience in semiconductor manufacturing processes.\nKey responsibilities include developing and optimizing plasma etch processes, collaborating with cross-functional teams, and guiding technology roadmaps to meet future manufacturing needs. This position offers competitive compensation and excellent benefits.\n\n#J-18808-Ljbffr","datePosted":"2026-07-10T03:14:23.216Z","dateModified":"2026-07-10T03:14:23.216Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Hillsboro","addressRegion":"IL","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"61b8f7a984c8fdaa56476415"},"url":"https://jobsearcher.com/jobs/61b8f7a984c8fdaa56476415"}}