{"schemaVersion":"jobsearcher.job.v1","id":"5fb34e8f44e9e5acae81c92f","url":"https://jobsearcher.com/jobs/5fb34e8f44e9e5acae81c92f","canonicalUrl":"https://jobsearcher.com/jobs/5fb34e8f44e9e5acae81c92f","title":"Advanced Packaging Engineer","description":"ITAR Notice: This role involves access to ITAR-controlled information. Applicants must be U.S. persons (U.S. citizens, U.S. permanent residents, asylees, or refugees) per 22 CFR 120.62.\n\nAbout The Role\nOwn different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.\n\nWhat you'll do\n\nOwn different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects\n\nUse and develop AI-assisted tool flows to accelerate package design and signoff timelines\n\nWhat we're looking for\n\nExceptional abilities across the full advanced packaging design and tradeoffs\n\n10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies\n\nHands-on with industry-standard Packaging tools and flows for Multi-die packaging (including 2.5D/3D)\n\nDemonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions\n\n(Optional) DFT-aware packaging design, RTL and PD flows\n\nCompensation\nFinal offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.\n\nVisa Sponsorship\nDensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.\n\nExport Controls\nAspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.\n\nEqual Opportunity\nDensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.\n\nFull compensation packages are based on candidate experience and relevant certifications.\n\nCalifornia pay range\n$200,000 - $350,000 USD\n\n#J-18808-Ljbffr","company":"Densityai","rawCompany":"densityai","city":"Mountain View","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-07-16T03:49:14.705Z","occupations":[{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Advanced Packaging Engineer","description":"ITAR Notice: This role involves access to ITAR-controlled information. Applicants must be U.S. persons (U.S. citizens, U.S. permanent residents, asylees, or refugees) per 22 CFR 120.62.\n\nAbout The Role\nOwn different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.\n\nWhat you'll do\n\nOwn different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects\n\nUse and develop AI-assisted tool flows to accelerate package design and signoff timelines\n\nWhat we're looking for\n\nExceptional abilities across the full advanced packaging design and tradeoffs\n\n10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies\n\nHands-on with industry-standard Packaging tools and flows for Multi-die packaging (including 2.5D/3D)\n\nDemonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions\n\n(Optional) DFT-aware packaging design, RTL and PD flows\n\nCompensation\nFinal offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.\n\nVisa Sponsorship\nDensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.\n\nExport Controls\nAspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.\n\nEqual Opportunity\nDensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.\n\nFull compensation packages are based on candidate experience and relevant certifications.\n\nCalifornia pay range\n$200,000 - $350,000 USD\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T03:49:14.705Z","dateModified":"2026-07-16T03:49:14.705Z","hiringOrganization":{"@type":"Organization","name":"Densityai","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Mountain View","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"5fb34e8f44e9e5acae81c92f"},"url":"https://jobsearcher.com/jobs/5fb34e8f44e9e5acae81c92f"}}