{"schemaVersion":"jobsearcher.job.v1","id":"5f39fdfc5eca89e973b862a9","url":"https://jobsearcher.com/jobs/5f39fdfc5eca89e973b862a9","canonicalUrl":"https://jobsearcher.com/jobs/5f39fdfc5eca89e973b862a9","title":"CMOS Advanced Packaging Development Technical Program Manager","description":"About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\r\nSummary of Role: The CMOS product team is seeking an experienced program manager with strong semiconductor process integration expertise to join our growing Advanced Packaging team in the U.S., preferably in Malta, NY. This role will lead cross-functional technology and product development programs that enable new advanced packaging features and offerings on FinFET and FDSOI base technologies, from early process demonstration through qualification and manufacturing transfer. Areas of focus include 2.5D and 3D heterogeneous integration solutions involving hybrid bonding, fusion bonding, die-to-wafer and wafer-to-wafer integration, TSV, deep trench capacitor integration, dicing, interposer-related integration, and package-process co-optimization in support of the full CMOS product portfolio.\r\nEssential Responsibilities: Serve as the program manager for advanced packaging technology development programs supporting GLOBALFOUNDRIES' expanding U.S. advanced packaging capabilities.\r\nPlan and drive execution of complex semiconductor technology development programs with clear milestones, deliverables, critical path management, and cross-functional dependencies.\r\nOwn the overall program schedule, resource planning, milestone alignment, and execution readiness across technical workstreams.\r\nPartner with process integration leaders to define development flows, establish committed execution plans, run hardware, and achieve technical figures of merit, yield, and reliability targets.\r\nEnsure seamless transition from development through qualification into manufacturing transfer and production readiness.\r\nLead cross-functional teams across integration, module development, manufacturing, product engineering, PDK, modeling, IP, quality, and operations to define work packages and deliver programs on time and with high quality.\r\nWork closely with Product Marketing, PMO, PDK, Modeling, IP, manufacturing, and external partners to align technical objectives, schedules, and customer requirements.\r\nCommunicate effectively with internal and external stakeholders, including customers and executive leadership, to provide program status, manage escalations, align priorities, and drive decisions.\r\nPrepare clear technical and executive-level presentations, status reviews, and customer updates, including risk assessments, mitigation plans, and decision summaries.\r\nSupport additional cross-functional initiatives, continuous improvement activities, and strategic assignments as needed.\r\nOther Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs\r\nTravel Required Qualifications: Strong working knowledge of modern CMOS process integration and semiconductor technology development.\r\nDemonstrated ability to work effectively in cross-functional teams, with strong written and verbal communication skills in English.\r\nStrong analytical, problem-solving, and project/program management skills, including risk management, issue resolution, and dependency tracking.\r\nSeveral years of experience in technical leadership roles within the semiconductor industry, preferably in advanced packaging, process integration, or technology development.\r\nProven track record in technology development and/or program management of complex, cross-functional engineering programs from concept through manufacturing transfer.\r\nExperience with semiconductor volume manufacturing, statistical methods, FMEA/8D methodology, and customer-facing work in multicultural environments is highly desirable.\r\nAdvanced packaging experience is preferred, including exposure to TSV, hybrid bonding, fusion bonding, die-to-wafer integration, wafer-to-wafer integration, heterogeneous integration, interposer integration, and related module development.\r\nMaster's degree, Diploma degree, or Ph.D. in Engineering or Science (for example Physics, Chemistry, Materials Science, Electrical Engineering, or related fields) from an accredited university.\r\nAdditional professional experience in advanced module development, process integration, and/or advanced packaging technology development: B.S. + minimum of 15+ years of relevant experience\r\nM.S. + minimum of 10 of relevant experience\r\nPh.D. + minimum of 8 of relevant experience\r\nHands-on familiarity with semiconductor integration practices including lot handling, DOE, inline/HOL/ET analysis, monitoring, yield learning, and data-driven problem solving. Strong coordination skills across departments and geographies, with a proactive and collaborative mindset.\r\nPreferred Qualifications: Strong technical program management skills, including the ability to navigate ambiguity, manage risk, align stakeholders, and drive programs through execution to completion.\r\nExperience in advanced packaging integration is a plus, including TSV, 2.5D/3D integration, hybrid bonding, fusion bonding, chiplet integration, or related heterogeneous integration technologies.\r\nProject management certification (for example PMP or IPMA) is a plus.\r\nStrong written and verbal communication skills, including the ability to present technical content clearly to executive and customer audiences.\r\nStrong planning, organizational, and execution skills with a disciplined approach to action tracking, milestone closure, and continuous improvement.\r\nExpected Salary Range $143,000.00 - $247,000.00\r\nThe exact Salary will be determined based on qualifications, experience and location.\r\nSecurity Clearance The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.\r\nAccommodation for Disabilities If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\r\nPre-Employment Conditions An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\r\nEqual Opportunity GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\r\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law\r\nJ-18808-Ljbffr","company":"GlobalFoundries","rawCompany":"globalfoundries","city":"New York","state":"NY","isRemote":false,"isActive":false,"createdAt":"2026-07-15T03:00:20.273Z","occupations":[{"code":"13-1082.00","title":"Project Management Specialists","slug":"project-management-specialists"},{"code":"15-1299.09","title":"Information Technology Project Managers","slug":"information-technology-project-managers"},{"code":"11-9151.00","title":"Social and Community Service Managers","slug":"social-and-community-service-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"CMOS Advanced Packaging Development Technical Program Manager","description":"About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\r\nSummary of Role: The CMOS product team is seeking an experienced program manager with strong semiconductor process integration expertise to join our growing Advanced Packaging team in the U.S., preferably in Malta, NY. This role will lead cross-functional technology and product development programs that enable new advanced packaging features and offerings on FinFET and FDSOI base technologies, from early process demonstration through qualification and manufacturing transfer. Areas of focus include 2.5D and 3D heterogeneous integration solutions involving hybrid bonding, fusion bonding, die-to-wafer and wafer-to-wafer integration, TSV, deep trench capacitor integration, dicing, interposer-related integration, and package-process co-optimization in support of the full CMOS product portfolio.\r\nEssential Responsibilities: Serve as the program manager for advanced packaging technology development programs supporting GLOBALFOUNDRIES' expanding U.S. advanced packaging capabilities.\r\nPlan and drive execution of complex semiconductor technology development programs with clear milestones, deliverables, critical path management, and cross-functional dependencies.\r\nOwn the overall program schedule, resource planning, milestone alignment, and execution readiness across technical workstreams.\r\nPartner with process integration leaders to define development flows, establish committed execution plans, run hardware, and achieve technical figures of merit, yield, and reliability targets.\r\nEnsure seamless transition from development through qualification into manufacturing transfer and production readiness.\r\nLead cross-functional teams across integration, module development, manufacturing, product engineering, PDK, modeling, IP, quality, and operations to define work packages and deliver programs on time and with high quality.\r\nWork closely with Product Marketing, PMO, PDK, Modeling, IP, manufacturing, and external partners to align technical objectives, schedules, and customer requirements.\r\nCommunicate effectively with internal and external stakeholders, including customers and executive leadership, to provide program status, manage escalations, align priorities, and drive decisions.\r\nPrepare clear technical and executive-level presentations, status reviews, and customer updates, including risk assessments, mitigation plans, and decision summaries.\r\nSupport additional cross-functional initiatives, continuous improvement activities, and strategic assignments as needed.\r\nOther Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs\r\nTravel Required Qualifications: Strong working knowledge of modern CMOS process integration and semiconductor technology development.\r\nDemonstrated ability to work effectively in cross-functional teams, with strong written and verbal communication skills in English.\r\nStrong analytical, problem-solving, and project/program management skills, including risk management, issue resolution, and dependency tracking.\r\nSeveral years of experience in technical leadership roles within the semiconductor industry, preferably in advanced packaging, process integration, or technology development.\r\nProven track record in technology development and/or program management of complex, cross-functional engineering programs from concept through manufacturing transfer.\r\nExperience with semiconductor volume manufacturing, statistical methods, FMEA/8D methodology, and customer-facing work in multicultural environments is highly desirable.\r\nAdvanced packaging experience is preferred, including exposure to TSV, hybrid bonding, fusion bonding, die-to-wafer integration, wafer-to-wafer integration, heterogeneous integration, interposer integration, and related module development.\r\nMaster's degree, Diploma degree, or Ph.D. in Engineering or Science (for example Physics, Chemistry, Materials Science, Electrical Engineering, or related fields) from an accredited university.\r\nAdditional professional experience in advanced module development, process integration, and/or advanced packaging technology development: B.S. + minimum of 15+ years of relevant experience\r\nM.S. + minimum of 10 of relevant experience\r\nPh.D. + minimum of 8 of relevant experience\r\nHands-on familiarity with semiconductor integration practices including lot handling, DOE, inline/HOL/ET analysis, monitoring, yield learning, and data-driven problem solving. Strong coordination skills across departments and geographies, with a proactive and collaborative mindset.\r\nPreferred Qualifications: Strong technical program management skills, including the ability to navigate ambiguity, manage risk, align stakeholders, and drive programs through execution to completion.\r\nExperience in advanced packaging integration is a plus, including TSV, 2.5D/3D integration, hybrid bonding, fusion bonding, chiplet integration, or related heterogeneous integration technologies.\r\nProject management certification (for example PMP or IPMA) is a plus.\r\nStrong written and verbal communication skills, including the ability to present technical content clearly to executive and customer audiences.\r\nStrong planning, organizational, and execution skills with a disciplined approach to action tracking, milestone closure, and continuous improvement.\r\nExpected Salary Range $143,000.00 - $247,000.00\r\nThe exact Salary will be determined based on qualifications, experience and location.\r\nSecurity Clearance The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.\r\nAccommodation for Disabilities If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\r\nPre-Employment Conditions An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\r\nEqual Opportunity GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\r\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law\r\nJ-18808-Ljbffr","datePosted":"2026-07-15T03:00:20.273Z","dateModified":"2026-07-15T03:00:20.273Z","hiringOrganization":{"@type":"Organization","name":"GlobalFoundries","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"New York","addressRegion":"NY","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"5f39fdfc5eca89e973b862a9"},"url":"https://jobsearcher.com/jobs/5f39fdfc5eca89e973b862a9"}}