{"schemaVersion":"jobsearcher.job.v1","id":"5d3aa6932d4421060b171733","url":"https://jobsearcher.com/jobs/5d3aa6932d4421060b171733","canonicalUrl":"https://jobsearcher.com/jobs/5d3aa6932d4421060b171733","title":"Lead External Memory & Packaging Integration Engineer","description":"A leading technology company is looking for an External Technology Integration Engineer in Phoenix, Arizona. The role involves integrating cutting-edge semiconductor technologies and managing technical programs for advanced packaging. Candidates are required to have a relevant degree and significant experience in microelectronic packaging processes. This position offers competitive compensation, a hybrid work model, and an opportunity to be at the forefront of innovation in technology.\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-04-09T09:14:52.495Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"53-7064.00","title":"Packers and Packagers, Hand","slug":"packers-and-packagers-hand"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334112","title":"Computer Storage Device Manufacturing","slug":"computer-storage-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead External Memory & Packaging Integration Engineer","description":"A leading technology company is looking for an External Technology Integration Engineer in Phoenix, Arizona. The role involves integrating cutting-edge semiconductor technologies and managing technical programs for advanced packaging. Candidates are required to have a relevant degree and significant experience in microelectronic packaging processes. This position offers competitive compensation, a hybrid work model, and an opportunity to be at the forefront of innovation in technology.\n#J-18808-Ljbffr","datePosted":"2026-04-09T09:14:52.495Z","dateModified":"2026-04-09T09:14:52.495Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"5d3aa6932d4421060b171733"},"url":"https://jobsearcher.com/jobs/5d3aa6932d4421060b171733"}}