{"schemaVersion":"jobsearcher.job.v1","id":"57ae39e82a00f02bfb1c8d3b","url":"https://jobsearcher.com/jobs/57ae39e82a00f02bfb1c8d3b","canonicalUrl":"https://jobsearcher.com/jobs/57ae39e82a00f02bfb1c8d3b","title":"Package Process Development - Sr. Manager, Engineering","description":"Job Title: Package Process Development - Sr. Manager, Engineering\nPosting Start Date: 9/16/26\nJob Location(s): Irvine\n\nIf you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.\n\nAt Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.\n\nRequisition ID: 78361\n\nJob Description:\nDescription\n\nWe are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.\n\nKey Responsibilities\n\nTechnology Development & NTI\n\nLead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.\nDevelop process roadmaps and technology strategies to support future RF module and SiP product requirements.\nEvaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.\nDrive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.\nPartner with cross-functional teams to ensure seamless transition from technology development into production.\n\nPackage Process Development\n\nOwn development and optimization of RF SiP assembly processes, including:\nDie Attach\nFlip Chip Assembly\nWire Bonding\nWafer-Level Packaging Integration\nUnderfill\nEncapsulation/Molding\nShielding Processes\nSMT and Board-Level Assembly\nDefine process windows, critical process parameters, and control methodologies.\nLead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.\nEstablish process specifications, qualification plans, and manufacturing standards.\n\nManufacturing Readiness & Production Transfer\n\nDrive process development activities from concept through production release.\nLead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.\nDevelop process control plans and monitoring strategies to ensure consistent manufacturing performance.\nWork closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.\nSupport factory transfer and production ramp-up activities.\n\nReliability & Quality\n\nPartner with reliability and quality engineering teams to ensure package/process robustness.\nDefine package qualification requirements and reliability stress test plans.\nLead failure analysis investigations and corrective action implementation.\nEnsure compliance with customer, industry, and regulatory reliability requirements.\n\nLeadership & Team Development\n\nBuild and lead a high-performing package process development team.\nProvide technical mentorship and career development for engineers.\nFoster a culture of innovation, accountability, and continuous improvement.\nCoordinate activities across global engineering, manufacturing, and supplier organizations.\nRequired Qualifications\nMS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.\n12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.\nStrong hands-on experience in RF SiP package development and assembly process engineering .\nProven track record of successfully launching new package technologies into mass production.\nDeep understanding of semiconductor package assembly processes and equipment.\nExperience with NTI programs and technology transfer to manufacturing.\nStrong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.\nExperience working with OSATs and external manufacturing partners.\nExcellent problem-solving, communication, and cross-functional leadership skills.\nDesired Experience and Skills\nExtensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.\nKnowledge of RF performance impacts associated with package structures and assembly processes.\nExperience with advanced packaging technologies such as:\nFan-Out Packaging\nWafer-Level Packaging (WLP)\nPanel-Level Packaging (PLP)\nHeterogeneous Integration\nMulti-Chip Modules (MCM)\nEmbedded Component Technologies\nS trong understanding of package reliability physics and failure mechanisms.\nExperience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.\n\n#LI-JR1\n\nThe typical base pay range for this role across the U.S. is currently USD $143,000 - $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.\n\nSkyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.\n\nApply now","company":"Skyworkssolutions","rawCompany":"skyworkssolutions","city":"Irvine","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-09-17T10:50:41.340Z","occupations":[{"code":"11-9041.00","title":"Architectural and Engineering Managers","slug":"architectural-and-engineering-managers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"13-1082.00","title":"Project Management Specialists","slug":"project-management-specialists"}],"industries":[{"code":"334220","title":"Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing","slug":"radio-and-television-broadcasting-and-wireless-communications-equipment-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Package Process Development - Sr. Manager, Engineering","description":"Job Title: Package Process Development - Sr. Manager, Engineering\nPosting Start Date: 9/16/26\nJob Location(s): Irvine\n\nIf you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.\n\nAt Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.\n\nRequisition ID: 78361\n\nJob Description:\nDescription\n\nWe are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.\n\nKey Responsibilities\n\nTechnology Development & NTI\n\nLead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.\nDevelop process roadmaps and technology strategies to support future RF module and SiP product requirements.\nEvaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.\nDrive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.\nPartner with cross-functional teams to ensure seamless transition from technology development into production.\n\nPackage Process Development\n\nOwn development and optimization of RF SiP assembly processes, including:\nDie Attach\nFlip Chip Assembly\nWire Bonding\nWafer-Level Packaging Integration\nUnderfill\nEncapsulation/Molding\nShielding Processes\nSMT and Board-Level Assembly\nDefine process windows, critical process parameters, and control methodologies.\nLead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.\nEstablish process specifications, qualification plans, and manufacturing standards.\n\nManufacturing Readiness & Production Transfer\n\nDrive process development activities from concept through production release.\nLead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.\nDevelop process control plans and monitoring strategies to ensure consistent manufacturing performance.\nWork closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.\nSupport factory transfer and production ramp-up activities.\n\nReliability & Quality\n\nPartner with reliability and quality engineering teams to ensure package/process robustness.\nDefine package qualification requirements and reliability stress test plans.\nLead failure analysis investigations and corrective action implementation.\nEnsure compliance with customer, industry, and regulatory reliability requirements.\n\nLeadership & Team Development\n\nBuild and lead a high-performing package process development team.\nProvide technical mentorship and career development for engineers.\nFoster a culture of innovation, accountability, and continuous improvement.\nCoordinate activities across global engineering, manufacturing, and supplier organizations.\nRequired Qualifications\nMS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.\n12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.\nStrong hands-on experience in RF SiP package development and assembly process engineering .\nProven track record of successfully launching new package technologies into mass production.\nDeep understanding of semiconductor package assembly processes and equipment.\nExperience with NTI programs and technology transfer to manufacturing.\nStrong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.\nExperience working with OSATs and external manufacturing partners.\nExcellent problem-solving, communication, and cross-functional leadership skills.\nDesired Experience and Skills\nExtensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.\nKnowledge of RF performance impacts associated with package structures and assembly processes.\nExperience with advanced packaging technologies such as:\nFan-Out Packaging\nWafer-Level Packaging (WLP)\nPanel-Level Packaging (PLP)\nHeterogeneous Integration\nMulti-Chip Modules (MCM)\nEmbedded Component Technologies\nS trong understanding of package reliability physics and failure mechanisms.\nExperience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.\n\n#LI-JR1\n\nThe typical base pay range for this role across the U.S. is currently USD $143,000 - $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.\n\nSkyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.\n\nApply now","datePosted":"2026-09-17T10:50:41.340Z","dateModified":"2026-09-17T10:50:41.340Z","hiringOrganization":{"@type":"Organization","name":"Skyworkssolutions","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Irvine","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"57ae39e82a00f02bfb1c8d3b"},"url":"https://jobsearcher.com/jobs/57ae39e82a00f02bfb1c8d3b"}}